Integrated Service Technology (3289) - Total Liabilities

Latest as of December 2025: NT$4.30 Billion TWD ≈ $135.48 Million USD

Based on the latest financial reports, Integrated Service Technology (3289) has total liabilities worth NT$4.30 Billion TWD (≈ $135.48 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Integrated Service Technology - Total Liabilities Trend (2017–2025)

This chart illustrates how Integrated Service Technology's total liabilities have evolved over time, based on quarterly financial data. See 3289 net working capital ratio to evaluate short-term liquidity relative to the company's equity base.

Integrated Service Technology Competitors by Total Liabilities

The table below lists competitors of Integrated Service Technology ranked by their total liabilities.

Company Country Total Liabilities
Surya Semesta Internusa Tbk
JK:SSIA
Indonesia Rp4.64 Trillion
Nanjing Railway New Technology Co.Ltd.
SHE:301016
China CN¥155.16 Million
China Sanjiang Fine Chemicals Company Limited
F:8C9
Germany €17.07 Billion
Winton Land Ltd
AU:WTN
Australia AU$196.54 Million
Minto Apartment Real Estate Investment Trust
TO:MI-UN
Canada CA$1.58 Billion
Chengdu Lihang Technology Co.Ltd.
SHG:603261
China CN¥423.99 Million
Korea Line
KO:005880
Korea ₩1.74 Trillion
Liaoning Shenhua Holdings Co Ltd
SHG:600653
China CN¥2.03 Billion

Liability Composition Analysis (2017–2025)

This chart breaks down Integrated Service Technology's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Integrated Service Technology (3289) total market value.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.20 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.92 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.48 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Integrated Service Technology's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Integrated Service Technology (2017–2025)

The table below shows the annual total liabilities of Integrated Service Technology from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 NT$4.30 Billion
≈ $135.48 Million
-8.19%
2024-12-31 NT$4.68 Billion
≈ $147.56 Million
+8.04%
2023-12-31 NT$4.33 Billion
≈ $136.57 Million
+7.78%
2022-12-31 NT$4.02 Billion
≈ $126.71 Million
+3.21%
2021-12-31 NT$3.90 Billion
≈ $122.77 Million
+13.05%
2020-12-31 NT$3.45 Billion
≈ $108.60 Million
-27.16%
2019-12-31 NT$4.73 Billion
≈ $149.09 Million
-23.29%
2018-12-31 NT$6.17 Billion
≈ $194.37 Million
+8.09%
2017-12-31 NT$5.71 Billion
≈ $179.82 Million
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About Integrated Service Technology

TWO:3289 Taiwan Semiconductors
Market Cap
$461.64 Million
NT$14.65 Billion TWD
Market Cap Rank
#12848 Global
#503 in Taiwan
Share Price
NT$169.50
Change (1 day)
+0.00%
52-Week Range
NT$99.40 - NT$210.50
All Time High
NT$210.50
About

Integrated Service Technology Inc. research, develops, and manufactures integrated circuits, analysis and burn-in, and testing in Taiwan and internationally. The company provides MOSFET wafer backend processes, which offer MOSFET front-side metallization, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes; MOSFET backside metalliza… Read more