Hua Hong Semiconductor Limited (1HH) — Cash Flow-to-Debt Ratio

Latest as of December 2023: 0.07x

Hua Hong Semiconductor Limited (1HH) has a Cash Flow-to-Debt Ratio of 0.07x as of December 2023, meaning its operating cash flow of €196.55 Million could theoretically repay 0% of its total liabilities (€2.93 Billion) in one year. See 1HH free cash flow to operating cash ratio to measure how efficiently the company converts operating cash flow to free cash.

CF-to-Debt Ratio

0.07x
Operating CF / Total Liabilities

Operating Cash Flow

€196.55 Million
EUR

Total Liabilities

€2.93 Billion
EUR

Data as of

Dec 2023
Most recent filing

Hua Hong Semiconductor Limited Cash Flow-to-Debt Ratio (2016–2025)

Historical debt coverage capacity for Hua Hong Semiconductor Limited across 10 annual periods. Also explore 1HH shareholders equity momentum to track the company's year-over-year net asset growth rate.

Annual Cash Flow-to-Debt Ratio for Hua Hong Semiconductor Limited (2016–2025)

Year-by-year debt coverage analysis for Hua Hong Semiconductor Limited. For market capitalisation and broader financial context, see Hua Hong Semiconductor Limited (1HH) market capitalisation.

Year CF-to-Debt Ratio Operating CF (EUR) Total Liabilities YoY Change
2025 0.12x €649.99 Million €5.29 Billion ▼ -6.2%
2024 0.13x €459.50 Million €3.51 Billion ▼ -40.2%
2023 0.22x €641.70 Million €2.93 Billion ▼ -14.8%
2022 0.26x €750.87 Million €2.92 Billion ▲ +24.9%
2021 0.21x €518.47 Million €2.52 Billion ▼ -7.1%
2020 0.22x €269.11 Million €1.21 Billion ▼ -27.8%
2019 0.31x €162.93 Million €530.71 Million ▼ -58.2%
2018 0.73x €274.40 Million €373.94 Million ▲ +8.8%
2017 0.67x €258.30 Million €383.10 Million ▲ +7.5%
2016 0.63x €211.91 Million €337.98 Million
Cash Flow-to-Debt Ratio = Operating Cash Flow / Total Liabilities. Higher is better for debt service capacity.