HPQ SILICON INC. Cash Flow-to-Debt Ratio
HPQ SILICON INC. cash flow-to-debt ratio. HPQ SILICON INC. (O08) has a Cash Flow-to-Debt Ratio of -0.61x as of December 2025, meaning its operating cash flow of €-2.05 Million could theoretically repay -1% of its total liabilities (€3.34 Million) in one year. Check earnings quality score of HPQ SILICON INC. to evaluate the quality of earnings relative to operating cash generation.
CF-to-Debt Ratio
Operating Cash Flow
Total Liabilities
Data as of
Cash Flow-to-Debt Ratio of HPQ SILICON INC. (2021–2025)
Cash flow-to-debt ratio of HPQ SILICON INC. from 2021 to 2025. Historical debt coverage capacity for HPQ SILICON INC. across 5 annual periods. Also explore O08 shareholders equity momentum to track the company's year-over-year net asset growth rate.
HPQ SILICON INC. Cash Flow-to-Debt Ratio by Year (2021–2025)
HPQ SILICON INC. cash flow-to-debt ratio by year from 2021 to 2025. Year-by-year debt coverage analysis for HPQ SILICON INC.. For the full cash flow conversion analysis, see HPQ SILICON INC. cash conversion from operations.
| Year | CF-to-Debt Ratio | Operating CF (EUR) | Total Liabilities | YoY Change |
|---|---|---|---|---|
| 2025 | -0.93x | €-3.11 Million | €3.34 Million | ▼ -375.5% |
| 2024 | -0.20x | €-1.69 Million | €8.66 Million | ▼ -11.8% |
| 2023 | -0.17x | €-1.26 Million | €7.23 Million | ▲ +74.6% |
| 2022 | -0.69x | €-4.88 Million | €7.09 Million | ▲ +3.2% |
| 2021 | -0.71x | €-2.41 Million | €3.39 Million | — |