Hangzhou SDIC Microelectronics Inc. A (688130) - Total Liabilities

Latest as of March 2026: CN¥43.53 Million CNY ≈ $6.37 Million USD

Based on the latest financial reports, Hangzhou SDIC Microelectronics Inc. A (688130) has total liabilities worth CN¥43.53 Million CNY (≈ $6.37 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Hangzhou SDIC Microelectronics Inc. A - Total Liabilities Trend (2020–2025)

This chart illustrates how Hangzhou SDIC Microelectronics Inc. A's total liabilities have evolved over time, based on quarterly financial data. See working capital position of Hangzhou SDIC Microelectronics Inc. A to evaluate short-term liquidity relative to the company's equity base.

Hangzhou SDIC Microelectronics Inc. A Competitors by Total Liabilities

The table below lists competitors of Hangzhou SDIC Microelectronics Inc. A ranked by their total liabilities.

Company Country Total Liabilities
Amper S.A.
MC:AMP
Spain €391.89 Million
CREDIT CORP. GROUP LTD.
F:2RC
Germany €507.87 Million
Nexity
PA:NXI
France €3.83 Billion
Career Technology MFG Co Ltd
TW:6153
Taiwan NT$6.91 Billion
Zhejiang Kan Specialities Material Co Ltd
SHE:002012
China CN¥162.69 Million
Studio Dragon Corporation
KQ:253450
Korea ₩234.22 Billion
Lumibird SA
PA:LBIRD
France €222.60 Million
Jiangsu Huifeng Agrochemical Co Ltd
SHE:002496
China CN¥987.73 Million

Liability Composition Analysis (2020–2025)

This chart breaks down Hangzhou SDIC Microelectronics Inc. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 688130 company net worth.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 28.13 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.04 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.03 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Hangzhou SDIC Microelectronics Inc. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Hangzhou SDIC Microelectronics Inc. A (2020–2025)

The table below shows the annual total liabilities of Hangzhou SDIC Microelectronics Inc. A from 2020 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥69.83 Million
≈ $10.22 Million
-57.04%
2024-12-31 CN¥162.55 Million
≈ $23.79 Million
+609.16%
2023-12-31 CN¥22.92 Million
≈ $3.35 Million
-36.76%
2022-12-31 CN¥36.25 Million
≈ $5.30 Million
+76.10%
2021-12-31 CN¥20.58 Million
≈ $3.01 Million
+7.71%
2020-12-31 CN¥19.11 Million
≈ $2.80 Million
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About Hangzhou SDIC Microelectronics Inc. A

SHG:688130 China Semiconductors
Market Cap
$490.02 Million
CN¥3.35 Billion CNY
Market Cap Rank
#12491 Global
#3678 in China
Share Price
CN¥27.70
Change (1 day)
+1.21%
52-Week Range
CN¥19.80 - CN¥30.63
All Time High
CN¥49.04
About

Hangzhou SDIC Microelectronics Inc. engages in the research and development, and sale of analog and digital-analog hybrid integrated circuits (ICs) in China. It offers industrial control application ICs, measurement sensor ICs, metrology ICs, and digital temperature sensors; and medical and health SoC chips, industrial control and instrument chips, intelligent sensing SoC chips, etc. for use in v… Read more