HPQ SILICON INC. (O08) — Cash Flow-to-Debt Ratio
HPQ SILICON INC. (O08) has a Cash Flow-to-Debt Ratio of -0.61x as of December 2025, meaning its operating cash flow of €-2.05 Million could theoretically repay -1% of its total liabilities (€3.34 Million) in one year. See HPQ SILICON INC. working capital to net assets to evaluate short-term liquidity relative to the company's equity base.
CF-to-Debt Ratio
Operating Cash Flow
Total Liabilities
Data as of
HPQ SILICON INC. Cash Flow-to-Debt Ratio (2021–2025)
Historical debt coverage capacity for HPQ SILICON INC. across 5 annual periods. Also explore O08 net asset momentum to track the company's year-over-year net asset growth rate.
Annual Cash Flow-to-Debt Ratio for HPQ SILICON INC. (2021–2025)
Year-by-year debt coverage analysis for HPQ SILICON INC.. For market capitalisation and broader financial context, see O08 market cap.
| Year | CF-to-Debt Ratio | Operating CF (EUR) | Total Liabilities | YoY Change |
|---|---|---|---|---|
| 2025 | -0.93x | €-3.11 Million | €3.34 Million | ▼ -375.5% |
| 2024 | -0.20x | €-1.69 Million | €8.66 Million | ▼ -11.8% |
| 2023 | -0.17x | €-1.26 Million | €7.23 Million | ▲ +74.6% |
| 2022 | -0.69x | €-4.88 Million | €7.09 Million | ▲ +3.2% |
| 2021 | -0.71x | €-2.41 Million | €3.39 Million | — |