Shenzhen Fine Made Electronics Group Co Ltd - Asset Resilience Ratio
Shenzhen Fine Made Electronics Group Co Ltd (300671) has an Asset Resilience Ratio of 13.10% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check Shenzhen Fine Made Electronics Group Co (300671) strategic asset index to assess the company's strategic physical and investment asset allocation.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2013–2025)
This chart shows how Shenzhen Fine Made Electronics Group Co Ltd's Asset Resilience Ratio has changed over time. See Shenzhen Fine Made Electronics Group Co balance sheet independence to measure how much of total assets are equity-financed.
Liquid Assets Composition Over Time
This chart breaks down Shenzhen Fine Made Electronics Group Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see Shenzhen Fine Made Electronics Group Co (300671) total market value.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 0% |
| Short-term Investments | CN¥360.50 Million | 13.1% |
| Total Liquid Assets | CN¥360.50 Million | 13.10% |
Asset Resilience Insights
- Moderate Liquidity: Shenzhen Fine Made Electronics Group Co Ltd has 13.10% of assets in liquid form.
- While adequate for normal operations, this level may limit flexibility during economic stress.
- The company has significant short-term investments, indicating active treasury management.
Shenzhen Fine Made Electronics Group Co Ltd Industry Peers by Asset Resilience Ratio
Compare Shenzhen Fine Made Electronics Group Co Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Sitime Corporation
NASDAQ:SITM |
Semiconductors | 22.45% |
|
Ingenic Semiconductor
SHE:300223 |
Semiconductors | 11.50% |
|
Dosilicon Co Ltd
SHG:688110 |
Semiconductors | 14.90% |
|
SmartSens Technology (Shanghai) Co. Ltd. A
SHG:688213 |
Semiconductors | 0.56% |
|
Shanghai Fullhan Microelectronics Co Ltd
SHE:300613 |
Semiconductors | 6.54% |
|
Zbit Semiconductor Inc. A
SHG:688416 |
Semiconductors | 27.75% |
|
Suzhou Oriental Semiconductor Co. Ltd. A
SHG:688261 |
Semiconductors | 34.42% |
|
SILEX Systems Ltd
AU:SLX |
Semiconductors | 62.86% |
Annual Asset Resilience Ratio for Shenzhen Fine Made Electronics Group Co Ltd (2013–2025)
The table below shows the annual Asset Resilience Ratio data for Shenzhen Fine Made Electronics Group Co Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 11.92% | CN¥318.55 Million ≈ $46.61 Million |
CN¥2.67 Billion ≈ $391.16 Million |
+3.73pp |
| 2024-12-31 | 8.19% | CN¥215.98 Million ≈ $31.60 Million |
CN¥2.64 Billion ≈ $386.00 Million |
-4.50pp |
| 2023-12-31 | 12.68% | CN¥369.55 Million ≈ $54.08 Million |
CN¥2.91 Billion ≈ $426.37 Million |
-4.49pp |
| 2022-12-31 | 17.17% | CN¥562.34 Million ≈ $82.29 Million |
CN¥3.28 Billion ≈ $479.27 Million |
+4.43pp |
| 2021-12-31 | 12.74% | CN¥377.61 Million ≈ $55.26 Million |
CN¥2.96 Billion ≈ $433.85 Million |
+6.04pp |
| 2020-12-31 | 6.70% | CN¥110.66 Million ≈ $16.19 Million |
CN¥1.65 Billion ≈ $241.78 Million |
+8.95pp |
| 2019-12-31 | -2.25% | CN¥-23.30 Million ≈ $-3.41 Million |
CN¥1.03 Billion ≈ $151.28 Million |
-1.71pp |
| 2013-12-31 | -0.54% | CN¥-1.53 Million ≈ $-223.67K |
CN¥281.94 Million ≈ $41.26 Million |
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About Shenzhen Fine Made Electronics Group Co Ltd
Shenzhen Fine Made Electronics Group Co., Ltd. engages in the design, development, packaging, testing, and sale of analog and digital-analog hybrid integrated circuits in China. The company offers power management, LED screen control and drive, MOSFET, MCU, fast charging protocol, RFID, radio frequency front-end and module chips, and various ASIC chips products. Its products are used in consumer … Read more