Union Semiconductor (Hefei) Co. Ltd. A Asset Resilience Ratio

Latest as of March 2026: 7.45%

Union Semiconductor (Hefei) Co. Ltd. A asset resilience ratio. Union Semiconductor (Hefei) Co. Ltd. A (688403) has an Asset Resilience Ratio of 7.45% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See operational self-sufficiency of Union Semiconductor (Hefei) Co. Ltd. A to measure how many days the company can operate on defensive assets alone.

Liquid Assets

CN¥375.92 Million
≈ $55.01 Million USD Cash + Short-term Investments

Total Assets

CN¥5.05 Billion
≈ $738.25 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio of Union Semiconductor (Hefei) Co. Ltd. A (2022–2025)

Asset resilience ratio of Union Semiconductor (Hefei) Co. Ltd. A from 2022 to 2025. This chart shows how Union Semiconductor (Hefei) Co. Ltd. A's Asset Resilience Ratio has changed over time. Read Union Semiconductor (Hefei) Co. Ltd. A (688403) total liabilities for a breakdown of total debt and financial obligations.

Liquid Assets Composition Over Time

This chart breaks down Union Semiconductor (Hefei) Co. Ltd. A's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see how large is Union Semiconductor (Hefei) Co. Ltd. A's balance sheet.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥375.92 Million 7.45%
Total Liquid Assets CN¥375.92 Million 7.45%

Asset Resilience Insights

  • Limited Liquidity: Union Semiconductor (Hefei) Co. Ltd. A maintains only 7.45% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Union Semiconductor (Hefei) Co. Ltd. A Industry Peers by Asset Resilience Ratio

Compare Union Semiconductor (Hefei) Co. Ltd. A's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Bestechnic (Shanghai) Co. Ltd. A
SHG:688608
Semiconductors 23.81%
Cambricon Technologies Corp Ltd
SHG:688256
Semiconductors 20.15%
ASE Industrial Holding Co Ltd ADR
NYSE:ASX
Semiconductors 1.07%
Astera Labs, Inc.
NASDAQ:ALAB
Semiconductors 59.10%
GlobalWafers Co Ltd
TWO:6488
Semiconductors 20.19%
Hubei Dinglong Chemical
SHE:300054
Semiconductors 0.75%
Goke Microelectronics Co Ltd
SHE:300672
Semiconductors 27.13%
Giantec Semiconductor Corp
SHG:688123
Semiconductors 24.98%

Union Semiconductor (Hefei) Co. Ltd. A Asset Resilience Ratio by Year (2022–2025)

Union Semiconductor (Hefei) Co. Ltd. A asset resilience ratio by year from 2022 to 2025. The table below shows the annual Asset Resilience Ratio data for Union Semiconductor (Hefei) Co. Ltd. A.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2025-12-31 10.97% CN¥534.51 Million
≈ $78.21 Million
CN¥4.87 Billion
≈ $713.31 Million
-3.88pp
2024-12-31 14.85% CN¥681.61 Million
≈ $99.74 Million
CN¥4.59 Billion
≈ $671.84 Million
+14.28pp
2023-12-31 0.56% CN¥20.19 Million
≈ $2.95 Million
CN¥3.60 Billion
≈ $526.25 Million
-18.26pp
2022-12-31 18.82% CN¥601.44 Million
≈ $88.01 Million
CN¥3.20 Billion
≈ $467.62 Million
--
pp = percentage points

About Union Semiconductor (Hefei) Co. Ltd. A

SHG:688403 China Semiconductors
Market Cap
$2.18 Billion
CN¥14.90 Billion CNY
Market Cap Rank
#5683 Global
#1006 in China
Share Price
CN¥15.00
Change (1 day)
+10.62%
52-Week Range
CN¥12.92 - CN¥41.30
All Time High
CN¥41.30
About

Union Semiconductor (Hefei) Co., Ltd. provides packaging and testing services for integrated circuits to display driver chip design companies in China and internationally. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electro… Read more