Raytron Technology Co Ltd (688002) - Total Liabilities

Latest as of June 2026: CN¥4.24 Billion CNY ≈ $621.00 Million USD

Based on the latest financial reports, Raytron Technology Co Ltd (688002) has total liabilities worth CN¥4.24 Billion CNY (≈ $621.00 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check asset resilience ratio of Raytron Technology Co Ltd to evaluate the company's liquid asset resilience ratio.

Raytron Technology Co Ltd - Total Liabilities Trend (2016–2025)

This chart illustrates how Raytron Technology Co Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see Raytron Technology Co Ltd total assets.

Raytron Technology Co Ltd Competitors by Total Liabilities

The table below lists competitors of Raytron Technology Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
Sociedad Quimica y Minera de Chile SA ADR B
NYSE:SQM
USA $6.19 Billion
CARLSBERG B DK20 ADR 1/5
F:CBGC
Germany €123.28 Billion
Sonova H Ag
SW:SOON
Switzerland CHF2.99 Billion
Revvity Inc.
NYSE:RVTY
USA $4.81 Billion
NIPPON YUSEN K.K.SP.DR1/5
F:NYK
Germany €1.49 Trillion
McCormick & Company Incorporated
NYSE:MKC
USA $8.90 Billion
Exelixis Inc
NASDAQ:EXEL
USA $683.10 Million
BANKINTER ADR 2007 EO-30
F:BAK
Germany €130.17 Billion

Liability Composition Analysis (2016–2025)

This chart breaks down Raytron Technology Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See net asset quality index of Raytron Technology Co Ltd to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.89 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.52 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.34 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Raytron Technology Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Raytron Technology Co Ltd (2016–2025)

The table below shows the annual total liabilities of Raytron Technology Co Ltd from 2016 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥-6.26 Billion
≈ $-916.19 Million
-291.14%
2024-12-31 CN¥3.28 Billion
≈ $479.34 Million
+3.18%
2023-12-31 CN¥3.17 Billion
≈ $464.56 Million
+59.83%
2022-12-31 CN¥1.99 Billion
≈ $290.66 Million
+79.34%
2021-12-31 CN¥1.11 Billion
≈ $162.07 Million
+80.15%
2020-12-31 CN¥614.81 Million
≈ $89.97 Million
+204.82%
2019-12-31 CN¥201.70 Million
≈ $29.51 Million
+8.86%
2018-12-31 CN¥185.28 Million
≈ $27.11 Million
+32.84%
2017-12-31 CN¥139.47 Million
≈ $20.41 Million
+170.38%
2016-12-31 CN¥51.59 Million
≈ $7.55 Million
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About Raytron Technology Co Ltd

SHG:688002 China Electronic Components
Market Cap
$12.18 Billion
CN¥83.26 Billion CNY
Market Cap Rank
#1928 Global
#192 in China
Share Price
CN¥178.85
Change (1 day)
-2.83%
52-Week Range
CN¥75.28 - CN¥186.80
All Time High
CN¥186.80
About

Raytron Technology Co.,Ltd. engages in the design and manufacturing of application specific integrated circuits and special chips in China and internationally. The company offers infrared thermal imaging, such as thermal sensors, detectors, core modules, and units; silicon-based beamforming chips, compound-based MMIC chips, T/R component design, and phased array antenna system integration. It als… Read more