Integrated Service Technology Asset Resilience Ratio

Integrated Service Technology Inc. research, develops, and manufactures integrated circuits, analysis and burn-in, and testing in Taiwan and internationally. It provides MOSFET wafer backend processes, which offer MOSFET front-side metallization, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes; MOSFET backside metallization processes comprising metal evaporation deposition and thick Ag process; and turnkey solutions for backend processes, which include chip probing, laser marking, vacuum mounting, ring removal, die sawing, frame probing, tape and reel, and final test. The company also offers verification analysis services, such as focused ion beam (FIB) circuit edit; engineering sample preparation services, including grinding, wafer dicing saw, die bonding, IC wire bonding/assembly solutions, and surface mount technique process; failure analysis offers electrical characteristics measurement, non-destructive analysis, defect detection, and competitive analysis services; and signal integrity test, and design quality management. In addition, it offers material analysis solutions comprising sample preparation, structure observation, surface analysis, thermal and component analysis, and crystallographic analysis; reliability design test, such as component and board level reliability test, PCB design verification, automotive electronics test, surface mount technique, warpage verification, and other services; chemical and material analysis services, includes Consultancy for green and environmental protection regulations, and precise and quantitative analysis; and various consultancy services, includes quality assurance and function safety, ESG, and laboratory accreditation and green mark, as well as import and export of semiconductor parts and relevant equipment, electronic parts, computer and computer components. The company was incorporated in 1994 and is based in Hsinchu City, Taiwan.