Transcom Inc (5222) - Total Liabilities

Latest as of March 2026: NT$677.15 Million TWD ≈ $21.33 Million USD

Based on the latest financial reports, Transcom Inc (5222) has total liabilities worth NT$677.15 Million TWD (≈ $21.33 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore net asset growth rate of Transcom Inc to track the company's year-over-year net asset growth rate.

Transcom Inc - Total Liabilities Trend (2011–2025)

This chart illustrates how Transcom Inc's total liabilities have evolved over time, based on quarterly financial data. See free cash flow generation of Transcom Inc to measure how efficiently the company converts operating cash flow to free cash.

Transcom Inc Competitors by Total Liabilities

The table below lists competitors of Transcom Inc ranked by their total liabilities.

Company Country Total Liabilities
Heliostar Metals Ltd
V:HSTR
Canada CA$64.99 Million
Taiwan Mask Corp
TW:2338
Taiwan NT$13.60 Billion
QingCloud Technologies Corp.
SHG:688316
China CN¥285.10 Million
European Lithium Ltd
AU:EUR
Australia AU$115.16 Million
Panoro Minerals Ltd.
V:PML
Canada CA$17.82 Million
Kits Eyecare Ltd
TO:KITS
Canada CA$37.62 Million
Zhejiang Zhenyuan Share Co Ltd
SHE:000705
China CN¥982.98 Million
Integrated Diagnostics Holdings PLC
LSE:IDHC
UK $3.67 Billion

Liability Composition Analysis (2011–2025)

This chart breaks down Transcom Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Transcom Inc market cap and net worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.25 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.28 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.22 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Transcom Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Transcom Inc (2011–2025)

The table below shows the annual total liabilities of Transcom Inc from 2011 to 2025.

Year Total Liabilities Change
2025-12-31 NT$474.49 Million
≈ $14.95 Million
-2.15%
2024-12-31 NT$484.91 Million
≈ $15.28 Million
+16.91%
2023-12-31 NT$414.78 Million
≈ $13.07 Million
+6.15%
2022-12-31 NT$390.75 Million
≈ $12.31 Million
+18.19%
2021-12-31 NT$330.62 Million
≈ $10.42 Million
+9.50%
2020-12-31 NT$301.93 Million
≈ $9.51 Million
-5.39%
2019-12-31 NT$319.14 Million
≈ $10.05 Million
+137.48%
2018-12-31 NT$134.39 Million
≈ $4.23 Million
-27.19%
2017-12-31 NT$184.56 Million
≈ $5.81 Million
+28.59%
2016-12-31 NT$143.53 Million
≈ $4.52 Million
+11.95%
2015-12-31 NT$128.20 Million
≈ $4.04 Million
+105.73%
2014-12-31 NT$62.32 Million
≈ $1.96 Million
+4.83%
2013-12-31 NT$59.45 Million
≈ $1.87 Million
+57.17%
2012-12-31 NT$37.82 Million
≈ $1.19 Million
+17.46%
2011-12-31 NT$32.20 Million
≈ $1.01 Million
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About Transcom Inc

TW:5222 Taiwan Semiconductor Equipment & Materials
Market Cap
$320.00 Million
NT$10.16 Billion TWD
Market Cap Rank
#14347 Global
#583 in Taiwan
Share Price
NT$111.50
Change (1 day)
+7.21%
52-Week Range
NT$104.00 - NT$162.00
All Time High
NT$1974.99
About

Transcom, Inc. operates as a microwave device and subsystem company in Taiwan. The company offers amplifiers(GaN), including amplifiers(GaN); drone/UAV, high-power SSPA modules; C-UAS/Jammer/EW; high-power SSPA modules; GaN solid-state power amplifiers(CW), and GaN solid-state power; amplifier; MIC module; subsystem; FET chip, such as super lower noise GaAs FETs (Gallium Arsenide Field Effect Tra… Read more