Shennan Circuits Co Ltd Class A (002916) - Total Assets
Based on the latest financial reports, Shennan Circuits Co Ltd Class A (002916) holds total assets worth CN¥30.58 Billion CNY (≈ $4.48 Billion USD) as of December 2025. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. See net assets of Shennan Circuits Co Ltd Class A for net asset value and shareholders' equity analysis.
Shennan Circuits Co Ltd Class A - Total Assets Trend (2007–2025)
This chart illustrates how Shennan Circuits Co Ltd Class A's total assets have evolved over time, based on quarterly financial data.
Shennan Circuits Co Ltd Class A - Asset Composition Analysis
Current Asset Composition (December 2025)
Shennan Circuits Co Ltd Class A's total assets of CN¥30.58 Billion consist of 44.7% current assets and 55.4% non-current assets.
| Asset Category | Amount (CNY) | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 3.3% |
| Accounts Receivable | CN¥6.75 Billion | 22.1% |
| Inventory | CN¥5.14 Billion | 16.8% |
| Property, Plant & Equipment | CN¥0.00 | 0.0% |
| Intangible Assets | CN¥638.63 Million | 2.1% |
| Goodwill | CN¥0.00 | 0.0% |
Asset Composition Trend (2007–2025)
This chart illustrates how Shennan Circuits Co Ltd Class A's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see Shennan Circuits Co Ltd Class A market capitalisation.
Key Asset Composition Facts
- Current vs. Non-Current Assets: Shennan Circuits Co Ltd Class A's current assets represent 44.7% of total assets in 2025, an increase from 37.5% in 2007.
- Cash Position: Cash and equivalents constituted 3.3% of total assets in 2025, down from 14.4% in 2007.
- Tangible vs. Intangible: Intangible assets (including goodwill) make up 2.0% of total assets, an increase from 1.0% in 2007.
- Asset Diversification: The largest asset category is accounts receivable at 22.1% of total assets.
Shennan Circuits Co Ltd Class A Competitors by Total Assets
Key competitors of Shennan Circuits Co Ltd Class A based on total assets are shown below.
| Company | Country | Total Assets |
|---|---|---|
|
Gold Circuit Electronics Ltd
TW:2368
|
Taiwan | NT$61.50 Billion |
|
Lingyi iTech Guangdong Co
SHE:002600
|
China | CN¥58.39 Billion |
|
Shenzhen Sunway Communication
SHE:300136
|
China | CN¥13.57 Billion |
|
Taiwan Union Technology
TWO:6274
|
Taiwan | NT$39.74 Billion |
|
Joulwatt Technology Co. Ltd. A
SHG:688141
|
China | CN¥5.20 Billion |
|
TDG Holding Co Ltd
SHG:600330
|
China | CN¥11.61 Billion |
|
Goldenmax International Technology Ltd
SHE:002636
|
China | CN¥6.29 Billion |
|
Xiamen Faratronic Co Ltd
SHG:600563
|
China | CN¥8.73 Billion |
Shennan Circuits Co Ltd Class A - Liquidity and Working Capital Analysis
Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.
Key Liquidity Metrics
| Metric | Current | 1 Year Ago | 5 Years Ago |
|---|---|---|---|
| Current Ratio | 1.36 | 1.45 | 1.27 |
| Quick Ratio | 0.85 | 1.00 | 0.72 |
| Cash Ratio | 0.00 | 0.00 | 0.00 |
| Working Capital | CN¥3.63 Billion | CN¥3.36 Billion | CN¥1.21 Billion |
Shennan Circuits Co Ltd Class A - Advanced Valuation Insights
This section examines the relationship between Shennan Circuits Co Ltd Class A's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.
Key Valuation Metrics
| Current Price-to-Book Ratio | 9.43 |
| Latest Market Cap to Assets Ratio | 1.02 |
| Asset Growth Rate (YoY) | 20.9% |
| Total Assets | CN¥30.58 Billion |
| Market Capitalization | $31.15 Billion USD |
Valuation Analysis
Above Book Valuation: The market values Shennan Circuits Co Ltd Class A's assets above their book value (1.02x), reflecting positive investor sentiment about the company's future prospects.
Rapid Asset Growth: Shennan Circuits Co Ltd Class A's assets grew by 20.9% over the past year, indicating significant expansion of the company's resource base.
Annual Total Assets for Shennan Circuits Co Ltd Class A (2007–2025)
The table below shows the annual total assets of Shennan Circuits Co Ltd Class A from 2007 to 2025.
| Year | Total Assets | Change |
|---|---|---|
| 2025-12-31 | CN¥30.58 Billion ≈ $4.48 Billion |
+20.87% |
| 2024-12-31 | CN¥25.30 Billion ≈ $3.70 Billion |
+11.92% |
| 2023-12-31 | CN¥22.61 Billion ≈ $3.31 Billion |
+9.04% |
| 2022-12-31 | CN¥20.73 Billion ≈ $3.03 Billion |
+23.46% |
| 2021-12-31 | CN¥16.79 Billion ≈ $2.46 Billion |
+19.39% |
| 2020-12-31 | CN¥14.06 Billion ≈ $2.06 Billion |
+15.10% |
| 2019-12-31 | CN¥12.22 Billion ≈ $1.79 Billion |
+43.26% |
| 2018-12-31 | CN¥8.53 Billion ≈ $1.25 Billion |
+14.59% |
| 2017-12-31 | CN¥7.44 Billion ≈ $1.09 Billion |
+44.81% |
| 2016-12-31 | CN¥5.14 Billion ≈ $752.14 Million |
+7.76% |
| 2015-12-31 | CN¥4.77 Billion ≈ $697.99 Million |
+17.72% |
| 2014-12-31 | CN¥4.05 Billion ≈ $592.94 Million |
+22.98% |
| 2013-12-31 | CN¥3.29 Billion ≈ $482.13 Million |
+26.41% |
| 2011-12-31 | CN¥2.61 Billion ≈ $381.40 Million |
+20.23% |
| 2010-12-31 | CN¥2.17 Billion ≈ $317.23 Million |
+40.64% |
| 2009-12-31 | CN¥1.54 Billion ≈ $225.56 Million |
+16.84% |
| 2008-12-31 | CN¥1.32 Billion ≈ $193.05 Million |
+24.13% |
| 2007-12-31 | CN¥1.06 Billion ≈ $155.52 Million |
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About Shennan Circuits Co Ltd Class A
Shennan Circuits Co., Ltd. engages in the design, manufacture, and sale of printed circuit boards, packaging substrates, and electronic assemblies in China and internationally. It operates through Packaging Substrates, Packaging Substrates, and Distribution Substrates segments. The company provides RF and microwave, thermal management, miniaturization, and chip package substrate solutions. It als… Read more