LB Semicon Inc - Asset Resilience Ratio
LB Semicon Inc (061970) has an Asset Resilience Ratio of 0.17% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read LB Semicon Inc balance sheet liabilities for a breakdown of total debt and financial obligations.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2010–2024)
This chart shows how LB Semicon Inc's Asset Resilience Ratio has changed over time. See 061970 net asset value for net asset value and shareholders' equity analysis.
Liquid Assets Composition Over Time
This chart breaks down LB Semicon Inc's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see LB Semicon Inc market capitalisation.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | ₩0.00 | 0% |
| Short-term Investments | ₩1.28 Billion | 0.17% |
| Total Liquid Assets | ₩1.28 Billion | 0.17% |
Asset Resilience Insights
- Limited Liquidity: LB Semicon Inc maintains only 0.17% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
LB Semicon Inc Industry Peers by Asset Resilience Ratio
Compare LB Semicon Inc's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
NVIDIA Corporation
NASDAQ:NVDA |
Semiconductors | 25.12% |
|
Broadcom Inc
NASDAQ:AVGO |
Semiconductors | 0.00% |
|
MediaTek Inc
TW:2454 |
Semiconductors | 1.67% |
|
Shannon Semiconductor Technology Co Ltd
SHE:300475 |
Semiconductors | 1.74% |
|
Sitime Corporation
NASDAQ:SITM |
Semiconductors | 61.15% |
|
Shanghai V-Test Semiconductor Tech Co. Ltd. A
SHG:688372 |
Semiconductors | 5.23% |
|
Airoha Technology Corp
TW:6526 |
Semiconductors | 0.08% |
|
Melexis NV
BR:MELE |
Semiconductors | 0.04% |
Annual Asset Resilience Ratio for LB Semicon Inc (2010–2024)
The table below shows the annual Asset Resilience Ratio data for LB Semicon Inc.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 9.59% | ₩77.28 Billion ≈ $52.37 Million |
₩806.05 Billion ≈ $546.25 Million |
-5.91pp |
| 2023-12-31 | 15.50% | ₩122.62 Billion ≈ $83.10 Million |
₩791.20 Billion ≈ $536.18 Million |
+2.98pp |
| 2022-12-31 | 12.52% | ₩96.03 Billion ≈ $65.08 Million |
₩767.09 Billion ≈ $519.85 Million |
-2.82pp |
| 2021-12-31 | 15.34% | ₩107.41 Billion ≈ $72.79 Million |
₩700.32 Billion ≈ $474.60 Million |
+6.95pp |
| 2020-12-31 | 8.39% | ₩44.23 Billion ≈ $29.98 Million |
₩527.48 Billion ≈ $357.47 Million |
+1.50pp |
| 2019-12-31 | 6.89% | ₩32.96 Billion ≈ $22.33 Million |
₩478.59 Billion ≈ $324.34 Million |
+2.36pp |
| 2018-12-31 | 4.52% | ₩17.60 Billion ≈ $11.93 Million |
₩388.96 Billion ≈ $263.59 Million |
-6.25pp |
| 2017-12-31 | 10.78% | ₩25.48 Billion ≈ $17.27 Million |
₩236.46 Billion ≈ $160.25 Million |
+3.23pp |
| 2016-12-31 | 7.55% | ₩16.02 Billion ≈ $10.86 Million |
₩212.30 Billion ≈ $143.88 Million |
+3.90pp |
| 2015-12-31 | 3.64% | ₩8.20 Billion ≈ $5.56 Million |
₩225.27 Billion ≈ $152.66 Million |
-0.10pp |
| 2014-12-31 | 3.74% | ₩8.55 Billion ≈ $5.79 Million |
₩228.75 Billion ≈ $155.02 Million |
-0.71pp |
| 2012-12-31 | 4.44% | ₩9.41 Billion ≈ $6.38 Million |
₩211.79 Billion ≈ $143.53 Million |
-3.11pp |
| 2011-12-31 | 7.55% | ₩12.12 Billion ≈ $8.21 Million |
₩160.42 Billion ≈ $108.72 Million |
+7.08pp |
| 2010-12-31 | 0.47% | ₩461.57 Million ≈ $312.80K |
₩98.33 Billion ≈ $66.64 Million |
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About LB Semicon Inc
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layo… Read more