China Wafer Level Csp Co Ltd (603005) - Cash Flow Conversion Efficiency

Latest as of September 2025: 0.032x

Based on the latest financial reports, China Wafer Level Csp Co Ltd (603005) has a cash flow conversion efficiency ratio of 0.032x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (CN¥145.37 Million ≈ $21.27 Million USD) by net assets (CN¥4.57 Billion ≈ $668.45 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.

China Wafer Level Csp Co Ltd - Cash Flow Conversion Efficiency Trend (2009–2025)

This chart illustrates how China Wafer Level Csp Co Ltd's cash flow conversion efficiency has evolved over time, based on yearly financial data. Read 603005 current and long-term liabilities for a breakdown of total debt and financial obligations.

China Wafer Level Csp Co Ltd Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of China Wafer Level Csp Co Ltd ranked by their cash flow conversion efficiency.

Company Cash Flow Conversion Efficiency
Sichuan Qiaoyuan Gas Co.Ltd
SHE:301286
0.005x
Northeast Securities Co Ltd
SHE:000686
-0.401x
SmartCentres Real Estate Investment Trust
TO:SRU-UN
0.014x
GRINM Semiconductor Materials Co. Ltd. A
SHG:688432
N/A
Shanxi Securities Co Ltd
SHE:002500
0.193x
Honeywell Automation India Limited
NSE:HONAUT
0.058x
Applied Opt
NASDAQ:AAOI
-0.051x
Hand Enterprise Solutions Co
SHE:300170
-0.011x

Annual Cash Flow Conversion Efficiency for China Wafer Level Csp Co Ltd (2009–2025)

The table below shows the annual cash flow conversion efficiency of China Wafer Level Csp Co Ltd from 2009 to 2025. For the full company profile with market capitalisation and key ratios, see market value of China Wafer Level Csp Co Ltd.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2025-12-31 CN¥4.64 Billion
≈ $679.42 Million
CN¥483.93 Million
≈ $70.81 Million
0.104x +26.30%
2024-12-31 CN¥4.31 Billion
≈ $630.32 Million
CN¥355.48 Million
≈ $52.02 Million
0.083x +11.31%
2023-12-31 CN¥4.12 Billion
≈ $603.11 Million
CN¥305.58 Million
≈ $44.72 Million
0.074x -23.91%
2022-12-31 CN¥4.02 Billion
≈ $588.33 Million
CN¥391.75 Million
≈ $57.33 Million
0.097x -37.30%
2021-12-31 CN¥3.95 Billion
≈ $577.31 Million
CN¥613.10 Million
≈ $89.72 Million
0.155x +8.05%
2020-12-31 CN¥3.36 Billion
≈ $492.33 Million
CN¥483.91 Million
≈ $70.81 Million
0.144x +113.85%
2019-12-31 CN¥1.99 Billion
≈ $290.51 Million
CN¥133.53 Million
≈ $19.54 Million
0.067x -56.64%
2018-12-31 CN¥1.88 Billion
≈ $275.59 Million
CN¥292.16 Million
≈ $42.75 Million
0.155x +18.55%
2017-12-31 CN¥1.79 Billion
≈ $262.27 Million
CN¥234.54 Million
≈ $34.32 Million
0.131x +98.22%
2016-12-31 CN¥1.67 Billion
≈ $245.00 Million
CN¥110.53 Million
≈ $16.17 Million
0.066x -47.36%
2015-12-31 CN¥1.65 Billion
≈ $241.13 Million
CN¥206.66 Million
≈ $30.24 Million
0.125x -17.70%
2014-12-31 CN¥1.57 Billion
≈ $230.08 Million
CN¥239.58 Million
≈ $35.06 Million
0.152x -43.87%
2013-12-31 CN¥750.78 Million
≈ $109.86 Million
CN¥203.82 Million
≈ $29.83 Million
0.271x +15.42%
2012-12-31 CN¥627.08 Million
≈ $91.76 Million
CN¥147.50 Million
≈ $21.58 Million
0.235x -15.39%
2011-12-31 CN¥519.18 Million
≈ $75.97 Million
CN¥144.33 Million
≈ $21.12 Million
0.278x -0.51%
2010-12-31 CN¥434.52 Million
≈ $63.58 Million
CN¥121.42 Million
≈ $17.77 Million
0.279x +18.88%
2009-12-31 CN¥327.30 Million
≈ $47.89 Million
CN¥76.93 Million
≈ $11.26 Million
0.235x --

About China Wafer Level Csp Co Ltd

SHG:603005 China Semiconductors
Market Cap
$2.97 Billion
CN¥20.28 Billion CNY
Market Cap Rank
#4964 Global
#947 in China
Share Price
CN¥31.10
Change (1 day)
+1.47%
52-Week Range
CN¥25.64 - CN¥35.22
All Time High
CN¥358.01
About

China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, an… Read more