China Wafer Level Csp Co Ltd - Asset Resilience Ratio

Latest as of December 2025: 14.50%

China Wafer Level Csp Co Ltd (603005) has an Asset Resilience Ratio of 14.50% as of December 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Read 603005 total liabilities for a breakdown of total debt and financial obligations.

Liquid Assets

CN¥750.00 Million
≈ $109.75 Million USD Cash + Short-term Investments

Total Assets

CN¥5.17 Billion
≈ $756.91 Million USD All company assets

Resilience Assessment

Moderate
Financial Resilience Level

Asset Resilience Ratio Trend (2014–2025)

This chart shows how China Wafer Level Csp Co Ltd's Asset Resilience Ratio has changed over time. See China Wafer Level Csp Co Ltd (603005) shareholders funds for net asset value and shareholders' equity analysis.

Liquid Assets Composition Over Time

This chart breaks down China Wafer Level Csp Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see market value of China Wafer Level Csp Co Ltd.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥750.00 Million 14.5%
Total Liquid Assets CN¥750.00 Million 14.50%

Asset Resilience Insights

  • Moderate Liquidity: China Wafer Level Csp Co Ltd has 14.50% of assets in liquid form.
  • While adequate for normal operations, this level may limit flexibility during economic stress.
  • The company has significant short-term investments, indicating active treasury management.

China Wafer Level Csp Co Ltd Industry Peers by Asset Resilience Ratio

Compare China Wafer Level Csp Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
NVIDIA Corporation
NASDAQ:NVDA
Semiconductors 25.12%
Broadcom Inc
NASDAQ:AVGO
Semiconductors 0.00%
MediaTek Inc
TW:2454
Semiconductors 1.67%
Shannon Semiconductor Technology Co Ltd
SHE:300475
Semiconductors 1.74%
Sitime Corporation
NASDAQ:SITM
Semiconductors 61.15%
Shanghai V-Test Semiconductor Tech Co. Ltd. A
SHG:688372
Semiconductors 5.23%
Airoha Technology Corp
TW:6526
Semiconductors 0.08%
Melexis NV
BR:MELE
Semiconductors 0.04%

Annual Asset Resilience Ratio for China Wafer Level Csp Co Ltd (2014–2025)

The table below shows the annual Asset Resilience Ratio data for China Wafer Level Csp Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2025-12-31 14.50% CN¥750.00 Million
≈ $109.75 Million
CN¥5.17 Billion
≈ $756.91 Million
-6.14pp
2024-12-31 20.64% CN¥980.00 Million
≈ $143.40 Million
CN¥4.75 Billion
≈ $694.83 Million
+20.19pp
2021-12-31 0.45% CN¥20.00 Million
≈ $2.93 Million
CN¥4.46 Billion
≈ $652.94 Million
-1.69pp
2020-12-31 2.14% CN¥80.00 Million
≈ $11.71 Million
CN¥3.73 Billion
≈ $546.34 Million
+0.41pp
2019-12-31 1.73% CN¥40.00 Million
≈ $5.85 Million
CN¥2.31 Billion
≈ $337.70 Million
-4.43pp
2018-12-31 6.16% CN¥140.00 Million
≈ $20.49 Million
CN¥2.27 Billion
≈ $332.49 Million
+0.02pp
2017-12-31 6.15% CN¥130.00 Million
≈ $19.02 Million
CN¥2.12 Billion
≈ $309.52 Million
+1.49pp
2016-12-31 4.65% CN¥90.00 Million
≈ $13.17 Million
CN¥1.93 Billion
≈ $283.13 Million
-5.36pp
2015-12-31 10.01% CN¥200.00 Million
≈ $29.27 Million
CN¥2.00 Billion
≈ $292.44 Million
+6.10pp
2014-12-31 3.91% CN¥80.00 Million
≈ $11.71 Million
CN¥2.05 Billion
≈ $299.76 Million
--
pp = percentage points

About China Wafer Level Csp Co Ltd

SHG:603005 China Semiconductors
Market Cap
$2.97 Billion
CN¥20.28 Billion CNY
Market Cap Rank
#4964 Global
#947 in China
Share Price
CN¥31.10
Change (1 day)
+1.47%
52-Week Range
CN¥25.64 - CN¥35.22
All Time High
CN¥358.01
About

China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, an… Read more