Transcom Inc (5222) - Total Liabilities
Based on the latest financial reports, Transcom Inc (5222) has total liabilities worth NT$513.69 Million TWD (≈ $16.18 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore cash efficiency ratio of Transcom Inc to assess how effectively this company generates cash.
Transcom Inc - Total Liabilities Trend (2011–2024)
This chart illustrates how Transcom Inc's total liabilities have evolved over time, based on quarterly financial data. Check how resilient are Transcom Inc's assets to evaluate the company's liquid asset resilience ratio.
Transcom Inc Competitors by Total Liabilities
The table below lists competitors of Transcom Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
GWA Group Ltd
AU:GWA
|
Australia | AU$345.31 Million |
|
Greene County Bancorp Inc
NASDAQ:GCBC
|
USA | $2.89 Billion |
|
Ramky Infrastructure Limited
NSE:RAMKY
|
India | Rs22.09 Billion |
|
Taiwan Steel Union Co Ltd
TW:6581
|
Taiwan | NT$818.73 Million |
|
Huida Sanitary Ware Co Ltd
SHG:603385
|
China | CN¥1.28 Billion |
|
Guangzhou Improve Med Instrument
SHE:300030
|
China | CN¥415.45 Million |
|
Wanxiang Doneed Co Ltd
SHG:600371
|
China | CN¥126.60 Million |
|
Hoasen Group
VN:HSG
|
Vietnam | ₫9.68 Trillion |
Liability Composition Analysis (2011–2024)
This chart breaks down Transcom Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Transcom Inc (5222) market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 2.87 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.22 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.18 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Transcom Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Transcom Inc (2011–2024)
The table below shows the annual total liabilities of Transcom Inc from 2011 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | NT$484.91 Million ≈ $15.28 Million |
+16.91% |
| 2023-12-31 | NT$414.78 Million ≈ $13.07 Million |
+6.15% |
| 2022-12-31 | NT$390.75 Million ≈ $12.31 Million |
+18.19% |
| 2021-12-31 | NT$330.62 Million ≈ $10.42 Million |
+9.50% |
| 2020-12-31 | NT$301.93 Million ≈ $9.51 Million |
-5.39% |
| 2019-12-31 | NT$319.14 Million ≈ $10.05 Million |
+137.48% |
| 2018-12-31 | NT$134.39 Million ≈ $4.23 Million |
-27.19% |
| 2017-12-31 | NT$184.56 Million ≈ $5.81 Million |
+28.59% |
| 2016-12-31 | NT$143.53 Million ≈ $4.52 Million |
+11.95% |
| 2015-12-31 | NT$128.20 Million ≈ $4.04 Million |
+105.73% |
| 2014-12-31 | NT$62.32 Million ≈ $1.96 Million |
+4.83% |
| 2013-12-31 | NT$59.45 Million ≈ $1.87 Million |
+57.17% |
| 2012-12-31 | NT$37.82 Million ≈ $1.19 Million |
+17.46% |
| 2011-12-31 | NT$32.20 Million ≈ $1.01 Million |
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About Transcom Inc
Transcom, Inc. operates as a microwave device and subsystem company in Taiwan, Asia, Europe, North America, and internationally. The company provides GaN solid-state power amplifiers; amplifiers; MIC modules; subsystems; FET chips; packaged FETs; monolithic microwave integrated circuits (MMIC); hybrid ICs; directional couplers; power dividers; fixed attenuators and termination products; and MIC c… Read more