MQ Technology Bhd Total Liabilities
MQ Technology Bhd total liabilities. Based on the latest financial reports, MQ Technology Bhd (0070) has total liabilities worth RM18.43 Million MYR (≈ $4.63 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. See MQ Technology Bhd defensive liquidity buffer to measure how many days the company can operate on defensive assets alone.
Total Liabilities of MQ Technology Bhd (2015–2024)
Total liabilities of MQ Technology Bhd from 2015 to 2024. This chart illustrates how MQ Technology Bhd's total liabilities have evolved over time, based on quarterly financial data. Check how resilient are MQ Technology Bhd's assets to evaluate the company's liquid asset resilience ratio.
MQ Technology Bhd Competitors by Total Liabilities
The table below lists competitors of MQ Technology Bhd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
GIVOT OLAM OIL EXP ILS1
TA:GIVO-L
|
Israel | ILA25.35 Million |
|
Vistal Gdynia
WAR:VTL
|
Poland | zł565.15 Million |
|
Askari Metals Ltd
AU:AS2
|
Australia | AU$1.62 Million |
|
Adherium Ltd
AU:ADR
|
Australia | AU$4.94 Million |
|
FAT Brands Inc
NASDAQ:FAT
|
USA | $1.80 Billion |
|
Vivos Therapeutics Inc
NASDAQ:VVOS
|
USA | $28.13 Million |
|
8I Holdings Ltd
AU:8IH
|
Australia | AU$316.61K |
|
Southern Empire Resources Corp
V:SMP
|
Canada | CA$2.44 Million |
Liability Composition Analysis (2015–2024)
This chart breaks down MQ Technology Bhd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see balance sheet size of MQ Technology Bhd.
Liquidity & Leverage Metrics
MQ Technology Bhd Total Liabilities Ratios Explained
MQ Technology Bhd total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 3.52 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.30 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.23 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how MQ Technology Bhd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for MQ Technology Bhd (2015–2024)
The table below shows the annual total liabilities of MQ Technology Bhd from 2015 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | RM12.95 Million ≈ $3.25 Million |
+271.80% |
| 2023-12-31 | RM3.48 Million ≈ $874.40K |
-31.71% |
| 2022-12-31 | RM5.10 Million ≈ $1.28 Million |
-27.39% |
| 2021-12-31 | RM7.02 Million ≈ $1.76 Million |
+34.16% |
| 2019-12-31 | RM5.24 Million ≈ $1.31 Million |
-64.21% |
| 2018-12-31 | RM14.63 Million ≈ $3.67 Million |
+4.25% |
| 2017-12-31 | RM14.03 Million ≈ $3.52 Million |
+6.12% |
| 2016-12-31 | RM13.22 Million ≈ $3.32 Million |
+19.49% |
| 2015-12-31 | RM11.07 Million ≈ $2.78 Million |
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About MQ Technology Bhd
MQ Technology Berhad, an investment holding company, engages in the manufacture and sale of moulds, tools, dies, jigs, and fixtures in Malaysia, Thailand, Ireland, Singapore, and the United States. It designs, develops, and manufactures suspension and progressive tooling, and semiconductor cavity/encapsulation molds for application in hard disk drives and semiconductor industries; and automation … Read more