China Wafer Level Csp Co Ltd Asset Resilience Ratio
China Wafer Level Csp Co Ltd asset resilience ratio. China Wafer Level Csp Co Ltd (603005) has an Asset Resilience Ratio of 14.50% as of December 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See China Wafer Level Csp Co Ltd (603005) defensive interval to measure how many days the company can operate on defensive assets alone.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio of China Wafer Level Csp Co Ltd (2014–2025)
Asset resilience ratio of China Wafer Level Csp Co Ltd from 2014 to 2025. This chart shows how China Wafer Level Csp Co Ltd's Asset Resilience Ratio has changed over time. Read China Wafer Level Csp Co Ltd debt and liabilities for a breakdown of total debt and financial obligations.
Liquid Assets Composition Over Time
This chart breaks down China Wafer Level Csp Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see 603005 asset base.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 0% |
| Short-term Investments | CN¥750.00 Million | 14.5% |
| Total Liquid Assets | CN¥750.00 Million | 14.50% |
Asset Resilience Insights
- Moderate Liquidity: China Wafer Level Csp Co Ltd has 14.50% of assets in liquid form.
- While adequate for normal operations, this level may limit flexibility during economic stress.
- The company has significant short-term investments, indicating active treasury management.
China Wafer Level Csp Co Ltd Industry Peers by Asset Resilience Ratio
Compare China Wafer Level Csp Co Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
SK Square Co Ltd
KO:402340 |
Semiconductors | 1.99% |
|
United Microelectronics
NYSE:UMC |
Semiconductors | 4.21% |
|
Realtek Semiconductor Corp
TW:2379 |
Semiconductors | 38.13% |
|
Maxscend Microelectronics Co Ltd
SHE:300782 |
Semiconductors | 0.01% |
|
FADU Inc.
KQ:440110 |
Semiconductors | 0.47% |
|
Motorcomm Electronic Technology Co. Ltd. A
SHG:688515 |
Semiconductors | 24.81% |
|
Actions Technology Co Ltd
SHG:688049 |
Semiconductors | 18.63% |
|
Wuxi Chipown Micro-electronics Ltd
SHG:688508 |
Semiconductors | 57.54% |
China Wafer Level Csp Co Ltd Asset Resilience Ratio by Year (2014–2025)
China Wafer Level Csp Co Ltd asset resilience ratio by year from 2014 to 2025. The table below shows the annual Asset Resilience Ratio data for China Wafer Level Csp Co Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 14.50% | CN¥750.00 Million ≈ $109.75 Million |
CN¥5.17 Billion ≈ $756.91 Million |
-6.14pp |
| 2024-12-31 | 20.64% | CN¥980.00 Million ≈ $143.40 Million |
CN¥4.75 Billion ≈ $694.83 Million |
+20.19pp |
| 2021-12-31 | 0.45% | CN¥20.00 Million ≈ $2.93 Million |
CN¥4.46 Billion ≈ $652.94 Million |
-1.69pp |
| 2020-12-31 | 2.14% | CN¥80.00 Million ≈ $11.71 Million |
CN¥3.73 Billion ≈ $546.34 Million |
+0.41pp |
| 2019-12-31 | 1.73% | CN¥40.00 Million ≈ $5.85 Million |
CN¥2.31 Billion ≈ $337.70 Million |
-4.43pp |
| 2018-12-31 | 6.16% | CN¥140.00 Million ≈ $20.49 Million |
CN¥2.27 Billion ≈ $332.49 Million |
+0.02pp |
| 2017-12-31 | 6.15% | CN¥130.00 Million ≈ $19.02 Million |
CN¥2.12 Billion ≈ $309.52 Million |
+1.49pp |
| 2016-12-31 | 4.65% | CN¥90.00 Million ≈ $13.17 Million |
CN¥1.93 Billion ≈ $283.13 Million |
-5.36pp |
| 2015-12-31 | 10.01% | CN¥200.00 Million ≈ $29.27 Million |
CN¥2.00 Billion ≈ $292.44 Million |
+6.10pp |
| 2014-12-31 | 3.91% | CN¥80.00 Million ≈ $11.71 Million |
CN¥2.05 Billion ≈ $299.76 Million |
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About China Wafer Level Csp Co Ltd
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, an… Read more