Maxscend Microelectronics Co Ltd (300782) - Total Liabilities

Latest as of March 2026: CN¥5.42 Billion CNY ≈ $793.21 Million USD

Based on the latest financial reports, Maxscend Microelectronics Co Ltd (300782) has total liabilities worth CN¥5.42 Billion CNY (≈ $793.21 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check asset resilience ratio of Maxscend Microelectronics Co Ltd to evaluate the company's liquid asset resilience ratio.

Maxscend Microelectronics Co Ltd - Total Liabilities Trend (2014–2025)

This chart illustrates how Maxscend Microelectronics Co Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 300782 total assets.

Maxscend Microelectronics Co Ltd Competitors by Total Liabilities

The table below lists competitors of Maxscend Microelectronics Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
BNP Paribas Bank Polska S.A.
WAR:BNP
Poland zł159.47 Billion
Qilu Bank Co Ltd
SHG:601665
China CN¥787.79 Billion
Sealed Air Corporation
NYSE:SEE
USA $5.78 Billion
Shenergy Co Ltd
SHG:600642
China CN¥60.73 Billion
Krafton Inc
KO:259960
Korea ₩1.16 Trillion
Gerdau S.A
F:GDUA
Germany €28.24 Billion
Hangzhou Tigermed Consulting
SHE:300347
China CN¥4.24 Billion
Shenzhen Sunlord Electronics Co Ltd
SHE:002138
China CN¥6.90 Billion

Liability Composition Analysis (2014–2025)

This chart breaks down Maxscend Microelectronics Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Maxscend Microelectronics Co Ltd balance sheet quality to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.03 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.56 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.36 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Maxscend Microelectronics Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Maxscend Microelectronics Co Ltd (2014–2025)

The table below shows the annual total liabilities of Maxscend Microelectronics Co Ltd from 2014 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥5.60 Billion
≈ $818.73 Million
+38.76%
2024-12-31 CN¥4.03 Billion
≈ $590.01 Million
+249.27%
2023-12-31 CN¥1.15 Billion
≈ $168.93 Million
+41.03%
2022-12-31 CN¥818.57 Million
≈ $119.78 Million
+0.63%
2021-12-31 CN¥813.44 Million
≈ $119.03 Million
+83.86%
2020-12-31 CN¥442.42 Million
≈ $64.74 Million
+96.08%
2019-12-31 CN¥225.63 Million
≈ $33.02 Million
+226.82%
2018-12-31 CN¥69.04 Million
≈ $10.10 Million
+30.46%
2017-12-31 CN¥52.92 Million
≈ $7.74 Million
-17.34%
2016-12-31 CN¥64.02 Million
≈ $9.37 Million
+30.83%
2015-12-31 CN¥48.94 Million
≈ $7.16 Million
+59.02%
2014-12-31 CN¥30.77 Million
≈ $4.50 Million
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About Maxscend Microelectronics Co Ltd

SHE:300782 China Semiconductors
Market Cap
$6.20 Billion
CN¥42.40 Billion CNY
Market Cap Rank
#3117 Global
#395 in China
Share Price
CN¥73.74
Change (1 day)
+2.92%
52-Week Range
CN¥64.72 - CN¥140.88
All Time High
CN¥332.73
About

Maxscend Microelectronics Company Limited, together with its subsidiaries, engages in the research, development, production, and sale of radio frequency integrated circuits in China and internationally. The company offers RF front-end chip products, including RF switches, low noise amplifiers, filters, power amplifiers, and front-end modules; and IoT chip products, such as Bluetooth low energy mi… Read more