Hefei Chipmore Technology Co. Ltd. A Asset Resilience Ratio
Hefei Chipmore Technology Co. Ltd. A asset resilience ratio. Hefei Chipmore Technology Co. Ltd. A (688352) has an Asset Resilience Ratio of 4.46% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See 688352 defensive asset coverage days to measure how many days the company can operate on defensive assets alone.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio of Hefei Chipmore Technology Co. Ltd. A (2021–2025)
Asset resilience ratio of Hefei Chipmore Technology Co. Ltd. A from 2021 to 2025. This chart shows how Hefei Chipmore Technology Co. Ltd. A's Asset Resilience Ratio has changed over time. Read Hefei Chipmore Technology Co. Ltd. A total liabilities for a breakdown of total debt and financial obligations.
Liquid Assets Composition Over Time
This chart breaks down Hefei Chipmore Technology Co. Ltd. A's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see Hefei Chipmore Technology Co. Ltd. A balance sheet assets.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 0% |
| Short-term Investments | CN¥355.95 Million | 4.46% |
| Total Liquid Assets | CN¥355.95 Million | 4.46% |
Asset Resilience Insights
- Limited Liquidity: Hefei Chipmore Technology Co. Ltd. A maintains only 4.46% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Hefei Chipmore Technology Co. Ltd. A Industry Peers by Asset Resilience Ratio
Compare Hefei Chipmore Technology Co. Ltd. A's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Advanced Micro Fabrication Inc
SHG:688012 |
Semiconductor Equipment & Materials | 2.66% |
|
Wuxi Taiji Industry Co Ltd
SHG:600667 |
Semiconductor Equipment & Materials | 0.00% |
|
Suzhou Everbright Photonics Co. Ltd. A
SHG:688048 |
Semiconductor Equipment & Materials | 15.57% |
|
Shanghai Sinyang Semiconductor
SHE:300236 |
Semiconductor Equipment & Materials | 0.00% |
|
JHT Design Co. Ltd. Cl A
SHG:603061 |
Semiconductor Equipment & Materials | 9.01% |
|
Jiangyin Jianghua Microelectronics Materials Co Ltd
SHG:603078 |
Semiconductor Equipment & Materials | 13.71% |
|
KCTech Co Ltd
KO:281820 |
Semiconductor Equipment & Materials | 35.99% |
|
Semco Technologies Sas
PA:ALSEM |
Semiconductor Equipment & Materials | 0.08% |
Hefei Chipmore Technology Co. Ltd. A Asset Resilience Ratio by Year (2021–2025)
Hefei Chipmore Technology Co. Ltd. A asset resilience ratio by year from 2021 to 2025. The table below shows the annual Asset Resilience Ratio data for Hefei Chipmore Technology Co. Ltd. A.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 5.72% | CN¥458.04 Million ≈ $67.03 Million |
CN¥8.00 Billion ≈ $1.17 Billion |
-1.67pp |
| 2024-12-31 | 7.40% | CN¥517.03 Million ≈ $75.66 Million |
CN¥6.99 Billion ≈ $1.02 Billion |
+5.38pp |
| 2023-12-31 | 2.01% | CN¥144.02 Million ≈ $21.07 Million |
CN¥7.15 Billion ≈ $1.05 Billion |
-0.30pp |
| 2022-12-31 | 2.32% | CN¥111.77 Million ≈ $16.36 Million |
CN¥4.82 Billion ≈ $705.77 Million |
+1.86pp |
| 2021-12-31 | 0.45% | CN¥20.00 Million ≈ $2.93 Million |
CN¥4.42 Billion ≈ $646.81 Million |
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About Hefei Chipmore Technology Co. Ltd. A
Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program developm… Read more