Dr. Hönle AG (HNL) - Total Liabilities
Based on the latest financial reports, Dr. Hönle AG (HNL) has total liabilities worth €68.48 Million EUR (≈ $80.06 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore Dr. Hönle AG (HNL) cash flow conversion to assess how effectively this company generates cash.
Dr. Hönle AG - Total Liabilities Trend (2014–2025)
This chart illustrates how Dr. Hönle AG's total liabilities have evolved over time, based on quarterly financial data. Check Dr. Hönle AG liquidity resilience to evaluate the company's liquid asset resilience ratio.
Dr. Hönle AG Competitors by Total Liabilities
The table below lists competitors of Dr. Hönle AG ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Mr Bricolage
PA:ALMRB
|
France | €220.49 Million |
|
Acrivon Therapeutics, Inc. Common Stock
NASDAQ:ACRV
|
USA | $16.70 Million |
|
Sam Jung Pulp
KO:009770
|
Korea | ₩34.82 Billion |
|
Power Metals Corp
V:PWM
|
Canada | CA$1.57 Million |
|
Plus Therapeutics Inc
NASDAQ:PSTV
|
USA | $13.62 Million |
|
BranchOut Food Inc. Common Stock
NASDAQ:BOF
|
USA | $8.89 Million |
|
Toivo Group Oyj
HE:TOIVO
|
Finland | €98.63 Million |
|
Voksel Electric Tbk
JK:VOKS
|
Indonesia | Rp1.46 Trillion |
Liability Composition Analysis (2014–2025)
This chart breaks down Dr. Hönle AG's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Dr. Hönle AG (HNL) market capitalisation.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.80 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.89 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.47 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Dr. Hönle AG's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Dr. Hönle AG (2014–2025)
The table below shows the annual total liabilities of Dr. Hönle AG from 2014 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-09-30 | €68.48 Million ≈ $80.06 Million |
-9.53% |
| 2024-09-30 | €75.70 Million ≈ $88.50 Million |
-5.40% |
| 2023-09-30 | €80.02 Million ≈ $93.56 Million |
-9.30% |
| 2022-09-30 | €88.22 Million ≈ $103.14 Million |
-3.88% |
| 2021-09-30 | €91.78 Million ≈ $107.30 Million |
+15.43% |
| 2020-09-30 | €79.51 Million ≈ $92.96 Million |
+47.17% |
| 2019-09-30 | €54.02 Million ≈ $63.16 Million |
+41.15% |
| 2018-09-30 | €38.27 Million ≈ $44.75 Million |
+17.66% |
| 2017-09-30 | €32.53 Million ≈ $38.03 Million |
-0.24% |
| 2016-09-30 | €32.61 Million ≈ $38.12 Million |
-2.66% |
| 2015-09-30 | €33.50 Million ≈ $39.16 Million |
-6.63% |
| 2014-09-30 | €35.88 Million ≈ $41.94 Million |
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About Dr. Hönle AG
Hoenle AG develops, manufactures, and distributes industrial UV technologies and systems in Germany and internationally. It operates through three segments: Adhesive Systems, Curing, and Disinfection. The Adhesives Systems segment offers industrial adhesives, as well as supplies adhesive curing systems used for consumer electronics, automotive, optics and opto-electronics, and curing of adhesives… Read more