LB Semicon Inc (061970) - Total Liabilities

Latest as of September 2025: ₩445.64 Billion KRW ≈ $302.01 Million USD

Based on the latest financial reports, LB Semicon Inc (061970) has total liabilities worth ₩445.64 Billion KRW (≈ $302.01 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore cash efficiency ratio of LB Semicon Inc to assess how effectively this company generates cash.

LB Semicon Inc - Total Liabilities Trend (2009–2024)

This chart illustrates how LB Semicon Inc's total liabilities have evolved over time, based on quarterly financial data. Check LB Semicon Inc liquidity resilience to evaluate the company's liquid asset resilience ratio.

LB Semicon Inc Competitors by Total Liabilities

The table below lists competitors of LB Semicon Inc ranked by their total liabilities.

Company Country Total Liabilities
Nextronics Engineering
TWO:8147
Taiwan NT$866.83 Million
Old Point Financial Corporation
NASDAQ:OPOF
USA $1.28 Billion
Blue Acquisition Corp. Class A Ordinary Shares
NASDAQ:BACC
USA $8.12 Million
Niu Technologies
NASDAQ:NIU
USA $2.41 Billion
Ha Tien 1 Cement JSC
VN:HT1
Vietnam ₫2.51 Trillion
Exco Technologies Limited
TO:XTC
Canada CA$206.99 Million
Seneca Foods Corp B
NASDAQ:SENEB
USA $508.64 Million
DaeChang Solution Co. Ltd
KQ:096350
Korea ₩104.24 Billion

Liability Composition Analysis (2009–2024)

This chart breaks down LB Semicon Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 061970 company net worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.58 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.39 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.58 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how LB Semicon Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for LB Semicon Inc (2009–2024)

The table below shows the annual total liabilities of LB Semicon Inc from 2009 to 2024.

Year Total Liabilities Change
2024-12-31 ₩459.81 Billion
≈ $311.61 Million
+8.18%
2023-12-31 ₩425.05 Billion
≈ $288.05 Million
-14.68%
2022-12-31 ₩498.18 Billion
≈ $337.61 Million
+5.62%
2021-12-31 ₩471.70 Billion
≈ $319.66 Million
+33.50%
2020-12-31 ₩353.33 Billion
≈ $239.45 Million
+7.43%
2019-12-31 ₩328.90 Billion
≈ $222.89 Million
+20.75%
2018-12-31 ₩272.38 Billion
≈ $184.59 Million
+100.22%
2017-12-31 ₩136.04 Billion
≈ $92.19 Million
+15.24%
2016-12-31 ₩118.06 Billion
≈ $80.00 Million
-17.75%
2015-12-31 ₩143.54 Billion
≈ $97.27 Million
+2.94%
2014-12-31 ₩139.44 Billion
≈ $94.50 Million
+16.89%
2012-12-31 ₩119.29 Billion
≈ $80.84 Million
+48.53%
2011-12-31 ₩80.31 Billion
≈ $54.43 Million
+39.07%
2010-12-31 ₩57.75 Billion
≈ $39.14 Million
+13.05%
2009-12-31 ₩51.09 Billion
≈ $34.62 Million
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About LB Semicon Inc

KQ:061970 Korea Semiconductors
Market Cap
$214.62 Million
₩316.70 Billion KRW
Market Cap Rank
#16264 Global
#667 in Korea
Share Price
₩5600.00
Change (1 day)
-2.27%
52-Week Range
₩3135.00 - ₩6880.00
All Time High
₩15732.38
About

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layo… Read more