Dalian Dalicap Technology Co Ltd (301566) - Total Liabilities

Latest as of March 2026: CN¥71.78 Million CNY ≈ $10.50 Million USD

Based on the latest financial reports, Dalian Dalicap Technology Co Ltd (301566) has total liabilities worth CN¥71.78 Million CNY (≈ $10.50 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Dalian Dalicap Technology Co Ltd - Total Liabilities Trend (2021–2025)

This chart illustrates how Dalian Dalicap Technology Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See Dalian Dalicap Technology Co Ltd current assets vs equity to evaluate short-term liquidity relative to the company's equity base.

Dalian Dalicap Technology Co Ltd Competitors by Total Liabilities

The table below lists competitors of Dalian Dalicap Technology Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
United Natural Foods Inc
NYSE:UNFI
USA $6.01 Billion
TES Co. Ltd
KQ:095610
Korea ₩128.46 Billion
China Science Publishing & Media Ltd
SHG:601858
China CN¥1.68 Billion
Shandong Buchang Pharmaceuticals Co Ltd
SHG:603858
China CN¥9.50 Billion
A-Zenith Home Furnishings Co Ltd
SHG:603389
China CN¥978.67 Million
LG Household & Healthcare
KO:051900
Korea ₩1.44 Trillion
Terna Energy Societe Anonyme Commercial Technical Company
AT:TENERGY
Greece €1.50 Billion
Zhongshan Public Utilities Group Co Ltd
SHE:000685
China CN¥17.48 Billion

Liability Composition Analysis (2021–2025)

This chart breaks down Dalian Dalicap Technology Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market cap of Dalian Dalicap Technology Co Ltd.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 38.74 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.05 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.04 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Dalian Dalicap Technology Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Dalian Dalicap Technology Co Ltd (2021–2025)

The table below shows the annual total liabilities of Dalian Dalicap Technology Co Ltd from 2021 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥68.50 Million
≈ $10.02 Million
-18.14%
2024-12-31 CN¥83.67 Million
≈ $12.24 Million
-64.45%
2023-12-31 CN¥235.35 Million
≈ $34.44 Million
-20.21%
2022-12-31 CN¥294.96 Million
≈ $43.16 Million
+5.38%
2021-12-31 CN¥279.91 Million
≈ $40.96 Million
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About Dalian Dalicap Technology Co Ltd

SHE:301566 China Electronic Components
Market Cap
$2.36 Billion
CN¥16.11 Billion CNY
Market Cap Rank
#5777 Global
#1165 in China
Share Price
CN¥40.28
Change (1 day)
+1.05%
52-Week Range
CN¥15.96 - CN¥40.28
All Time High
CN¥40.28
About

Dalian Dalicap Technology Co.,Ltd. engages in the research and development, manufacture, and sale of radio frequency (RF) microwave ceramic capacitors in China and internationally. The company offers RF/microwave multilayer ceramic capacitors, single-layer ceramic capacitors, broadband multilayer ceramic capacitors, non-magnetic multilayer chip ceramic capacitors, non-magnetic multilayer chip res… Read more