GRINM Semiconductor Materials Co. Ltd. A Cash Flow-to-Debt Ratio

Latest as of December 2024: 0.40x

GRINM Semiconductor Materials Co. Ltd. A cash flow-to-debt ratio. GRINM Semiconductor Materials Co. Ltd. A (688432) has a Cash Flow-to-Debt Ratio of 0.40x as of December 2024, meaning its operating cash flow of CN¥229.37 Million could theoretically repay 0% of its total liabilities (CN¥570.82 Million) in one year. Check GRINM Semiconductor Materials Co. Ltd. A cash flow quality index to evaluate the quality of earnings relative to operating cash generation.

CF-to-Debt Ratio

0.40x
Operating CF / Total Liabilities

Operating Cash Flow

CN¥229.37 Million
CNY

Total Liabilities

CN¥570.82 Million
CNY

Data as of

Dec 2024
Most recent filing

Cash Flow-to-Debt Ratio of GRINM Semiconductor Materials Co. Ltd. A (2020–2024)

Cash flow-to-debt ratio of GRINM Semiconductor Materials Co. Ltd. A from 2020 to 2024. Historical debt coverage capacity for GRINM Semiconductor Materials Co. Ltd. A across 5 annual periods. Check 688432 total capital reinvestment ratio to assess the company's total reinvestment commitment from operating cash flow.

GRINM Semiconductor Materials Co. Ltd. A Cash Flow-to-Debt Ratio by Year (2020–2024)

GRINM Semiconductor Materials Co. Ltd. A cash flow-to-debt ratio by year from 2020 to 2024. Year-by-year debt coverage analysis for GRINM Semiconductor Materials Co. Ltd. A. For the full cash flow conversion analysis, see GRINM Semiconductor Materials Co. Ltd. A (688432) cash flow conversion.

Year CF-to-Debt Ratio Operating CF (CNY) Total Liabilities YoY Change
2024 0.40x CN¥229.37 Million CN¥570.82 Million ▼ -30.3%
2023 0.58x CN¥266.64 Million CN¥462.49 Million ▼ -24.4%
2022 0.76x CN¥430.35 Million CN¥564.61 Million ▲ +58.3%
2021 0.48x CN¥322.74 Million CN¥670.12 Million ▲ +58.3%
2020 0.30x CN¥241.34 Million CN¥793.11 Million —
Cash Flow-to-Debt Ratio = Operating Cash Flow / Total Liabilities. Higher is better for debt service capacity.