China Wafer Level Csp Co Ltd (603005) - Cash Flow Conversion Efficiency
Based on the latest financial reports, China Wafer Level Csp Co Ltd (603005) has a cash flow conversion efficiency ratio of 0.032x as of September 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (CN¥145.37 Million ≈ $21.27 Million USD) by net assets (CN¥4.57 Billion ≈ $668.45 Million USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations. See 603005 defensive asset coverage days to measure how many days the company can operate on defensive assets alone.
China Wafer Level Csp Co Ltd - Cash Flow Conversion Efficiency Trend (2009–2025)
This chart illustrates how China Wafer Level Csp Co Ltd's cash flow conversion efficiency has evolved over time, based on yearly financial data.
China Wafer Level Csp Co Ltd Competitors by Cash Flow Conversion Efficiency
The table below lists competitors of China Wafer Level Csp Co Ltd ranked by their cash flow conversion efficiency.
| Company | Cash Flow Conversion Efficiency |
|---|---|
|
Cabot Corporation
NYSE:CBT
|
0.046x |
|
Belden Inc
NYSE:BDC
|
-0.015x |
|
Dianthus Therapeutics Inc.
NASDAQ:DNTH
|
-0.095x |
|
Shanghai Oriental Pearl Media Co Ltd
SHG:600637
|
0.010x |
|
BillionToOne, Inc. Class A Common Stock
NASDAQ:BLLN
|
0.031x |
|
Union Semiconductor (Hefei) Co. Ltd. A
SHG:688403
|
N/A |
|
Forehope Electronic (Ningbo) Co. Ltd. A
SHG:688362
|
N/A |
|
ShenZhen YUTO Packaging Technology Co Ltd
SHE:002831
|
0.052x |
Annual Cash Flow Conversion Efficiency for China Wafer Level Csp Co Ltd (2009–2025)
The table below shows the annual cash flow conversion efficiency of China Wafer Level Csp Co Ltd from 2009 to 2025. For the full company profile with market capitalisation and key ratios, see market value of China Wafer Level Csp Co Ltd.
| Year | Net Assets | Operating Cash Flow | Cash Flow Conversion Efficiency | Change |
|---|---|---|---|---|
| 2025-12-31 | CN¥4.64 Billion ≈ $679.42 Million |
CN¥483.93 Million ≈ $70.81 Million |
0.104x | +26.30% |
| 2024-12-31 | CN¥4.31 Billion ≈ $630.32 Million |
CN¥355.48 Million ≈ $52.02 Million |
0.083x | +11.31% |
| 2023-12-31 | CN¥4.12 Billion ≈ $603.11 Million |
CN¥305.58 Million ≈ $44.72 Million |
0.074x | -23.91% |
| 2022-12-31 | CN¥4.02 Billion ≈ $588.33 Million |
CN¥391.75 Million ≈ $57.33 Million |
0.097x | -37.30% |
| 2021-12-31 | CN¥3.95 Billion ≈ $577.31 Million |
CN¥613.10 Million ≈ $89.72 Million |
0.155x | +8.05% |
| 2020-12-31 | CN¥3.36 Billion ≈ $492.33 Million |
CN¥483.91 Million ≈ $70.81 Million |
0.144x | +113.85% |
| 2019-12-31 | CN¥1.99 Billion ≈ $290.51 Million |
CN¥133.53 Million ≈ $19.54 Million |
0.067x | -56.64% |
| 2018-12-31 | CN¥1.88 Billion ≈ $275.59 Million |
CN¥292.16 Million ≈ $42.75 Million |
0.155x | +18.55% |
| 2017-12-31 | CN¥1.79 Billion ≈ $262.27 Million |
CN¥234.54 Million ≈ $34.32 Million |
0.131x | +98.22% |
| 2016-12-31 | CN¥1.67 Billion ≈ $245.00 Million |
CN¥110.53 Million ≈ $16.17 Million |
0.066x | -47.36% |
| 2015-12-31 | CN¥1.65 Billion ≈ $241.13 Million |
CN¥206.66 Million ≈ $30.24 Million |
0.125x | -17.70% |
| 2014-12-31 | CN¥1.57 Billion ≈ $230.08 Million |
CN¥239.58 Million ≈ $35.06 Million |
0.152x | -43.87% |
| 2013-12-31 | CN¥750.78 Million ≈ $109.86 Million |
CN¥203.82 Million ≈ $29.83 Million |
0.271x | +15.42% |
| 2012-12-31 | CN¥627.08 Million ≈ $91.76 Million |
CN¥147.50 Million ≈ $21.58 Million |
0.235x | -15.39% |
| 2011-12-31 | CN¥519.18 Million ≈ $75.97 Million |
CN¥144.33 Million ≈ $21.12 Million |
0.278x | -0.51% |
| 2010-12-31 | CN¥434.52 Million ≈ $63.58 Million |
CN¥121.42 Million ≈ $17.77 Million |
0.279x | +18.88% |
| 2009-12-31 | CN¥327.30 Million ≈ $47.89 Million |
CN¥76.93 Million ≈ $11.26 Million |
0.235x | -- |
About China Wafer Level Csp Co Ltd
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, an… Read more