LB Semicon Inc Cash Flow Conversion Efficiency

Latest as of September 2025: 0.045x

LB Semicon Inc cash flow conversion efficiency. Based on the latest financial reports, LB Semicon Inc (061970) has a cash flow conversion efficiency ratio of 0.045x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩14.42 Billion ≈ $9.77 Million USD) by net assets (₩323.55 Billion ≈ $219.26 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.

Cash Flow Conversion Efficiency of LB Semicon Inc (2009–2024)

Cash flow conversion efficiency of LB Semicon Inc from 2009 to 2024. This chart illustrates how LB Semicon Inc's cash flow conversion efficiency has evolved over time, based on yearly financial data. View LB Semicon Inc (061970) share price today for real-time trading data and today's change.

LB Semicon Inc Cash Flow Conversion Ratio Explained

LB Semicon Inc cash flow conversion ratio divides operating cash flow by net assets, so a higher ratio means more cash generated from each unit of shareholder equity.

LB Semicon Inc Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of LB Semicon Inc ranked by their cash flow conversion efficiency. Also see 061970 market cap overview for the company's overall valuation and market capitalisation.

Company Cash Flow Conversion Efficiency
SaraminHR Co.Ltd
KQ:143240
-0.026x
Oriental Precision & Engineering Co.Ltd
KQ:014940
0.088x
New Asia Construction & Development Corp
TW:2516
0.014x
Safari Investments RSA Ltd
JSE:SAR
0.015x
Rafael Microelectronics
TWO:6568
0.045x
Procaps Group SA
NASDAQ:PROC
1.232x
Lokum Deweloper SA
WAR:LKD
-0.049x
Corner Growth Acquisition Corp
NASDAQ:COOL
0.000x

Annual Cash Flow Conversion Efficiency for LB Semicon Inc (2009–2024)

The table below shows the annual cash flow conversion efficiency of LB Semicon Inc from 2009 to 2024. Review 061970 free cash flow generation to assess how much free cash flow the company generates relative to operating cash flow.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2024-12-31 ₩346.24 Billion
≈ $234.64 Million
₩52.04 Billion
≈ $35.27 Million
0.150x -31.85%
2023-12-31 ₩366.15 Billion
≈ $248.13 Million
₩80.75 Billion
≈ $54.72 Million
0.221x -52.18%
2022-12-31 ₩268.91 Billion
≈ $182.24 Million
₩124.02 Billion
≈ $84.05 Million
0.461x -4.04%
2021-12-31 ₩228.62 Billion
≈ $154.93 Million
₩109.88 Billion
≈ $74.46 Million
0.481x +5.32%
2020-12-31 ₩174.15 Billion
≈ $118.02 Million
₩79.47 Billion
≈ $53.85 Million
0.456x -28.91%
2019-12-31 ₩149.70 Billion
≈ $101.45 Million
₩96.09 Billion
≈ $65.12 Million
0.642x +9.17%
2018-12-31 ₩116.58 Billion
≈ $79.00 Million
₩68.55 Billion
≈ $46.45 Million
0.588x +111.61%
2017-12-31 ₩100.42 Billion
≈ $68.05 Million
₩27.90 Billion
≈ $18.91 Million
0.278x -46.93%
2016-12-31 ₩94.25 Billion
≈ $63.87 Million
₩49.35 Billion
≈ $33.44 Million
0.524x +42.94%
2015-12-31 ₩81.74 Billion
≈ $55.39 Million
₩29.94 Billion
≈ $20.29 Million
0.366x +37.06%
2014-12-31 ₩89.31 Billion
≈ $60.52 Million
₩23.87 Billion
≈ $16.17 Million
0.267x +15.02%
2012-12-31 ₩92.50 Billion
≈ $62.69 Million
₩21.49 Billion
≈ $14.56 Million
0.232x +771.23%
2011-12-31 ₩80.11 Billion
≈ $54.29 Million
₩2.14 Billion
≈ $1.45 Million
0.027x -93.59%
2010-12-31 ₩40.58 Billion
≈ $27.50 Million
₩16.87 Billion
≈ $11.43 Million
0.416x -33.73%
2009-12-31 ₩21.42 Billion
≈ $14.51 Million
₩13.43 Billion
≈ $9.10 Million
0.627x --

About LB Semicon Inc

KQ:061970 Korea Semiconductors
Market Cap
$114.02 Million
₩168.25 Billion KRW
Market Cap Rank
#18472 Global
#832 in Korea
Share Price
₩2975.00
Change (1 day)
-4.65%
52-Week Range
₩2970.00 - ₩6880.00
All Time High
₩15732.38
About

LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layo… Read more