Integrated Service Technology (3289) - Total Liabilities

Latest as of September 2025: NT$5.47 Billion TWD ≈ $172.24 Million USD

Based on the latest financial reports, Integrated Service Technology (3289) has total liabilities worth NT$5.47 Billion TWD (≈ $172.24 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore cash flow conversion of Integrated Service Technology to assess how effectively this company generates cash.

Integrated Service Technology - Total Liabilities Trend (2017–2024)

This chart illustrates how Integrated Service Technology's total liabilities have evolved over time, based on quarterly financial data. Check Integrated Service Technology liquid asset ratio to evaluate the company's liquid asset resilience ratio.

Integrated Service Technology Competitors by Total Liabilities

The table below lists competitors of Integrated Service Technology ranked by their total liabilities.

Company Country Total Liabilities
KOSES Co.Ltd
KQ:089890
Korea ₩19.20 Billion
Pareto Bank ASA
OL:PARB
Norway Nkr19.60 Billion
Weikeng Industrial Co Ltd
TW:3033
Taiwan NT$33.44 Billion
Maravai Lifesciences Holdings Inc
NASDAQ:MRVI
USA $417.33 Million
PIERER Mobility AG
VI:PKTM
Austria €1.44 Billion
Asia Aviation Public Company Limited
BK:AAV-R
Thailand ฿65.62 Billion
Smartoptics Group AS
OL:SMOP
Norway Nkr23.55 Million
Suzhou Weizhixiang Food Co. Ltd.
SHG:605089
China CN¥74.73 Million

Liability Composition Analysis (2017–2024)

This chart breaks down Integrated Service Technology's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Integrated Service Technology (3289) total market value.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.20 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.57 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.61 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Integrated Service Technology's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Integrated Service Technology (2017–2024)

The table below shows the annual total liabilities of Integrated Service Technology from 2017 to 2024.

Year Total Liabilities Change
2024-12-31 NT$4.68 Billion
≈ $147.56 Million
+8.04%
2023-12-31 NT$4.33 Billion
≈ $136.57 Million
+7.78%
2022-12-31 NT$4.02 Billion
≈ $126.71 Million
+3.21%
2021-12-31 NT$3.90 Billion
≈ $122.77 Million
+13.05%
2020-12-31 NT$3.45 Billion
≈ $108.60 Million
-27.16%
2019-12-31 NT$4.73 Billion
≈ $149.09 Million
-23.29%
2018-12-31 NT$6.17 Billion
≈ $194.37 Million
+8.09%
2017-12-31 NT$5.71 Billion
≈ $179.82 Million
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About Integrated Service Technology

TWO:3289 Taiwan Semiconductors
Market Cap
$540.81 Million
NT$17.17 Billion TWD
Market Cap Rank
#12115 Global
#425 in Taiwan
Share Price
NT$199.00
Change (1 day)
+3.11%
52-Week Range
NT$99.40 - NT$210.50
All Time High
NT$210.50
About

Integrated Service Technology Inc. research, develops, and manufactures integrated circuits, analysis and burn-in, and testing in Taiwan and internationally. The company provides MOSFET wafer backend processes, which offer MOSFET front-side metallization, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes; MOSFET backside metalliza… Read more