Shennan Circuits Co Ltd Class A (002916) - Cash Flow Conversion Efficiency

Latest as of December 2025: 0.089x

Based on the latest financial reports, Shennan Circuits Co Ltd Class A (002916) has a cash flow conversion efficiency ratio of 0.089x as of December 2025. Cash flow conversion efficiency measures how effectively a company's net assets (equity) generate operating cash flow. It is calculated by dividing operating cash flow (CN¥1.52 Billion ≈ $223.04 Million USD) by net assets (CN¥17.18 Billion ≈ $2.51 Billion USD). A higher ratio indicates that the company is more efficient at using its equity to generate cash flow from its core operations.

Shennan Circuits Co Ltd Class A - Cash Flow Conversion Efficiency Trend (2007–2025)

This chart illustrates how Shennan Circuits Co Ltd Class A's cash flow conversion efficiency has evolved over time, based on yearly financial data. Read Shennan Circuits Co Ltd Class A debt and liabilities for a breakdown of total debt and financial obligations.

Shennan Circuits Co Ltd Class A Competitors by Cash Flow Conversion Efficiency

The table below lists competitors of Shennan Circuits Co Ltd Class A ranked by their cash flow conversion efficiency.

Company Cash Flow Conversion Efficiency
Copart Inc
NASDAQ:CPRT
0.013x
Orix Corp Ads
F:OIXA
0.068x
Medline Inc. Class A Common Stock
NASDAQ:MDLN
0.012x
Ping An Bank Co Ltd
SHE:000001
0.198x
BeiGene, Ltd.
NASDAQ:ONC
0.096x
FUJITSU LTD. ADR 5/1
F:FUJA
N/A
SUMITOMO CORP. SP. ADR 1
F:SUMB
N/A
Transurban Group
AU:TCL
0.124x

Annual Cash Flow Conversion Efficiency for Shennan Circuits Co Ltd Class A (2007–2025)

The table below shows the annual cash flow conversion efficiency of Shennan Circuits Co Ltd Class A from 2007 to 2025. For the full company profile with market capitalisation and key ratios, see market value of Shennan Circuits Co Ltd Class A.

Year Net Assets Operating Cash Flow Cash Flow Conversion Efficiency Change
2025-12-31 CN¥17.18 Billion
≈ $2.51 Billion
CN¥3.84 Billion
≈ $561.67 Million
0.223x +9.72%
2024-12-31 CN¥14.65 Billion
≈ $2.14 Billion
CN¥2.98 Billion
≈ $436.39 Million
0.204x +3.70%
2023-12-31 CN¥13.19 Billion
≈ $1.93 Billion
CN¥2.59 Billion
≈ $378.89 Million
0.196x -24.33%
2022-12-31 CN¥12.26 Billion
≈ $1.79 Billion
CN¥3.18 Billion
≈ $465.31 Million
0.259x -5.60%
2021-12-31 CN¥8.52 Billion
≈ $1.25 Billion
CN¥2.34 Billion
≈ $342.68 Million
0.275x +13.67%
2020-12-31 CN¥7.44 Billion
≈ $1.09 Billion
CN¥1.80 Billion
≈ $263.40 Million
0.242x -4.21%
2019-12-31 CN¥5.00 Billion
≈ $732.08 Million
CN¥1.26 Billion
≈ $184.80 Million
0.252x +7.02%
2018-12-31 CN¥3.73 Billion
≈ $545.43 Million
CN¥879.13 Million
≈ $128.64 Million
0.236x -16.60%
2017-12-31 CN¥3.17 Billion
≈ $463.59 Million
CN¥896.00 Million
≈ $131.11 Million
0.283x -44.37%
2016-12-31 CN¥1.58 Billion
≈ $230.89 Million
CN¥802.24 Million
≈ $117.39 Million
0.508x +20.38%
2015-12-31 CN¥1.36 Billion
≈ $198.46 Million
CN¥572.82 Million
≈ $83.82 Million
0.422x +40.58%
2014-12-31 CN¥1.56 Billion
≈ $228.65 Million
CN¥469.47 Million
≈ $68.70 Million
0.300x -33.64%
2013-12-31 CN¥1.21 Billion
≈ $177.04 Million
CN¥547.72 Million
≈ $80.15 Million
0.453x +375.91%
2011-12-31 CN¥923.44 Million
≈ $135.13 Million
CN¥87.84 Million
≈ $12.85 Million
0.095x -66.05%
2010-12-31 CN¥832.63 Million
≈ $121.84 Million
CN¥233.30 Million
≈ $34.14 Million
0.280x +12.45%
2009-12-31 CN¥670.40 Million
≈ $98.10 Million
CN¥167.05 Million
≈ $24.45 Million
0.249x -12.91%
2008-12-31 CN¥554.70 Million
≈ $81.17 Million
CN¥158.71 Million
≈ $23.22 Million
0.286x +19.04%
2007-12-31 CN¥466.90 Million
≈ $68.32 Million
CN¥112.21 Million
≈ $16.42 Million
0.240x --

About Shennan Circuits Co Ltd Class A

SHE:002916 China Electronic Components
Market Cap
$31.93 Billion
CN¥218.23 Billion CNY
Market Cap Rank
#828 Global
#55 in China
Share Price
CN¥320.37
Change (1 day)
-0.97%
52-Week Range
CN¥84.26 - CN¥323.50
All Time High
CN¥323.50
About

Shennan Circuits Co., Ltd. engages in the design, manufacture, and sale of printed circuit boards, packaging substrates, and electronic assemblies in China and internationally. It operates through Packaging Substrates, Packaging Substrates, and Distribution Substrates segments. The company provides RF and microwave, thermal management, miniaturization, and chip package substrate solutions. It als… Read more