C*Core Technology Co Ltd (688262) - Total Liabilities

Latest as of March 2026: CN¥1.23 Billion CNY ≈ $179.43 Million USD

Based on the latest financial reports, C*Core Technology Co Ltd (688262) has total liabilities worth CN¥1.23 Billion CNY (≈ $179.43 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check 688262 financial resilience to evaluate the company's liquid asset resilience ratio.

C*Core Technology Co Ltd - Total Liabilities Trend (2017–2025)

This chart illustrates how C*Core Technology Co Ltd's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 688262 total assets.

C*Core Technology Co Ltd Competitors by Total Liabilities

The table below lists competitors of C*Core Technology Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
Xinjiang Machinery Research Inst
SHE:300159
China CN¥553.44 Million
PM Capital Global Opportunities Fund Ltd
AU:PGF
Australia AU$364.24 Million
Interroll Holding AG
SW:INRN
Switzerland CHF108.31 Million
Savers Value Village, Inc.
NYSE:SVV
USA $1.63 Billion
Fufeng Group Limited
F:FFO1
Germany €24.25 Billion
Great Wall Enterprise Co Ltd
TW:1210
Taiwan NT$40.68 Billion
Xian International Medical Investment Co Ltd
SHE:000516
China CN¥6.56 Billion
ChemoMetec A/S
CO:CHEMM
Denmark Dkr130.78 Million

Liability Composition Analysis (2017–2025)

This chart breaks down C*Core Technology Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See C*Core Technology Co Ltd (688262) net asset quality to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.80 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.64 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.39 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how C*Core Technology Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for C*Core Technology Co Ltd (2017–2025)

The table below shows the annual total liabilities of C*Core Technology Co Ltd from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥-2.06 Billion
≈ $-301.73 Million
-305.04%
2024-12-31 CN¥1.01 Billion
≈ $147.15 Million
+86.47%
2023-12-31 CN¥539.29 Million
≈ $78.91 Million
+136.91%
2022-12-31 CN¥227.63 Million
≈ $33.31 Million
+31.09%
2021-12-31 CN¥173.65 Million
≈ $25.41 Million
+69.66%
2020-12-31 CN¥102.35 Million
≈ $14.98 Million
+44.70%
2019-12-31 CN¥70.73 Million
≈ $10.35 Million
+18.52%
2018-12-31 CN¥59.68 Million
≈ $8.73 Million
+64.43%
2017-12-31 CN¥36.30 Million
≈ $5.31 Million
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About C*Core Technology Co Ltd

SHG:688262 China Semiconductors
Market Cap
$1.39 Billion
CN¥9.50 Billion CNY
Market Cap Rank
#7578 Global
#1669 in China
Share Price
CN¥28.26
Change (1 day)
+2.84%
52-Week Range
CN¥22.76 - CN¥46.61
All Time High
CN¥54.37
About

C*Core Technology Co., Ltd. operates as a chip design company in China. The company offers custom chip technology services, such as IP products and SoC platform; automotive electronics and industrial control products, including microcontrollers, DSP, security and smart cards, and mixed-signal chip; and information technology innovation and information security products comprising cloud-to-device … Read more