Hangzhou SDIC Microelectronics Inc. A (688130) - Total Liabilities

Latest as of June 2026: CN¥46.77 Million CNY ≈ $6.84 Million USD

Based on the latest financial reports, Hangzhou SDIC Microelectronics Inc. A (688130) has total liabilities worth CN¥46.77 Million CNY (≈ $6.84 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Hangzhou SDIC Microelectronics Inc. A asset resilience ratio to evaluate the company's liquid asset resilience ratio.

Hangzhou SDIC Microelectronics Inc. A - Total Liabilities Trend (2020–2025)

This chart illustrates how Hangzhou SDIC Microelectronics Inc. A's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 688130 current and non-current assets.

Hangzhou SDIC Microelectronics Inc. A Competitors by Total Liabilities

The table below lists competitors of Hangzhou SDIC Microelectronics Inc. A ranked by their total liabilities.

Company Country Total Liabilities
Guangzhou Jiacheng
SHG:603535
China CN¥2.34 Billion
John Mattson Fastighetsforetagen AB
ST:JOMA
Sweden Skr8.78 Billion
Tae Kwang Corporation
KQ:023160
Korea ₩71.20 Billion
I-Mab
NASDAQ:IMAB
USA $18.50 Million
People & Technology Inc
KQ:137400
Korea ₩1.14 Trillion
mF International Limited Ordinary Shares
NASDAQ:MFI
USA $21.51 Million
Brave C&H Supply Co Ltd
TWO:6538
Taiwan NT$1.08 Billion

Liability Composition Analysis (2020–2025)

This chart breaks down Hangzhou SDIC Microelectronics Inc. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See 688130 equity financing ratio to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 25.49 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.04 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.04 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hangzhou SDIC Microelectronics Inc. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hangzhou SDIC Microelectronics Inc. A (2020–2025)

The table below shows the annual total liabilities of Hangzhou SDIC Microelectronics Inc. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥69.83 Million
≈ $10.22 Million
-57.04%
2024-12-31 CN¥162.55 Million
≈ $23.79 Million
+609.16%
2023-12-31 CN¥22.92 Million
≈ $3.35 Million
-36.76%
2022-12-31 CN¥36.25 Million
≈ $5.30 Million
+76.10%
2021-12-31 CN¥20.58 Million
≈ $3.01 Million
+7.71%
2020-12-31 CN¥19.11 Million
≈ $2.80 Million
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About Hangzhou SDIC Microelectronics Inc. A

SHG:688130 China Semiconductors
Market Cap
$456.41 Million
CN¥3.12 Billion CNY
Market Cap Rank
#12834 Global
#3798 in China
Share Price
CN¥25.80
Change (1 day)
+4.07%
52-Week Range
CN¥17.20 - CN¥30.63
All Time High
CN¥49.04
About

Hangzhou SDIC Microelectronics Inc. engages in the research and development, and sale of analog and mixed-signal integrated circuits (ICs) in China and internationally. It offers medical and healthcare SoC chips, industrial control and instrumentation chips, intelligent sensing SoC chips, and battery management chips, which are used in medical and healthcare, pressure measurement, industrial cont… Read more