Union Semiconductor (Hefei) Co. Ltd. A
Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, a… Read more
Union Semiconductor (Hefei) Co. Ltd. A (688403) - Total Liabilities
Latest total liabilities as of June 2025: CN¥1.48 Billion CNY
Based on the latest financial reports, Union Semiconductor (Hefei) Co. Ltd. A (688403) has total liabilities worth CN¥1.48 Billion CNY as of June 2025.
Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Union Semiconductor (Hefei) Co. Ltd. A - Total Liabilities Trend (2020–2024)
This chart illustrates how Union Semiconductor (Hefei) Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. Explore and compare other companies by total liabilities.
Union Semiconductor (Hefei) Co. Ltd. A Competitors by Total Liabilities
The table below lists competitors of Union Semiconductor (Hefei) Co. Ltd. A ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Pexa Group Ltd
AU:PXA
|
Australia | AU$540.95 Million |
|
Hubei Wanrun New Energy Technology Co. Ltd. A
SHG:688275
|
China | CN¥12.87 Billion |
|
Toyota Boshoku Corporation
F:TY7
|
Germany | €598.50 Billion |
|
Storskogen Group AB Series B
ST:STOR-B
|
Sweden | Skr20.86 Billion |
|
OBIC Business Consultants Co., Ltd.
PINK:OBIBF
|
USA | $48.06 Billion |
|
Shenzhen Aisidi Co Ltd
SHE:002416
|
China | CN¥6.69 Billion |
|
Corbion N.V
PINK:CSNVF
|
USA | $727.30 Million |
|
Semen Indonesia Persero Tbk PT
PINK:PSGTY
|
USA | $28.51 Trillion |
Liability Composition Analysis (2020–2024)
This chart breaks down Union Semiconductor (Hefei) Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 7.20 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.46 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.31 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Union Semiconductor (Hefei) Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Union Semiconductor (Hefei) Co. Ltd. A (2020–2024)
The table below shows the annual total liabilities of Union Semiconductor (Hefei) Co. Ltd. A from 2020 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | CN¥1.39 Billion | +199.43% |
| 2023-12-31 | CN¥464.27 Million | +59.04% |
| 2022-12-31 | CN¥291.93 Million | -54.69% |
| 2021-12-31 | CN¥644.32 Million | +6.07% |
| 2020-12-31 | CN¥607.44 Million | -- |