GRINM Semiconductor Materials Co. Ltd. A (688432) — Cash Flow-to-Debt Ratio

Latest as of December 2024: 0.40x

GRINM Semiconductor Materials Co. Ltd. A (688432) has a Cash Flow-to-Debt Ratio of 0.40x as of December 2024, meaning its operating cash flow of CN¥229.37 Million could theoretically repay 0% of its total liabilities (CN¥570.82 Million) in one year. See 688432 free cash flow to operating cash ratio to measure how efficiently the company converts operating cash flow to free cash.

CF-to-Debt Ratio

0.40x
Operating CF / Total Liabilities

Operating Cash Flow

CN¥229.37 Million
CNY

Total Liabilities

CN¥570.82 Million
CNY

Data as of

Dec 2024
Most recent filing

GRINM Semiconductor Materials Co. Ltd. A Cash Flow-to-Debt Ratio (2020–2024)

Historical debt coverage capacity for GRINM Semiconductor Materials Co. Ltd. A across 5 annual periods. Also explore GRINM Semiconductor Materials Co. Ltd. A annual equity growth to track the company's year-over-year net asset growth rate.

Annual Cash Flow-to-Debt Ratio for GRINM Semiconductor Materials Co. Ltd. A (2020–2024)

Year-by-year debt coverage analysis for GRINM Semiconductor Materials Co. Ltd. A. For market capitalisation and broader financial context, see GRINM Semiconductor Materials Co. Ltd. A market capitalisation.

Year CF-to-Debt Ratio Operating CF (CNY) Total Liabilities YoY Change
2024 0.40x CN¥229.37 Million CN¥570.82 Million ▼ -30.3%
2023 0.58x CN¥266.64 Million CN¥462.49 Million ▼ -24.4%
2022 0.76x CN¥430.35 Million CN¥564.61 Million ▲ +58.3%
2021 0.48x CN¥322.74 Million CN¥670.12 Million ▲ +58.3%
2020 0.30x CN¥241.34 Million CN¥793.11 Million
Cash Flow-to-Debt Ratio = Operating Cash Flow / Total Liabilities. Higher is better for debt service capacity.