Hefei Chipmore Technology Co. Ltd. A - Asset Resilience Ratio

Latest as of March 2026: 4.46%

Hefei Chipmore Technology Co. Ltd. A (688352) has an Asset Resilience Ratio of 4.46% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Hefei Chipmore Technology Co. Ltd. A financial flexibility index to measure the company's free cash flow as a share of total liabilities.

Liquid Assets

CN¥355.95 Million
≈ $52.09 Million USD Cash + Short-term Investments

Total Assets

CN¥7.98 Billion
≈ $1.17 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2021–2025)

This chart shows how Hefei Chipmore Technology Co. Ltd. A's Asset Resilience Ratio has changed over time. See net asset quality index of Hefei Chipmore Technology Co. Ltd. A to measure how much of total assets are equity-financed.

Liquid Assets Composition Over Time

This chart breaks down Hefei Chipmore Technology Co. Ltd. A's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 688352 stock market capitalisation.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥355.95 Million 4.46%
Total Liquid Assets CN¥355.95 Million 4.46%

Asset Resilience Insights

  • Limited Liquidity: Hefei Chipmore Technology Co. Ltd. A maintains only 4.46% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Hefei Chipmore Technology Co. Ltd. A Industry Peers by Asset Resilience Ratio

Compare Hefei Chipmore Technology Co. Ltd. A's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
3Peak Inc
SHG:688536
Semiconductor Equipment & Materials 35.99%
Thinkon Semiconductor Jinzhou Corp
SHG:688233
Semiconductor Equipment & Materials 18.85%
JHT Design Co. Ltd. Cl A
SHG:603061
Semiconductor Equipment & Materials 9.01%
GIGAVIS LTD (PROPOSED)
KQ:420770
Semiconductor Equipment & Materials 28.97%
JiLin Sino-Microelectronics Co Ltd
SHG:600360
Semiconductor Equipment & Materials 8.45%
Semco Technologies Sas
PA:ALSEM
Semiconductor Equipment & Materials 0.08%
New Power Plasma Co.Ltd
KQ:144960
Semiconductor Equipment & Materials 0.99%
BCnC Co. Ltd.
KQ:146320
Semiconductor Equipment & Materials 1.60%

Annual Asset Resilience Ratio for Hefei Chipmore Technology Co. Ltd. A (2021–2025)

The table below shows the annual Asset Resilience Ratio data for Hefei Chipmore Technology Co. Ltd. A.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2025-12-31 5.72% CN¥458.04 Million
≈ $67.03 Million
CN¥8.00 Billion
≈ $1.17 Billion
-1.67pp
2024-12-31 7.40% CN¥517.03 Million
≈ $75.66 Million
CN¥6.99 Billion
≈ $1.02 Billion
+5.38pp
2023-12-31 2.01% CN¥144.02 Million
≈ $21.07 Million
CN¥7.15 Billion
≈ $1.05 Billion
-0.30pp
2022-12-31 2.32% CN¥111.77 Million
≈ $16.36 Million
CN¥4.82 Billion
≈ $705.77 Million
+1.86pp
2021-12-31 0.45% CN¥20.00 Million
≈ $2.93 Million
CN¥4.42 Billion
≈ $646.81 Million
--
pp = percentage points

About Hefei Chipmore Technology Co. Ltd. A

SHG:688352 China Semiconductor Equipment & Materials
Market Cap
$3.32 Billion
CN¥22.71 Billion CNY
Market Cap Rank
#4728 Global
#850 in China
Share Price
CN¥19.10
Change (1 day)
+1.54%
52-Week Range
CN¥10.80 - CN¥23.62
All Time High
CN¥23.62
About

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits in China and internationally. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing; and support services, such as photomask design, COF tape-on-feed design, substrate/frame design, test program developm… Read more