Primarius Technologies Co. Ltd. A (688206) - Total Liabilities

Latest as of June 2025: CN¥436.31 Million CNY ≈ $63.85 Million USD

Based on the latest financial reports, Primarius Technologies Co. Ltd. A (688206) has total liabilities worth CN¥436.31 Million CNY (≈ $63.85 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Primarius Technologies Co. Ltd. A (688206) liquid assets ratio to evaluate the company's liquid asset resilience ratio.

Primarius Technologies Co. Ltd. A - Total Liabilities Trend (2019–2024)

This chart illustrates how Primarius Technologies Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 688206 total asset value.

Primarius Technologies Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Primarius Technologies Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Ningbo Ronbay New Energy Tech Ltd
SHG:688005
China CN¥15.73 Billion
TAG IMMOBILIEN ADR 1/2
F:TEG0
Germany €5.63 Billion
BKV Corporation
NYSE:BKV
USA $1.06 Billion
Rumble Inc.
NASDAQ:RUM
USA $698.47 Million
Jiangsu Lihua Animal Husbandry Co Ltd
SHE:300761
China CN¥6.91 Billion
Ducommun Incorporated
NYSE:DCO
USA $534.12 Million
Megacable Holdings S. A. B. de C. V
MX:MEGACPO
Mexico MX$37.96 Billion
American Eagle Outfitters Inc
NYSE:AEO
USA $2.35 Billion

Liability Composition Analysis (2019–2024)

This chart breaks down Primarius Technologies Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Primarius Technologies Co. Ltd. A (688206) net asset quality to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 5.52 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.22 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.18 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Primarius Technologies Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Primarius Technologies Co. Ltd. A (2019–2024)

The table below shows the annual total liabilities of Primarius Technologies Co. Ltd. A from 2019 to 2024.

Year Total Liabilities Change
2024-12-31 CN¥493.43 Million
≈ $72.20 Million
+21.36%
2023-12-31 CN¥406.59 Million
≈ $59.50 Million
+22.91%
2022-12-31 CN¥330.80 Million
≈ $48.41 Million
+44.06%
2021-12-31 CN¥229.62 Million
≈ $33.60 Million
+93.65%
2020-12-31 CN¥118.58 Million
≈ $17.35 Million
+12.80%
2019-12-31 CN¥105.12 Million
≈ $15.38 Million
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About Primarius Technologies Co. Ltd. A

SHG:688206 China Semiconductors
Market Cap
$2.51 Billion
CN¥17.16 Billion CNY
Market Cap Rank
#5455 Global
#990 in China
Share Price
CN¥39.44
Change (1 day)
+5.85%
52-Week Range
CN¥29.42 - CN¥53.00
All Time High
CN¥53.00
About

Primarius Technologies Co., Ltd. researches, designs, and develops electronic design automation (EDA) tools in China, and internationally. It offers Fab EDA; digital design EDA; testing systems that include parameter testing, noise measurement, and integrated testing; and design enablement services, consisting of wafer testing, SPICE modeling, testchip design, new device, and PDK and IP developme… Read more