LB Semicon Inc (061970) - Total Liabilities
Based on the latest financial reports, LB Semicon Inc (061970) has total liabilities worth ₩445.64 Billion KRW (≈ $302.01 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
LB Semicon Inc - Total Liabilities Trend (2009–2024)
This chart illustrates how LB Semicon Inc's total liabilities have evolved over time, based on quarterly financial data. See LB Semicon Inc short-term liquidity ratio to evaluate short-term liquidity relative to the company's equity base.
LB Semicon Inc Competitors by Total Liabilities
The table below lists competitors of LB Semicon Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Platinum Group Metals Ltd
TO:PTM
|
Canada | CA$4.81 Million |
|
Eurocash S.A.
WAR:EUR
|
Poland | zł7.42 Billion |
|
Tong Ming Enterprise Co Ltd
TW:5538
|
Taiwan | NT$7.04 Billion |
|
eGain Corporation
NASDAQ:EGAN
|
USA | $48.13 Million |
|
Saturn Metals Ltd
AU:STN
|
Australia | AU$2.96 Million |
|
Priner Serviços Industriais S.A
SA:PRNR3
|
Brazil | R$1.26 Billion |
|
029 GROUP SE INH O.N.
XETRA:Z29
|
Germany | €778.19K |
|
Principal Capital Public Company Limited
BK:PRINC
|
Thailand | ฿6.90 Billion |
Liability Composition Analysis (2009–2024)
This chart breaks down LB Semicon Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 061970 company net worth.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.58 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 1.39 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.58 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how LB Semicon Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for LB Semicon Inc (2009–2024)
The table below shows the annual total liabilities of LB Semicon Inc from 2009 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | ₩459.81 Billion ≈ $311.61 Million |
+8.18% |
| 2023-12-31 | ₩425.05 Billion ≈ $288.05 Million |
-14.68% |
| 2022-12-31 | ₩498.18 Billion ≈ $337.61 Million |
+5.62% |
| 2021-12-31 | ₩471.70 Billion ≈ $319.66 Million |
+33.50% |
| 2020-12-31 | ₩353.33 Billion ≈ $239.45 Million |
+7.43% |
| 2019-12-31 | ₩328.90 Billion ≈ $222.89 Million |
+20.75% |
| 2018-12-31 | ₩272.38 Billion ≈ $184.59 Million |
+100.22% |
| 2017-12-31 | ₩136.04 Billion ≈ $92.19 Million |
+15.24% |
| 2016-12-31 | ₩118.06 Billion ≈ $80.00 Million |
-17.75% |
| 2015-12-31 | ₩143.54 Billion ≈ $97.27 Million |
+2.94% |
| 2014-12-31 | ₩139.44 Billion ≈ $94.50 Million |
+16.89% |
| 2012-12-31 | ₩119.29 Billion ≈ $80.84 Million |
+48.53% |
| 2011-12-31 | ₩80.31 Billion ≈ $54.43 Million |
+39.07% |
| 2010-12-31 | ₩57.75 Billion ≈ $39.14 Million |
+13.05% |
| 2009-12-31 | ₩51.09 Billion ≈ $34.62 Million |
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About LB Semicon Inc
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layo… Read more