Shennan Circuits Co Ltd Class A Asset Resilience Ratio

Latest as of September 2024: 1.57%

Shennan Circuits Co Ltd Class A asset resilience ratio. Shennan Circuits Co Ltd Class A (002916) has an Asset Resilience Ratio of 1.57% as of September 2024. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See operational self-sufficiency of Shennan Circuits Co Ltd Class A to measure how many days the company can operate on defensive assets alone.

Liquid Assets

CN¥390.04 Million
≈ $57.07 Million USD Cash + Short-term Investments

Total Assets

CN¥24.78 Billion
≈ $3.63 Billion USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio of Shennan Circuits Co Ltd Class A (2018–2023)

Asset resilience ratio of Shennan Circuits Co Ltd Class A from 2018 to 2023. This chart shows how Shennan Circuits Co Ltd Class A's Asset Resilience Ratio has changed over time. Read 002916 current and long-term liabilities for a breakdown of total debt and financial obligations.

Liquid Assets Composition Over Time

This chart breaks down Shennan Circuits Co Ltd Class A's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see Shennan Circuits Co Ltd Class A assets under control.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥390.04 Million 1.57%
Total Liquid Assets CN¥390.04 Million 1.57%

Asset Resilience Insights

  • Limited Liquidity: Shennan Circuits Co Ltd Class A maintains only 1.57% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Shennan Circuits Co Ltd Class A Industry Peers by Asset Resilience Ratio

Compare Shennan Circuits Co Ltd Class A's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Luxshare Precision Industry Co Ltd
SHE:002475
Electronic Components 1.70%
Guizhou Space Appliance Co Ltd
SHE:002025
Electronic Components -0.32%
Jiangsu Lettall Electronic Co Ltd
SHG:603629
Electronic Components 0.07%
Xiamen Leading Optics Co Ltd
SHG:605118
Electronic Components 4.95%
Wuhu Token Sciences
SHE:300088
Electronic Components 0.69%
Co-Tech Development
TWO:8358
Electronic Components 0.16%
TXC Corp
TW:3042
Electronic Components 6.15%
Holitech Technology Co Ltd
SHE:002217
Electronic Components 0.87%

Shennan Circuits Co Ltd Class A Asset Resilience Ratio by Year (2018–2023)

Shennan Circuits Co Ltd Class A asset resilience ratio by year from 2018 to 2023. The table below shows the annual Asset Resilience Ratio data for Shennan Circuits Co Ltd Class A.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2023-12-31 2.61% CN¥590.31 Million
≈ $86.38 Million
CN¥22.61 Billion
≈ $3.31 Billion
+1.30pp
2022-12-31 1.31% CN¥270.92 Million
≈ $39.64 Million
CN¥20.73 Billion
≈ $3.03 Billion
+1.30pp
2021-12-31 0.00% CN¥814.49K
≈ $119.19K
CN¥16.79 Billion
≈ $2.46 Billion
-1.17pp
2020-12-31 1.17% CN¥165.10 Million
≈ $24.16 Million
CN¥14.06 Billion
≈ $2.06 Billion
-0.88pp
2018-12-31 2.05% CN¥175.00 Million
≈ $25.61 Million
CN¥8.53 Billion
≈ $1.25 Billion
--
pp = percentage points

About Shennan Circuits Co Ltd Class A

SHE:002916 China Electronic Components
Market Cap
$23.22 Billion
CN¥158.71 Billion CNY
Market Cap Rank
#1111 Global
#66 in China
Share Price
CN¥233.00
Change (1 day)
-8.20%
52-Week Range
CN¥187.41 - CN¥457.90
All Time High
CN¥457.90
About

Shennan Circuits Co., Ltd. engages in the design, manufacture, and sale of printed circuit boards, packaging substrates, and electronic assemblies in China and internationally. It operates through Packaging Substrates, Packaging Substrates, and Distribution Substrates segments. The company provides RF and microwave, thermal management, miniaturization, and chip package substrate solutions. It als… Read more