Hefei Chipmore Technology Co. Ltd. A - Asset Resilience Ratio

Latest as of March 2026: 4.46%

Hefei Chipmore Technology Co. Ltd. A (688352) has an Asset Resilience Ratio of 4.46% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Hefei Chipmore Technology Co. Ltd. A (688352) liquidity to equity ratio to evaluate short-term liquidity relative to the company's equity base.

Liquid Assets

CN¥355.95 Million
≈ $52.09 Million USD Cash + Short-term Investments

Total Assets

CN¥7.98 Billion
≈ $1.17 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2021–2025)

This chart shows how Hefei Chipmore Technology Co. Ltd. A's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see how large is Hefei Chipmore Technology Co. Ltd. A's balance sheet.

Liquid Assets Composition Over Time

This chart breaks down Hefei Chipmore Technology Co. Ltd. A's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Read 688352 total debt and obligations for a breakdown of total debt and financial obligations.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥355.95 Million 4.46%
Total Liquid Assets CN¥355.95 Million 4.46%

Asset Resilience Insights

  • Limited Liquidity: Hefei Chipmore Technology Co. Ltd. A maintains only 4.46% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Hefei Chipmore Technology Co. Ltd. A Industry Peers by Asset Resilience Ratio

Compare Hefei Chipmore Technology Co. Ltd. A's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Ferrotec (Anhui) Technology Development Co. Ltd. A
SHE:301297
Semiconductor Equipment & Materials 7.65%
Shanghai Originaldow Advanced
SHG:603991
Semiconductor Equipment & Materials 4.04%
SDI Corp
TW:2351
Semiconductor Equipment & Materials 0.62%
LandMark Optoelectronics
TWO:3081
Semiconductor Equipment & Materials 21.51%
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401
Semiconductor Equipment & Materials 4.11%
Bluglass Ltd
AU:BLG
Semiconductor Equipment & Materials 23.98%
Spectra7 Microsystems Inc
V:SEV
Semiconductor Equipment & Materials 29.72%
NAURA Technology Group Co Ltd
SHE:002371
Semiconductor Equipment & Materials 0.04%

Annual Asset Resilience Ratio for Hefei Chipmore Technology Co. Ltd. A (2021–2025)

The table below shows the annual Asset Resilience Ratio data for Hefei Chipmore Technology Co. Ltd. A.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2025-12-31 5.72% CN¥458.04 Million
≈ $67.03 Million
CN¥8.00 Billion
≈ $1.17 Billion
-1.67pp
2024-12-31 7.40% CN¥517.03 Million
≈ $75.66 Million
CN¥6.99 Billion
≈ $1.02 Billion
+5.38pp
2023-12-31 2.01% CN¥144.02 Million
≈ $21.07 Million
CN¥7.15 Billion
≈ $1.05 Billion
-0.30pp
2022-12-31 2.32% CN¥111.77 Million
≈ $16.36 Million
CN¥4.82 Billion
≈ $705.77 Million
+1.86pp
2021-12-31 0.45% CN¥20.00 Million
≈ $2.93 Million
CN¥4.42 Billion
≈ $646.81 Million
--
pp = percentage points

About Hefei Chipmore Technology Co. Ltd. A

SHG:688352 China Semiconductor Equipment & Materials
Market Cap
$3.39 Billion
CN¥23.15 Billion CNY
Market Cap Rank
#4582 Global
#735 in China
Share Price
CN¥19.47
Change (1 day)
+0.78%
52-Week Range
CN¥11.87 - CN¥24.18
All Time High
CN¥24.18
About

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program developm… Read more