Transcom Inc (5222) - Total Liabilities

Latest as of March 2026: NT$677.15 Million TWD ≈ $21.33 Million USD

Based on the latest financial reports, Transcom Inc (5222) has total liabilities worth NT$677.15 Million TWD (≈ $21.33 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check financial resilience of Transcom Inc to evaluate the company's liquid asset resilience ratio.

Transcom Inc - Total Liabilities Trend (2011–2025)

This chart illustrates how Transcom Inc's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 5222 total assets.

Transcom Inc Competitors by Total Liabilities

The table below lists competitors of Transcom Inc ranked by their total liabilities.

Company Country Total Liabilities
Shanghai HYP-ARCH Architectural Design Consultant Co.Ltd.
SHE:301024
China CN¥273.33 Million
Regional Management Corp
NYSE:RM
USA $1.70 Billion
Richtech Robotics Inc. Class B Common Stock
NASDAQ:RR
USA $4.58 Million
Shenzhen Increase Technology Co Ltd Class A
SHE:300713
China CN¥565.36 Million
Fujian Yongan Forestry Group Joint-Stock
SHE:000663
China CN¥543.06 Million
Vanda Pharmaceuticals Inc
NASDAQ:VNDA
USA $161.76 Million
KGI Securities (Thailand) Public Company Limited
BK:KGI
Thailand ฿8.97 Billion
Panama Petrochem Limited
NSE:PANAMAPET
India Rs4.50 Billion

Liability Composition Analysis (2011–2025)

This chart breaks down Transcom Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See 5222 equity to assets ratio to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.25 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.28 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.22 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Transcom Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Transcom Inc (2011–2025)

The table below shows the annual total liabilities of Transcom Inc from 2011 to 2025.

Year Total Liabilities Change
2025-12-31 NT$474.49 Million
≈ $14.95 Million
-2.15%
2024-12-31 NT$484.91 Million
≈ $15.28 Million
+16.91%
2023-12-31 NT$414.78 Million
≈ $13.07 Million
+6.15%
2022-12-31 NT$390.75 Million
≈ $12.31 Million
+18.19%
2021-12-31 NT$330.62 Million
≈ $10.42 Million
+9.50%
2020-12-31 NT$301.93 Million
≈ $9.51 Million
-5.39%
2019-12-31 NT$319.14 Million
≈ $10.05 Million
+137.48%
2018-12-31 NT$134.39 Million
≈ $4.23 Million
-27.19%
2017-12-31 NT$184.56 Million
≈ $5.81 Million
+28.59%
2016-12-31 NT$143.53 Million
≈ $4.52 Million
+11.95%
2015-12-31 NT$128.20 Million
≈ $4.04 Million
+105.73%
2014-12-31 NT$62.32 Million
≈ $1.96 Million
+4.83%
2013-12-31 NT$59.45 Million
≈ $1.87 Million
+57.17%
2012-12-31 NT$37.82 Million
≈ $1.19 Million
+17.46%
2011-12-31 NT$32.20 Million
≈ $1.01 Million
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About Transcom Inc

TW:5222 Taiwan Semiconductor Equipment & Materials
Market Cap
$295.61 Million
NT$9.38 Billion TWD
Market Cap Rank
#14976 Global
#634 in Taiwan
Share Price
NT$103.00
Change (1 day)
+1.98%
52-Week Range
NT$101.00 - NT$157.50
All Time High
NT$1974.99
About

Transcom, Inc. operates as a microwave device and subsystem company in Taiwan. The company offers amplifiers(GaN), including amplifiers(GaN); drone/UAV, high-power SSPA modules; C-UAS/Jammer/EW; high-power SSPA modules; GaN solid-state power amplifiers(CW), and GaN solid-state power; amplifier; MIC module; subsystem; FET chip, such as super lower noise GaAs FETs (Gallium Arsenide Field Effect Tra… Read more