Hangzhou SDIC Microelectronics Inc. A (688130) - Total Liabilities

Latest as of March 2026: CN¥43.53 Million CNY ≈ $6.37 Million USD

Based on the latest financial reports, Hangzhou SDIC Microelectronics Inc. A (688130) has total liabilities worth CN¥43.53 Million CNY (≈ $6.37 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore net asset momentum of Hangzhou SDIC Microelectronics Inc. A to track the company's year-over-year net asset growth rate.

Hangzhou SDIC Microelectronics Inc. A - Total Liabilities Trend (2020–2025)

This chart illustrates how Hangzhou SDIC Microelectronics Inc. A's total liabilities have evolved over time, based on quarterly financial data. See 688130 free cash flow to operating cash ratio to measure how efficiently the company converts operating cash flow to free cash.

Hangzhou SDIC Microelectronics Inc. A Competitors by Total Liabilities

The table below lists competitors of Hangzhou SDIC Microelectronics Inc. A ranked by their total liabilities.

Company Country Total Liabilities
Xpro India Limited
NSE:XPROINDIA
India Rs4.20 Billion
Sappe Public Company Limited
BK:SAPPE
Thailand ฿1.10 Billion
Yaxing Chem
SHG:600319
China CN¥2.57 Billion
BlackRock California Municipal Income Closed Fund
NYSE:BFZ
USA $275.83 Million
Worldex Industry & Trading Co. Ltd
KQ:101160
Korea ₩90.85 Billion
Chengdu Shengbang Seals Co.Ltd.
SHE:301233
China CN¥85.45 Million
Campine
BR:CAMB
Belgium €107.69 Million
Radiant Logistics Inc
NYSE MKT:RLGT
USA $218.17 Million

Liability Composition Analysis (2020–2025)

This chart breaks down Hangzhou SDIC Microelectronics Inc. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Hangzhou SDIC Microelectronics Inc. A (688130) total market value.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 28.13 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.04 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.03 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hangzhou SDIC Microelectronics Inc. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hangzhou SDIC Microelectronics Inc. A (2020–2025)

The table below shows the annual total liabilities of Hangzhou SDIC Microelectronics Inc. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥69.83 Million
≈ $10.22 Million
-57.04%
2024-12-31 CN¥162.55 Million
≈ $23.79 Million
+609.16%
2023-12-31 CN¥22.92 Million
≈ $3.35 Million
-36.76%
2022-12-31 CN¥36.25 Million
≈ $5.30 Million
+76.10%
2021-12-31 CN¥20.58 Million
≈ $3.01 Million
+7.71%
2020-12-31 CN¥19.11 Million
≈ $2.80 Million
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About Hangzhou SDIC Microelectronics Inc. A

SHG:688130 China Semiconductors
Market Cap
$330.10 Million
CN¥2.26 Billion CNY
Market Cap Rank
#14254 Global
#4228 in China
Share Price
CN¥18.66
Change (1 day)
+1.36%
52-Week Range
CN¥17.20 - CN¥30.63
All Time High
CN¥49.04
About

Hangzhou SDIC Microelectronics Inc. engages in the research and development, and sale of analog and digital-analog hybrid integrated circuits (ICs) in China. It offers industrial control application ICs, measurement sensor ICs, metrology ICs, and digital temperature sensors; and medical and health SoC chips, industrial control and instrument chips, intelligent sensing SoC chips, etc. for use in v… Read more