Integrated Service Technology (3289) - Total Liabilities
Based on the latest financial reports, Integrated Service Technology (3289) has total liabilities worth NT$4.30 Billion TWD (≈ $135.48 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Integrated Service Technology - Total Liabilities Trend (2017–2025)
This chart illustrates how Integrated Service Technology's total liabilities have evolved over time, based on quarterly financial data. See 3289 net working capital ratio to evaluate short-term liquidity relative to the company's equity base.
Integrated Service Technology Competitors by Total Liabilities
The table below lists competitors of Integrated Service Technology ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Surya Semesta Internusa Tbk
JK:SSIA
|
Indonesia | Rp4.64 Trillion |
|
Nanjing Railway New Technology Co.Ltd.
SHE:301016
|
China | CN¥155.16 Million |
|
China Sanjiang Fine Chemicals Company Limited
F:8C9
|
Germany | €17.07 Billion |
|
Winton Land Ltd
AU:WTN
|
Australia | AU$196.54 Million |
|
Minto Apartment Real Estate Investment Trust
TO:MI-UN
|
Canada | CA$1.58 Billion |
|
Chengdu Lihang Technology Co.Ltd.
SHG:603261
|
China | CN¥423.99 Million |
|
Korea Line
KO:005880
|
Korea | ₩1.74 Trillion |
|
Liaoning Shenhua Holdings Co Ltd
SHG:600653
|
China | CN¥2.03 Billion |
Liability Composition Analysis (2017–2025)
This chart breaks down Integrated Service Technology's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Integrated Service Technology (3289) total market value.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.20 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.92 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.48 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Integrated Service Technology's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Integrated Service Technology (2017–2025)
The table below shows the annual total liabilities of Integrated Service Technology from 2017 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | NT$4.30 Billion ≈ $135.48 Million |
-8.19% |
| 2024-12-31 | NT$4.68 Billion ≈ $147.56 Million |
+8.04% |
| 2023-12-31 | NT$4.33 Billion ≈ $136.57 Million |
+7.78% |
| 2022-12-31 | NT$4.02 Billion ≈ $126.71 Million |
+3.21% |
| 2021-12-31 | NT$3.90 Billion ≈ $122.77 Million |
+13.05% |
| 2020-12-31 | NT$3.45 Billion ≈ $108.60 Million |
-27.16% |
| 2019-12-31 | NT$4.73 Billion ≈ $149.09 Million |
-23.29% |
| 2018-12-31 | NT$6.17 Billion ≈ $194.37 Million |
+8.09% |
| 2017-12-31 | NT$5.71 Billion ≈ $179.82 Million |
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About Integrated Service Technology
Integrated Service Technology Inc. research, develops, and manufactures integrated circuits, analysis and burn-in, and testing in Taiwan and internationally. The company provides MOSFET wafer backend processes, which offer MOSFET front-side metallization, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes; MOSFET backside metalliza… Read more