China Wafer Level Csp Co Ltd (603005) - Total Liabilities
Based on the latest financial reports, China Wafer Level Csp Co Ltd (603005) has total liabilities worth CN¥529.55 Million CNY (≈ $77.49 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
China Wafer Level Csp Co Ltd - Total Liabilities Trend (2009–2025)
This chart illustrates how China Wafer Level Csp Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See working capital to net assets of China Wafer Level Csp Co Ltd to evaluate short-term liquidity relative to the company's equity base.
China Wafer Level Csp Co Ltd Competitors by Total Liabilities
The table below lists competitors of China Wafer Level Csp Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Shanghai Oriental Pearl Media Co Ltd
SHG:600637
|
China | CN¥7.70 Billion |
|
Dianthus Therapeutics Inc.
NASDAQ:DNTH
|
USA | $37.52 Million |
|
Belden Inc
NYSE:BDC
|
USA | $2.18 Billion |
|
Cabot Corporation
NYSE:CBT
|
USA | $2.21 Billion |
|
BillionToOne, Inc. Class A Common Stock
NASDAQ:BLLN
|
USA | $195.11 Million |
|
Union Semiconductor (Hefei) Co. Ltd. A
SHG:688403
|
China | CN¥1.02 Billion |
|
Forehope Electronic (Ningbo) Co. Ltd. A
SHG:688362
|
China | CN¥11.75 Billion |
|
ShenZhen YUTO Packaging Technology Co Ltd
SHE:002831
|
China | CN¥10.67 Billion |
Liability Composition Analysis (2009–2025)
This chart breaks down China Wafer Level Csp Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 603005 market cap overview.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 6.36 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.11 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.10 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how China Wafer Level Csp Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for China Wafer Level Csp Co Ltd (2009–2025)
The table below shows the annual total liabilities of China Wafer Level Csp Co Ltd from 2009 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | CN¥529.55 Million ≈ $77.49 Million |
+20.12% |
| 2024-12-31 | CN¥440.84 Million ≈ $64.51 Million |
-37.26% |
| 2023-12-31 | CN¥702.59 Million ≈ $102.81 Million |
+23.96% |
| 2022-12-31 | CN¥566.77 Million ≈ $82.94 Million |
+9.67% |
| 2021-12-31 | CN¥516.79 Million ≈ $75.62 Million |
+40.02% |
| 2020-12-31 | CN¥369.10 Million ≈ $54.01 Million |
+14.46% |
| 2019-12-31 | CN¥322.47 Million ≈ $47.19 Million |
-17.08% |
| 2018-12-31 | CN¥388.88 Million ≈ $56.91 Million |
+20.42% |
| 2017-12-31 | CN¥322.93 Million ≈ $47.25 Million |
+23.94% |
| 2016-12-31 | CN¥260.54 Million ≈ $38.13 Million |
-25.70% |
| 2015-12-31 | CN¥350.65 Million ≈ $51.31 Million |
-26.37% |
| 2014-12-31 | CN¥476.20 Million ≈ $69.68 Million |
+53.34% |
| 2013-12-31 | CN¥310.54 Million ≈ $45.44 Million |
+481.11% |
| 2012-12-31 | CN¥53.44 Million ≈ $7.82 Million |
-32.18% |
| 2011-12-31 | CN¥78.80 Million ≈ $11.53 Million |
+52.30% |
| 2010-12-31 | CN¥51.74 Million ≈ $7.57 Million |
-30.30% |
| 2009-12-31 | CN¥74.23 Million ≈ $10.86 Million |
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About China Wafer Level Csp Co Ltd
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, an… Read more