Union Semiconductor (Hefei) Co. Ltd. A Total Liabilities
Union Semiconductor (Hefei) Co. Ltd. A total liabilities. Based on the latest financial reports, Union Semiconductor (Hefei) Co. Ltd. A (688403) has total liabilities worth CN¥1.02 Billion CNY (≈ $149.10 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Union Semiconductor (Hefei) Co. Ltd. A asset resilience ratio to evaluate the company's liquid asset resilience ratio.
Total Liabilities of Union Semiconductor (Hefei) Co. Ltd. A (2020–2025)
Total liabilities of Union Semiconductor (Hefei) Co. Ltd. A from 2020 to 2025. This chart illustrates how Union Semiconductor (Hefei) Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data.
Union Semiconductor (Hefei) Co. Ltd. A Competitors by Total Liabilities
The table below lists competitors of Union Semiconductor (Hefei) Co. Ltd. A ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Appian Corp
NASDAQ:APPN
|
USA | $690.89 Million |
|
Henan Yuneng Holdings Co Ltd
SHE:001896
|
China | CN¥28.64 Billion |
|
Shilpa Medicare Limited
NSE:SHILPAMED
|
India | Rs10.57 Billion |
|
Albany International Corporation
NYSE:AIN
|
USA | $1.00 Billion |
|
Plug Power Inc
NASDAQ:PLUG
|
USA | $1.61 Billion |
|
Sinocelltech Group Ltd
SHG:688520
|
China | CN¥4.49 Billion |
|
Youngone
KO:111770
|
Korea | ₩1.69 Trillion |
|
ADEIA CORP
NASDAQ:ADEA
|
USA | $536.31 Million |
Liability Composition Analysis (2020–2025)
This chart breaks down Union Semiconductor (Hefei) Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Union Semiconductor (Hefei) Co. Ltd. A total assets.
Liquidity & Leverage Metrics
Union Semiconductor (Hefei) Co. Ltd. A Total Liabilities Ratios Explained
Union Semiconductor (Hefei) Co. Ltd. A total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 3.65 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.25 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.20 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Union Semiconductor (Hefei) Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Union Semiconductor (Hefei) Co. Ltd. A (2020–2025)
The table below shows the annual total liabilities of Union Semiconductor (Hefei) Co. Ltd. A from 2020 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | CN¥1.33 Billion ≈ $193.98 Million |
-4.64% |
| 2024-12-31 | CN¥1.39 Billion ≈ $203.42 Million |
+199.43% |
| 2023-12-31 | CN¥464.27 Million ≈ $67.94 Million |
+59.04% |
| 2022-12-31 | CN¥291.93 Million ≈ $42.72 Million |
-54.69% |
| 2021-12-31 | CN¥644.32 Million ≈ $94.28 Million |
+6.07% |
| 2020-12-31 | CN¥607.44 Million ≈ $88.89 Million |
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About Union Semiconductor (Hefei) Co. Ltd. A
Union Semiconductor (Hefei) Co., Ltd. provides packaging and testing services for integrated circuits to display driver chip design companies in China and internationally. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electro… Read more