Union Semiconductor (Hefei) Co. Ltd. A (688403) - Total Liabilities

Latest as of March 2026: CN¥1.02 Billion CNY ≈ $149.10 Million USD

Based on the latest financial reports, Union Semiconductor (Hefei) Co. Ltd. A (688403) has total liabilities worth CN¥1.02 Billion CNY (≈ $149.10 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Union Semiconductor (Hefei) Co. Ltd. A - Total Liabilities Trend (2020–2025)

This chart illustrates how Union Semiconductor (Hefei) Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. See Union Semiconductor (Hefei) Co. Ltd. A working capital to net assets to evaluate short-term liquidity relative to the company's equity base.

Union Semiconductor (Hefei) Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Union Semiconductor (Hefei) Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
China Airlines Ltd
TW:2610
Taiwan NT$238.92 Billion
De Grey Mining Ltd
AU:DEG
Australia AU$33.89 Million
Silgan Holdings Inc
NYSE:SLGN
USA $7.00 Billion
Shenzhen FRD Science & Technology Co Ltd
SHE:300602
China CN¥4.68 Billion
Tanger Factory Outlet Centers Inc
NYSE:SKT
USA $2.14 Billion
Companhia de Saneamento de Minas Gerais
SA:CSMG3
Brazil R$9.16 Billion
Beijing Easpring Material Tech
SHE:300073
China CN¥4.81 Billion
INTERCORP FIN.SERV. O.N.
F:9IFA
Germany €86.68 Billion

Liability Composition Analysis (2020–2025)

This chart breaks down Union Semiconductor (Hefei) Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Union Semiconductor (Hefei) Co. Ltd. A market cap and net worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.65 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.25 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.20 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Union Semiconductor (Hefei) Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Union Semiconductor (Hefei) Co. Ltd. A (2020–2025)

The table below shows the annual total liabilities of Union Semiconductor (Hefei) Co. Ltd. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥1.33 Billion
≈ $193.98 Million
-4.64%
2024-12-31 CN¥1.39 Billion
≈ $203.42 Million
+199.43%
2023-12-31 CN¥464.27 Million
≈ $67.94 Million
+59.04%
2022-12-31 CN¥291.93 Million
≈ $42.72 Million
-54.69%
2021-12-31 CN¥644.32 Million
≈ $94.28 Million
+6.07%
2020-12-31 CN¥607.44 Million
≈ $88.89 Million
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About Union Semiconductor (Hefei) Co. Ltd. A

SHG:688403 China Semiconductors
Market Cap
$4.18 Billion
CN¥28.56 Billion CNY
Market Cap Rank
#4066 Global
#652 in China
Share Price
CN¥28.82
Change (1 day)
+6.90%
52-Week Range
CN¥9.57 - CN¥28.82
All Time High
CN¥28.82
About

Union Semiconductor (Hefei) Co., Ltd. provides packaging and testing services for integrated circuits to display driver chip design companies in China and internationally. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electro… Read more