Wireless Power Amplifier Module Inc (332570) — Cash Flow-to-Debt Ratio

Latest as of September 2025: 0.13x

Wireless Power Amplifier Module Inc (332570) has a Cash Flow-to-Debt Ratio of 0.13x as of September 2025, meaning its operating cash flow of ₩12.56 Billion could theoretically repay 0% of its total liabilities (₩93.06 Billion) in one year. See Wireless Power Amplifier Module Inc free cash flow generation to measure how efficiently the company converts operating cash flow to free cash.

CF-to-Debt Ratio

0.13x
Operating CF / Total Liabilities

Operating Cash Flow

₩12.56 Billion
KRW

Total Liabilities

₩93.06 Billion
KRW

Data as of

Sep 2025
Most recent filing

Wireless Power Amplifier Module Inc Cash Flow-to-Debt Ratio (2017–2024)

Historical debt coverage capacity for Wireless Power Amplifier Module Inc across 8 annual periods. Also explore Wireless Power Amplifier Module Inc (332570) net asset momentum to track the company's year-over-year net asset growth rate.

Annual Cash Flow-to-Debt Ratio for Wireless Power Amplifier Module Inc (2017–2024)

Year-by-year debt coverage analysis for Wireless Power Amplifier Module Inc. For market capitalisation and broader financial context, see 332570 market cap overview.

Year CF-to-Debt Ratio Operating CF (KRW) Total Liabilities YoY Change
2024 0.45x ₩35.32 Billion ₩78.41 Billion ▲ +349.6%
2023 0.10x ₩5.99 Billion ₩59.81 Billion ▼ -74.8%
2022 0.40x ₩22.53 Billion ₩56.67 Billion ▲ +141.4%
2021 -0.96x ₩-22.43 Billion ₩23.37 Billion ▼ -10.6%
2020 -0.87x ₩-6.91 Billion ₩7.97 Billion ▼ -155.6%
2019 1.56x ₩12.69 Billion ₩8.14 Billion ▲ +356.5%
2018 -0.61x ₩-4.03 Billion ₩6.64 Billion ▼ -2126.4%
2017 0.03x ₩776.97 Million ₩25.90 Billion
Cash Flow-to-Debt Ratio = Operating Cash Flow / Total Liabilities. Higher is better for debt service capacity.