Union Semiconductor (Hefei) Co. Ltd. A (688403) - Total Liabilities

Latest as of March 2026: CN¥1.02 Billion CNY ≈ $149.10 Million USD

Based on the latest financial reports, Union Semiconductor (Hefei) Co. Ltd. A (688403) has total liabilities worth CN¥1.02 Billion CNY (≈ $149.10 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check 688403 asset liquidity ratio to evaluate the company's liquid asset resilience ratio.

Union Semiconductor (Hefei) Co. Ltd. A - Total Liabilities Trend (2020–2025)

This chart illustrates how Union Semiconductor (Hefei) Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 688403 asset base.

Union Semiconductor (Hefei) Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Union Semiconductor (Hefei) Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Zhejiang Taotao Vehicles Co. Ltd. A
SHE:301345
China CN¥3.00 Billion
L&T Technology Services Limited
NSE:LTTS
India Rs36.22 Billion
KINGDEE INT. UNS.ADR/100
F:KDID
Germany €6.38 Billion
Kunshan Kinglai Hygienic Materials Co Ltd
SHE:300260
China CN¥3.37 Billion
All Ring Tech Co Ltd
TWO:6187
Taiwan NT$4.75 Billion
FIELMANN AG (ADR/1/5)O.N.
F:FIE1
Germany €1.42 Billion
Mirion Technologies Inc
NYSE:MIR
USA $1.65 Billion
Shenzhen Zhongjin Lingnan Nonfemet Co Ltd
SHE:000060
China CN¥31.14 Billion

Liability Composition Analysis (2020–2025)

This chart breaks down Union Semiconductor (Hefei) Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Union Semiconductor (Hefei) Co. Ltd. A (688403) balance sheet quality index to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.65 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.25 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.20 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Union Semiconductor (Hefei) Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Union Semiconductor (Hefei) Co. Ltd. A (2020–2025)

The table below shows the annual total liabilities of Union Semiconductor (Hefei) Co. Ltd. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥1.33 Billion
≈ $193.98 Million
-4.64%
2024-12-31 CN¥1.39 Billion
≈ $203.42 Million
+199.43%
2023-12-31 CN¥464.27 Million
≈ $67.94 Million
+59.04%
2022-12-31 CN¥291.93 Million
≈ $42.72 Million
-54.69%
2021-12-31 CN¥644.32 Million
≈ $94.28 Million
+6.07%
2020-12-31 CN¥607.44 Million
≈ $88.89 Million
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About Union Semiconductor (Hefei) Co. Ltd. A

SHG:688403 China Semiconductors
Market Cap
$3.84 Billion
CN¥26.21 Billion CNY
Market Cap Rank
#4246 Global
#656 in China
Share Price
CN¥26.39
Change (1 day)
+4.18%
52-Week Range
CN¥12.92 - CN¥41.30
All Time High
CN¥41.30
About

Union Semiconductor (Hefei) Co., Ltd. provides packaging and testing services for integrated circuits to display driver chip design companies in China and internationally. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electro… Read more