China Wafer Level Csp Co Ltd - Asset Resilience Ratio
China Wafer Level Csp Co Ltd (603005) has an Asset Resilience Ratio of 14.50% as of December 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read 603005 total liabilities for a breakdown of total debt and financial obligations.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2014–2025)
This chart shows how China Wafer Level Csp Co Ltd's Asset Resilience Ratio has changed over time. See China Wafer Level Csp Co Ltd (603005) shareholders funds for net asset value and shareholders' equity analysis.
Liquid Assets Composition Over Time
This chart breaks down China Wafer Level Csp Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see market value of China Wafer Level Csp Co Ltd.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 0% |
| Short-term Investments | CN¥750.00 Million | 14.5% |
| Total Liquid Assets | CN¥750.00 Million | 14.50% |
Asset Resilience Insights
- Moderate Liquidity: China Wafer Level Csp Co Ltd has 14.50% of assets in liquid form.
- While adequate for normal operations, this level may limit flexibility during economic stress.
- The company has significant short-term investments, indicating active treasury management.
China Wafer Level Csp Co Ltd Industry Peers by Asset Resilience Ratio
Compare China Wafer Level Csp Co Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
NVIDIA Corporation
NASDAQ:NVDA |
Semiconductors | 25.12% |
|
Broadcom Inc
NASDAQ:AVGO |
Semiconductors | 0.00% |
|
MediaTek Inc
TW:2454 |
Semiconductors | 1.67% |
|
Shannon Semiconductor Technology Co Ltd
SHE:300475 |
Semiconductors | 1.74% |
|
Sitime Corporation
NASDAQ:SITM |
Semiconductors | 61.15% |
|
Shanghai V-Test Semiconductor Tech Co. Ltd. A
SHG:688372 |
Semiconductors | 5.23% |
|
Airoha Technology Corp
TW:6526 |
Semiconductors | 0.08% |
|
Melexis NV
BR:MELE |
Semiconductors | 0.04% |
Annual Asset Resilience Ratio for China Wafer Level Csp Co Ltd (2014–2025)
The table below shows the annual Asset Resilience Ratio data for China Wafer Level Csp Co Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 14.50% | CN¥750.00 Million ≈ $109.75 Million |
CN¥5.17 Billion ≈ $756.91 Million |
-6.14pp |
| 2024-12-31 | 20.64% | CN¥980.00 Million ≈ $143.40 Million |
CN¥4.75 Billion ≈ $694.83 Million |
+20.19pp |
| 2021-12-31 | 0.45% | CN¥20.00 Million ≈ $2.93 Million |
CN¥4.46 Billion ≈ $652.94 Million |
-1.69pp |
| 2020-12-31 | 2.14% | CN¥80.00 Million ≈ $11.71 Million |
CN¥3.73 Billion ≈ $546.34 Million |
+0.41pp |
| 2019-12-31 | 1.73% | CN¥40.00 Million ≈ $5.85 Million |
CN¥2.31 Billion ≈ $337.70 Million |
-4.43pp |
| 2018-12-31 | 6.16% | CN¥140.00 Million ≈ $20.49 Million |
CN¥2.27 Billion ≈ $332.49 Million |
+0.02pp |
| 2017-12-31 | 6.15% | CN¥130.00 Million ≈ $19.02 Million |
CN¥2.12 Billion ≈ $309.52 Million |
+1.49pp |
| 2016-12-31 | 4.65% | CN¥90.00 Million ≈ $13.17 Million |
CN¥1.93 Billion ≈ $283.13 Million |
-5.36pp |
| 2015-12-31 | 10.01% | CN¥200.00 Million ≈ $29.27 Million |
CN¥2.00 Billion ≈ $292.44 Million |
+6.10pp |
| 2014-12-31 | 3.91% | CN¥80.00 Million ≈ $11.71 Million |
CN¥2.05 Billion ≈ $299.76 Million |
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About China Wafer Level Csp Co Ltd
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, an… Read more