Maxscend Microelectronics Co Ltd (300782) - Total Liabilities
Based on the latest financial reports, Maxscend Microelectronics Co Ltd (300782) has total liabilities worth CN¥5.42 Billion CNY (≈ $793.21 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Maxscend Microelectronics Co Ltd - Total Liabilities Trend (2014–2025)
This chart illustrates how Maxscend Microelectronics Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See Maxscend Microelectronics Co Ltd short-term liquidity ratio to evaluate short-term liquidity relative to the company's equity base.
Maxscend Microelectronics Co Ltd Competitors by Total Liabilities
The table below lists competitors of Maxscend Microelectronics Co Ltd ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Dutch Bros Inc
NYSE:BROS
|
USA | $2.18 Billion |
|
Allegro Microsystems Inc
NASDAQ:ALGM
|
USA | $459.73 Million |
|
Trelleborg AB (publ)
ST:TREL-B
|
Sweden | Skr20.83 Billion |
|
T&S Communications Co Ltd
SHE:300570
|
China | CN¥426.72 Million |
|
Interpublic Group of Companies Inc
NYSE:IPG
|
USA | $13.25 Billion |
|
American Healthcare REIT, Inc.
NYSE:AHR
|
USA | $2.08 Trillion |
|
WT Microelectronics Co Ltd
TW:3036
|
Taiwan | NT$561.17 Billion |
|
ORKLA ADR/1 NK 625
F:OKL0
|
Germany | €36.55 Billion |
Liability Composition Analysis (2014–2025)
This chart breaks down Maxscend Microelectronics Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 300782 market cap.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 2.03 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.56 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.36 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Maxscend Microelectronics Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Maxscend Microelectronics Co Ltd (2014–2025)
The table below shows the annual total liabilities of Maxscend Microelectronics Co Ltd from 2014 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | CN¥5.60 Billion ≈ $818.73 Million |
+38.76% |
| 2024-12-31 | CN¥4.03 Billion ≈ $590.01 Million |
+249.27% |
| 2023-12-31 | CN¥1.15 Billion ≈ $168.93 Million |
+41.03% |
| 2022-12-31 | CN¥818.57 Million ≈ $119.78 Million |
+0.63% |
| 2021-12-31 | CN¥813.44 Million ≈ $119.03 Million |
+83.86% |
| 2020-12-31 | CN¥442.42 Million ≈ $64.74 Million |
+96.08% |
| 2019-12-31 | CN¥225.63 Million ≈ $33.02 Million |
+226.82% |
| 2018-12-31 | CN¥69.04 Million ≈ $10.10 Million |
+30.46% |
| 2017-12-31 | CN¥52.92 Million ≈ $7.74 Million |
-17.34% |
| 2016-12-31 | CN¥64.02 Million ≈ $9.37 Million |
+30.83% |
| 2015-12-31 | CN¥48.94 Million ≈ $7.16 Million |
+59.02% |
| 2014-12-31 | CN¥30.77 Million ≈ $4.50 Million |
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About Maxscend Microelectronics Co Ltd
Maxscend Microelectronics Company Limited, together with its subsidiaries, engages in the research, development, production, and sale of radio frequency integrated circuits in China and internationally. The company offers RF front-end chip products, including RF switches, low noise amplifiers, filters, power amplifiers, and front-end modules; and IoT chip products, such as Bluetooth low energy mi… Read more