Shennan Circuits Co Ltd Class A (002916) - Total Assets
Based on the latest financial reports, Shennan Circuits Co Ltd Class A (002916) holds total assets worth CN¥40.74 Billion CNY (≈ $5.96 Billion USD) as of June 2026. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments.
Shennan Circuits Co Ltd Class A - Total Assets Trend (2007–2025)
This chart illustrates how Shennan Circuits Co Ltd Class A's total assets have evolved over time, based on quarterly financial data. Also see 002916 market cap for the company's overall valuation and market capitalisation.
Shennan Circuits Co Ltd Class A - Asset Composition Analysis
Current Asset Composition (December 2025)
Shennan Circuits Co Ltd Class A's total assets of CN¥40.74 Billion consist of 44.7% current assets and 55.4% non-current assets. Review debt load of Shennan Circuits Co Ltd Class A to assess the company's total debt and financial obligations.
| Asset Category | Amount (CNY) | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 3.3% |
| Accounts Receivable | CN¥6.75 Billion | 22.1% |
| Inventory | CN¥5.14 Billion | 16.8% |
| Property, Plant & Equipment | CN¥0.00 | 0.0% |
| Intangible Assets | CN¥638.63 Million | 2.1% |
| Goodwill | CN¥0.00 | 0.0% |
Asset Composition Trend (2007–2025)
This chart illustrates how Shennan Circuits Co Ltd Class A's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. See 002916 stock price and chart for real-time trading data and today's change.
Key Asset Composition Facts
- Current vs. Non-Current Assets: Shennan Circuits Co Ltd Class A's current assets represent 44.7% of total assets in 2025, an increase from 37.5% in 2007.
- Cash Position: Cash and equivalents constituted 3.3% of total assets in 2025, down from 14.4% in 2007.
- Tangible vs. Intangible: Intangible assets (including goodwill) make up 2.0% of total assets, an increase from 1.0% in 2007.
- Asset Diversification: The largest asset category is accounts receivable at 22.1% of total assets.
Shennan Circuits Co Ltd Class A Competitors by Total Assets
Key competitors of Shennan Circuits Co Ltd Class A based on total assets are shown below.
| Company | Country | Total Assets |
|---|---|---|
|
Founder Technology Group Co Ltd
SHG:600601
|
China | CN¥8.88 Billion |
|
Shenzhen Sunway Communication
SHE:300136
|
China | CN¥14.13 Billion |
|
Gold Circuit Electronics Ltd
TW:2368
|
Taiwan | NT$84.38 Billion |
|
Plexus Corp
NASDAQ:PLXS
|
USA | $3.19 Billion |
|
Guangdong Fenghua Advanced Technology Holding Co Ltd
SHE:000636
|
China | CN¥16.69 Billion |
|
Poco Holding Co Ltd
SHE:300811
|
China | CN¥3.80 Billion |
|
Aoshikang Technology Co Ltd Class A
SHE:002913
|
China | CN¥9.62 Billion |
|
WG Tech JiangXi Co Ltd
SHG:603773
|
China | CN¥4.43 Billion |
Shennan Circuits Co Ltd Class A - Liquidity and Working Capital Analysis
Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.
Key Liquidity Metrics
| Metric | Current | 1 Year Ago | 5 Years Ago |
|---|---|---|---|
| Current Ratio | 1.20 | 1.41 | 1.24 |
| Quick Ratio | 0.71 | 0.92 | 0.73 |
| Cash Ratio | 0.00 | 0.00 | 0.00 |
| Working Capital | CN¥3.22 Billion | CN¥3.37 Billion | CN¥1.40 Billion |
Shennan Circuits Co Ltd Class A - Advanced Valuation Insights
This section examines the relationship between Shennan Circuits Co Ltd Class A's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.
Key Valuation Metrics
| Current Price-to-Book Ratio | 14.48 |
| Latest Market Cap to Assets Ratio | 1.27 |
| Asset Growth Rate (YoY) | 20.9% |
| Total Assets | CN¥30.58 Billion |
| Market Capitalization | $38.85 Billion USD |
Valuation Analysis
Above Book Valuation: The market values Shennan Circuits Co Ltd Class A's assets above their book value (1.27x), reflecting positive investor sentiment about the company's future prospects.
Rapid Asset Growth: Shennan Circuits Co Ltd Class A's assets grew by 20.9% over the past year, indicating significant expansion of the company's resource base.
Annual Total Assets for Shennan Circuits Co Ltd Class A (2007–2025)
The table below shows the annual total assets of Shennan Circuits Co Ltd Class A from 2007 to 2025.
| Year | Total Assets | Change |
|---|---|---|
| 2025-12-31 | CN¥30.58 Billion ≈ $4.48 Billion |
+20.87% |
| 2024-12-31 | CN¥25.30 Billion ≈ $3.70 Billion |
+11.92% |
| 2023-12-31 | CN¥22.61 Billion ≈ $3.31 Billion |
+9.04% |
| 2022-12-31 | CN¥20.73 Billion ≈ $3.03 Billion |
+23.46% |
| 2021-12-31 | CN¥16.79 Billion ≈ $2.46 Billion |
+19.39% |
| 2020-12-31 | CN¥14.06 Billion ≈ $2.06 Billion |
+15.10% |
| 2019-12-31 | CN¥12.22 Billion ≈ $1.79 Billion |
+43.26% |
| 2018-12-31 | CN¥8.53 Billion ≈ $1.25 Billion |
+14.59% |
| 2017-12-31 | CN¥7.44 Billion ≈ $1.09 Billion |
+44.81% |
| 2016-12-31 | CN¥5.14 Billion ≈ $752.14 Million |
+7.76% |
| 2015-12-31 | CN¥4.77 Billion ≈ $697.99 Million |
+17.72% |
| 2014-12-31 | CN¥4.05 Billion ≈ $592.94 Million |
+22.98% |
| 2013-12-31 | CN¥3.29 Billion ≈ $482.13 Million |
+26.41% |
| 2011-12-31 | CN¥2.61 Billion ≈ $381.40 Million |
+20.23% |
| 2010-12-31 | CN¥2.17 Billion ≈ $317.23 Million |
+40.64% |
| 2009-12-31 | CN¥1.54 Billion ≈ $225.56 Million |
+16.84% |
| 2008-12-31 | CN¥1.32 Billion ≈ $193.05 Million |
+24.13% |
| 2007-12-31 | CN¥1.06 Billion ≈ $155.52 Million |
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About Shennan Circuits Co Ltd Class A
Shennan Circuits Co., Ltd. engages in the design, manufacture, and sale of printed circuit boards, packaging substrates, and electronic assemblies in China and internationally. It operates through Packaging Substrates, Packaging Substrates, and Distribution Substrates segments. The company provides RF and microwave, thermal management, miniaturization, and chip package substrate solutions. It als… Read more