Kyobo 3 SPAC
Photon Co., Ltd. engages in the manufacture and sale of camera module parts for smart phones in China and internationally. It offers AF/OIS (optical image stabilization) FPCB assy, folded zoom FPCB assy, SUB assy, ISM, winding coils, etc. The company was formerly known as Biolog Device Co., Ltd. and changed its name to Photon Co., Ltd. in April 2025. The company was founded in 2008 and is headqua… Read more
Kyobo 3 SPAC - Asset Resilience Ratio
Kyobo 3 SPAC (208710) has an Asset Resilience Ratio of 6.53% as of March 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2015–2024)
This chart shows how Kyobo 3 SPAC's Asset Resilience Ratio has changed over time. Compare with other companies' asset resilience ratios.
Liquid Assets Composition Over Time
This chart breaks down Kyobo 3 SPAC's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | ₩5.60 Billion | 6.53% |
| Short-term Investments | ₩-1.05K | -0.0% |
| Total Liquid Assets | ₩5.60 Billion | 6.53% |
Asset Resilience Insights
- Limited Liquidity: Kyobo 3 SPAC maintains only 6.53% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company primarily holds liquidity in cash and equivalents rather than short-term investments.
Kyobo 3 SPAC Industry Peers by Asset Resilience Ratio
Compare Kyobo 3 SPAC's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Shenzhen Zhongheng Huafa Co Ltd Class A
SHE:000020 |
Electronic Components | 0.51% |
|
Shenzhen Desay Battery Technology Co Ltd
SHE:000049 |
Electronic Components | 8.20% |
|
CPT Technology Group Co Ltd
SHE:000536 |
Electronic Components | 8.15% |
|
Guangdong Fenghua Advanced Technology Holding Co Ltd
SHE:000636 |
Electronic Components | 0.29% |
|
YoungPoong
KO:000670 |
Electronic Components | 3.00% |
|
Xiamen Xindeco Ltd
SHE:000701 |
Electronic Components | 0.56% |
|
BOE Technology Group Co Ltd
SHE:000725 |
Electronic Components | 0.55% |
|
China Zhenhua Group Science & Technology Co Ltd
SHE:000733 |
Electronic Components | 9.10% |
Annual Asset Resilience Ratio for Kyobo 3 SPAC (2015–2024)
The table below shows the annual Asset Resilience Ratio data for Kyobo 3 SPAC.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 8.03% | ₩7.94 Billion | ₩98.90 Billion | -0.18pp |
| 2023-12-31 | 8.21% | ₩8.87 Billion | ₩108.15 Billion | +4.82pp |
| 2022-12-31 | 3.39% | ₩2.92 Billion | ₩86.05 Billion | -7.16pp |
| 2021-12-31 | 10.55% | ₩10.95 Billion | ₩103.77 Billion | +6.40pp |
| 2020-12-31 | 4.15% | ₩4.20 Billion | ₩101.14 Billion | -3.25pp |
| 2019-12-31 | 7.41% | ₩6.58 Billion | ₩88.92 Billion | -0.64pp |
| 2018-12-31 | 8.04% | ₩6.16 Billion | ₩76.55 Billion | -11.44pp |
| 2017-12-31 | 19.48% | ₩12.45 Billion | ₩63.92 Billion | +14.13pp |
| 2016-12-31 | 5.35% | ₩2.82 Billion | ₩52.64 Billion | +4.56pp |
| 2015-12-31 | 0.79% | ₩335.00 Million | ₩42.36 Billion | -- |