Shenzhen Sunshine Laser & Electronics Technology Co Ltd - Asset Resilience Ratio

Latest as of March 2026: 1.55%

Shenzhen Sunshine Laser & Electronics Technology Co Ltd (300227) has an Asset Resilience Ratio of 1.55% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Shenzhen Sunshine Laser & Electronics Te (300227) liquidity to equity ratio to evaluate short-term liquidity relative to the company's equity base.

Liquid Assets

CN¥70.00 Million
≈ $10.24 Million USD Cash + Short-term Investments

Total Assets

CN¥4.52 Billion
≈ $662.14 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2019–2025)

This chart shows how Shenzhen Sunshine Laser & Electronics Technology Co Ltd's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see 300227 current and non-current assets.

Liquid Assets Composition Over Time

This chart breaks down Shenzhen Sunshine Laser & Electronics Technology Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Explore 300227 long-term asset investment ratio to see how much of total assets are deployed in long-term investments.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥70.00 Million 1.55%
Total Liquid Assets CN¥70.00 Million 1.55%

Asset Resilience Insights

  • Limited Liquidity: Shenzhen Sunshine Laser & Electronics Technology Co Ltd maintains only 1.55% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Shenzhen Sunshine Laser & Electronics Technology Co Ltd Industry Peers by Asset Resilience Ratio

Compare Shenzhen Sunshine Laser & Electronics Technology Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Gold Circuit Electronics Ltd
TW:2368
Electronic Components 0.52%
Shennan Circuits Co Ltd Class A
SHE:002916
Electronic Components 1.57%
Goldenmax International Technology Ltd
SHE:002636
Electronic Components 2.56%
LG Innotek Co Ltd
KO:011070
Electronic Components 0.01%
Shanghai Wanye Enterprises Co Ltd
SHG:600641
Electronic Components 0.06%
Suzhou HYC Technology Co Ltd
SHG:688001
Electronic Components 0.06%
Co-Tech Development
TWO:8358
Electronic Components 0.16%
Long Young Electronic (Kunshan) Co. Ltd. A
SHE:301389
Electronic Components 27.28%

Annual Asset Resilience Ratio for Shenzhen Sunshine Laser & Electronics Technology Co Ltd (2019–2025)

The table below shows the annual Asset Resilience Ratio data for Shenzhen Sunshine Laser & Electronics Technology Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2025-12-31 1.06% CN¥45.00 Million
≈ $6.58 Million
CN¥4.23 Billion
≈ $618.77 Million
+1.05pp
2024-12-31 0.01% CN¥350.21K
≈ $51.25K
CN¥2.88 Billion
≈ $421.29 Million
-1.15pp
2020-12-31 1.17% CN¥23.11 Million
≈ $3.38 Million
CN¥1.98 Billion
≈ $290.00 Million
-0.62pp
2019-12-31 1.78% CN¥31.23 Million
≈ $4.57 Million
CN¥1.75 Billion
≈ $256.41 Million
--
pp = percentage points

About Shenzhen Sunshine Laser & Electronics Technology Co Ltd

SHE:300227 China Electronic Components
Market Cap
$980.76 Million
CN¥6.70 Billion CNY
Market Cap Rank
#9046 Global
#2229 in China
Share Price
CN¥11.25
Change (1 day)
+1.08%
52-Week Range
CN¥8.10 - CN¥14.33
All Time High
CN¥7025.64
About

Shenzhen Sunshine Laser & Electronics Technology Co., Ltd. provides laser intelligent manufacturing solutions and services worldwide. It offers laser application services, such as precision laser stencil, precise laser drilling, laser structuring of flexible circuit board, and additive manufacturing 3D printing, as well as individual design and manufacture of precision components; electronic manu… Read more