Transcom Inc - Asset Resilience Ratio
Transcom Inc (5222) has an Asset Resilience Ratio of 3.17% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check Transcom Inc strategic asset allocation index to assess the company's strategic physical and investment asset allocation.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2013–2024)
This chart shows how Transcom Inc's Asset Resilience Ratio has changed over time. See net asset quality index of Transcom Inc to measure how much of total assets are equity-financed.
Liquid Assets Composition Over Time
This chart breaks down Transcom Inc's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see market value of Transcom Inc.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$89.00 Million | 3.17% |
| Total Liquid Assets | NT$89.00 Million | 3.17% |
Asset Resilience Insights
- Limited Liquidity: Transcom Inc maintains only 3.17% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Transcom Inc Industry Peers by Asset Resilience Ratio
Compare Transcom Inc's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
ASM International NV
AS:ASM |
Semiconductor Equipment & Materials | -0.06% |
|
Advanced Micro Fabrication Inc
SHG:688012 |
Semiconductor Equipment & Materials | 2.66% |
|
Konfoong Materials International Co Ltd
SHE:300666 |
Semiconductor Equipment & Materials | 0.04% |
|
Henan Shijia Photons Technology Co Ltd
SHG:688313 |
Semiconductor Equipment & Materials | 0.39% |
|
3Peak Inc
SHG:688536 |
Semiconductor Equipment & Materials | 35.99% |
|
LandMark Optoelectronics
TWO:3081 |
Semiconductor Equipment & Materials | 25.41% |
|
JHT Design Co. Ltd. Cl A
SHG:603061 |
Semiconductor Equipment & Materials | 9.01% |
|
Wuxi Taiji Industry Co Ltd
SHG:600667 |
Semiconductor Equipment & Materials | 0.00% |
Annual Asset Resilience Ratio for Transcom Inc (2013–2024)
The table below shows the annual Asset Resilience Ratio data for Transcom Inc.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 3.10% | NT$91.73 Million ≈ $2.89 Million |
NT$2.96 Billion ≈ $93.26 Million |
-1.43pp |
| 2023-12-31 | 4.53% | NT$120.97 Million ≈ $3.81 Million |
NT$2.67 Billion ≈ $84.08 Million |
-4.35pp |
| 2022-12-31 | 8.88% | NT$212.96 Million ≈ $6.71 Million |
NT$2.40 Billion ≈ $75.52 Million |
+7.37pp |
| 2021-12-31 | 1.52% | NT$35.00 Million ≈ $1.10 Million |
NT$2.31 Billion ≈ $72.78 Million |
-12.21pp |
| 2020-12-31 | 13.72% | NT$163.62 Million ≈ $5.16 Million |
NT$1.19 Billion ≈ $37.57 Million |
+12.91pp |
| 2019-12-31 | 0.81% | NT$7.00 Million ≈ $220.57K |
NT$862.20 Million ≈ $27.16 Million |
-1.49pp |
| 2018-12-31 | 2.30% | NT$12.55 Million ≈ $395.33K |
NT$544.72 Million ≈ $17.16 Million |
-0.03pp |
| 2017-12-31 | 2.33% | NT$12.54 Million ≈ $394.98K |
NT$537.71 Million ≈ $16.94 Million |
-0.68pp |
| 2016-12-31 | 3.01% | NT$13.33 Million ≈ $419.84K |
NT$442.92 Million ≈ $13.95 Million |
-1.24pp |
| 2015-12-31 | 4.25% | NT$13.31 Million ≈ $419.40K |
NT$313.42 Million ≈ $9.87 Million |
+2.21pp |
| 2014-12-31 | 2.03% | NT$2.60 Million ≈ $81.95K |
NT$127.83 Million ≈ $4.03 Million |
+0.10pp |
| 2013-12-31 | 1.94% | NT$2.60 Million ≈ $82.07K |
NT$134.57 Million ≈ $4.24 Million |
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About Transcom Inc
Transcom, Inc. operates as a microwave device and subsystem company in Taiwan, Asia, Europe, North America, and internationally. The company provides GaN solid-state power amplifiers; amplifiers; MIC modules; subsystems; FET chips; packaged FETs; monolithic microwave integrated circuits (MMIC); hybrid ICs; directional couplers; power dividers; fixed attenuators and termination products; and MIC c… Read more