LB Semicon Inc (061970) - Total Liabilities

Latest as of September 2025: ₩445.64 Billion KRW ≈ $302.01 Million USD

Based on the latest financial reports, LB Semicon Inc (061970) has total liabilities worth ₩445.64 Billion KRW (≈ $302.01 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

LB Semicon Inc - Total Liabilities Trend (2009–2024)

This chart illustrates how LB Semicon Inc's total liabilities have evolved over time, based on quarterly financial data. See LB Semicon Inc short-term liquidity ratio to evaluate short-term liquidity relative to the company's equity base.

LB Semicon Inc Competitors by Total Liabilities

The table below lists competitors of LB Semicon Inc ranked by their total liabilities.

Company Country Total Liabilities
Platinum Group Metals Ltd
TO:PTM
Canada CA$4.81 Million
Eurocash S.A.
WAR:EUR
Poland zł7.42 Billion
Tong Ming Enterprise Co Ltd
TW:5538
Taiwan NT$7.04 Billion
eGain Corporation
NASDAQ:EGAN
USA $48.13 Million
Saturn Metals Ltd
AU:STN
Australia AU$2.96 Million
Priner Serviços Industriais S.A
SA:PRNR3
Brazil R$1.26 Billion
029 GROUP SE INH O.N.
XETRA:Z29
Germany €778.19K
Principal Capital Public Company Limited
BK:PRINC
Thailand ฿6.90 Billion

Liability Composition Analysis (2009–2024)

This chart breaks down LB Semicon Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 061970 company net worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.58 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.39 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.58 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how LB Semicon Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for LB Semicon Inc (2009–2024)

The table below shows the annual total liabilities of LB Semicon Inc from 2009 to 2024.

Year Total Liabilities Change
2024-12-31 ₩459.81 Billion
≈ $311.61 Million
+8.18%
2023-12-31 ₩425.05 Billion
≈ $288.05 Million
-14.68%
2022-12-31 ₩498.18 Billion
≈ $337.61 Million
+5.62%
2021-12-31 ₩471.70 Billion
≈ $319.66 Million
+33.50%
2020-12-31 ₩353.33 Billion
≈ $239.45 Million
+7.43%
2019-12-31 ₩328.90 Billion
≈ $222.89 Million
+20.75%
2018-12-31 ₩272.38 Billion
≈ $184.59 Million
+100.22%
2017-12-31 ₩136.04 Billion
≈ $92.19 Million
+15.24%
2016-12-31 ₩118.06 Billion
≈ $80.00 Million
-17.75%
2015-12-31 ₩143.54 Billion
≈ $97.27 Million
+2.94%
2014-12-31 ₩139.44 Billion
≈ $94.50 Million
+16.89%
2012-12-31 ₩119.29 Billion
≈ $80.84 Million
+48.53%
2011-12-31 ₩80.31 Billion
≈ $54.43 Million
+39.07%
2010-12-31 ₩57.75 Billion
≈ $39.14 Million
+13.05%
2009-12-31 ₩51.09 Billion
≈ $34.62 Million
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About LB Semicon Inc

KQ:061970 Korea Semiconductors
Market Cap
$203.13 Million
₩299.73 Billion KRW
Market Cap Rank
#16594 Global
#634 in Korea
Share Price
₩5300.00
Change (1 day)
-4.33%
52-Week Range
₩3500.00 - ₩6880.00
All Time High
₩15732.38
About

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layo… Read more