LB Semicon Inc Cash Flow Conversion Efficiency
LB Semicon Inc cash flow conversion efficiency. Based on the latest financial reports, LB Semicon Inc (061970) has a cash flow conversion efficiency ratio of 0.045x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (₩14.42 Billion ≈ $9.77 Million USD) by net assets (₩323.55 Billion ≈ $219.26 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.
Cash Flow Conversion Efficiency of LB Semicon Inc (2009–2024)
Cash flow conversion efficiency of LB Semicon Inc from 2009 to 2024. This chart illustrates how LB Semicon Inc's cash flow conversion efficiency has evolved over time, based on yearly financial data. View LB Semicon Inc (061970) share price today for real-time trading data and today's change.
LB Semicon Inc Cash Flow Conversion Ratio Explained
LB Semicon Inc cash flow conversion ratio divides operating cash flow by net assets, so a higher ratio means more cash generated from each unit of shareholder equity.
LB Semicon Inc Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of LB Semicon Inc ranked by their cash flow conversion efficiency. Also see 061970 market cap overview for the company's overall valuation and market capitalisation.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
SaraminHR Co.Ltd
KQ:143240
|
-0.026x |
|
Oriental Precision & Engineering Co.Ltd
KQ:014940
|
0.088x |
|
New Asia Construction & Development Corp
TW:2516
|
0.014x |
|
Safari Investments RSA Ltd
JSE:SAR
|
0.015x |
|
Rafael Microelectronics
TWO:6568
|
0.045x |
|
Procaps Group SA
NASDAQ:PROC
|
1.232x |
|
Lokum Deweloper SA
WAR:LKD
|
-0.049x |
|
Corner Growth Acquisition Corp
NASDAQ:COOL
|
0.000x |
Annual Cash Flow Conversion Efficiency for LB Semicon Inc (2009–2024)
The table below shows the annual cash flow conversion efficiency of LB Semicon Inc from 2009 to 2024. Review 061970 free cash flow generation to assess how much free cash flow the company generates relative to operating cash flow.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2024-12-31 | ₩346.24 Billion ≈ $234.64 Million |
₩52.04 Billion ≈ $35.27 Million |
0.150x | -31.85% |
| 2023-12-31 | ₩366.15 Billion ≈ $248.13 Million |
₩80.75 Billion ≈ $54.72 Million |
0.221x | -52.18% |
| 2022-12-31 | ₩268.91 Billion ≈ $182.24 Million |
₩124.02 Billion ≈ $84.05 Million |
0.461x | -4.04% |
| 2021-12-31 | ₩228.62 Billion ≈ $154.93 Million |
₩109.88 Billion ≈ $74.46 Million |
0.481x | +5.32% |
| 2020-12-31 | ₩174.15 Billion ≈ $118.02 Million |
₩79.47 Billion ≈ $53.85 Million |
0.456x | -28.91% |
| 2019-12-31 | ₩149.70 Billion ≈ $101.45 Million |
₩96.09 Billion ≈ $65.12 Million |
0.642x | +9.17% |
| 2018-12-31 | ₩116.58 Billion ≈ $79.00 Million |
₩68.55 Billion ≈ $46.45 Million |
0.588x | +111.61% |
| 2017-12-31 | ₩100.42 Billion ≈ $68.05 Million |
₩27.90 Billion ≈ $18.91 Million |
0.278x | -46.93% |
| 2016-12-31 | ₩94.25 Billion ≈ $63.87 Million |
₩49.35 Billion ≈ $33.44 Million |
0.524x | +42.94% |
| 2015-12-31 | ₩81.74 Billion ≈ $55.39 Million |
₩29.94 Billion ≈ $20.29 Million |
0.366x | +37.06% |
| 2014-12-31 | ₩89.31 Billion ≈ $60.52 Million |
₩23.87 Billion ≈ $16.17 Million |
0.267x | +15.02% |
| 2012-12-31 | ₩92.50 Billion ≈ $62.69 Million |
₩21.49 Billion ≈ $14.56 Million |
0.232x | +771.23% |
| 2011-12-31 | ₩80.11 Billion ≈ $54.29 Million |
₩2.14 Billion ≈ $1.45 Million |
0.027x | -93.59% |
| 2010-12-31 | ₩40.58 Billion ≈ $27.50 Million |
₩16.87 Billion ≈ $11.43 Million |
0.416x | -33.73% |
| 2009-12-31 | ₩21.42 Billion ≈ $14.51 Million |
₩13.43 Billion ≈ $9.10 Million |
0.627x | -- |
About LB Semicon Inc
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layo… Read more