Hua Hong Semiconductor Limited (1HH) — Cash Flow-to-Debt Ratio

Latest as of December 2023: 0.07x

Hua Hong Semiconductor Limited (1HH) has a Cash Flow-to-Debt Ratio of 0.07x as of December 2023, meaning its operating cash flow of €196.55 Million could theoretically repay 0% of its total liabilities (€2.93 Billion) in one year. See financial agility of Hua Hong Semiconductor Limited to measure the company's free cash flow as a share of total liabilities.

CF-to-Debt Ratio

0.07x
Operating CF / Total Liabilities

Operating Cash Flow

€196.55 Million
EUR

Total Liabilities

€2.93 Billion
EUR

Data as of

Dec 2023
Most recent filing

Hua Hong Semiconductor Limited Cash Flow-to-Debt Ratio (2016–2025)

Historical debt coverage capacity for Hua Hong Semiconductor Limited across 10 annual periods. For the full cash flow conversion analysis, see 1HH cash flow conversion.

Annual Cash Flow-to-Debt Ratio for Hua Hong Semiconductor Limited (2016–2025)

Year-by-year debt coverage analysis for Hua Hong Semiconductor Limited. Check Hua Hong Semiconductor Limited earnings quality ratio to evaluate the quality of earnings relative to operating cash generation.

Year CF-to-Debt Ratio Operating CF (EUR) Total Liabilities YoY Change
2025 0.12x €649.99 Million €5.29 Billion ▼ -6.2%
2024 0.13x €459.50 Million €3.51 Billion ▼ -40.2%
2023 0.22x €641.70 Million €2.93 Billion ▼ -14.8%
2022 0.26x €750.87 Million €2.92 Billion ▲ +24.9%
2021 0.21x €518.47 Million €2.52 Billion ▼ -7.1%
2020 0.22x €269.11 Million €1.21 Billion ▼ -27.8%
2019 0.31x €162.93 Million €530.71 Million ▼ -58.2%
2018 0.73x €274.40 Million €373.94 Million ▲ +8.8%
2017 0.67x €258.30 Million €383.10 Million ▲ +7.5%
2016 0.63x €211.91 Million €337.98 Million
Cash Flow-to-Debt Ratio = Operating Cash Flow / Total Liabilities. Higher is better for debt service capacity.