LB Semicon Inc (061970) - Total Liabilities

Latest as of September 2025: ₩445.64 Billion KRW ≈ $302.01 Million USD

Based on the latest financial reports, LB Semicon Inc (061970) has total liabilities worth ₩445.64 Billion KRW (≈ $302.01 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 061970 strategic capital deployment ratio to see how much of total assets are deployed in long-term investments.

LB Semicon Inc - Total Liabilities Trend (2009–2024)

This chart illustrates how LB Semicon Inc's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 061970 total assets.

LB Semicon Inc Competitors by Total Liabilities

The table below lists competitors of LB Semicon Inc ranked by their total liabilities.

Company Country Total Liabilities
ALEXANDRIA PANKKIIRILIIKE
F:3ZL
Germany €22.70 Million
Mountain & I Acquisition Co Corp
NASDAQ:MCAA
USA $16.41 Million
MODISON LIMITED
NSE:MODISONLTD
India Rs2.28 Billion
InfoBeans Technologies Limited
NSE:INFOBEAN
India Rs-4.14 Billion
Gesher Acquisition Corp. II
NASDAQ:GSHR
USA $5.47 Million
Net Lease Office Properties
NYSE:NLOP
USA $33.17 Million
Nusantara Pelabuhan Handal Tbk PT
JK:PORT
Indonesia Rp1.25 Trillion
Wellgistics Health, Inc. Common Stock
NASDAQ:WGRX
USA $45.19 Million

Liability Composition Analysis (2009–2024)

This chart breaks down LB Semicon Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See how leveraged is LB Semicon Inc's balance sheet to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 0.58 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 1.39 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.58 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how LB Semicon Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for LB Semicon Inc (2009–2024)

The table below shows the annual total liabilities of LB Semicon Inc from 2009 to 2024.

Year Total Liabilities Change
2024-12-31 ₩459.81 Billion
≈ $311.61 Million
+8.18%
2023-12-31 ₩425.05 Billion
≈ $288.05 Million
-14.68%
2022-12-31 ₩498.18 Billion
≈ $337.61 Million
+5.62%
2021-12-31 ₩471.70 Billion
≈ $319.66 Million
+33.50%
2020-12-31 ₩353.33 Billion
≈ $239.45 Million
+7.43%
2019-12-31 ₩328.90 Billion
≈ $222.89 Million
+20.75%
2018-12-31 ₩272.38 Billion
≈ $184.59 Million
+100.22%
2017-12-31 ₩136.04 Billion
≈ $92.19 Million
+15.24%
2016-12-31 ₩118.06 Billion
≈ $80.00 Million
-17.75%
2015-12-31 ₩143.54 Billion
≈ $97.27 Million
+2.94%
2014-12-31 ₩139.44 Billion
≈ $94.50 Million
+16.89%
2012-12-31 ₩119.29 Billion
≈ $80.84 Million
+48.53%
2011-12-31 ₩80.31 Billion
≈ $54.43 Million
+39.07%
2010-12-31 ₩57.75 Billion
≈ $39.14 Million
+13.05%
2009-12-31 ₩51.09 Billion
≈ $34.62 Million
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About LB Semicon Inc

KQ:061970 Korea Semiconductors
Market Cap
$157.71 Million
₩232.72 Billion KRW
Market Cap Rank
#17548 Global
#718 in Korea
Share Price
₩4115.00
Change (1 day)
+3.13%
52-Week Range
₩2970.00 - ₩6880.00
All Time High
₩15732.38
About

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layo… Read more