Forehope Electronic (Ningbo) Co. Ltd. A Total Liabilities
Forehope Electronic (Ningbo) Co. Ltd. A total liabilities. Based on the latest financial reports, Forehope Electronic (Ningbo) Co. Ltd. A (688362) has total liabilities worth CN¥11.75 Billion CNY (≈ $1.72 Billion USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Forehope Electronic (Ningbo) Co. Ltd. A asset resilience ratio to evaluate the company's liquid asset resilience ratio.
Total Liabilities of Forehope Electronic (Ningbo) Co. Ltd. A (2020–2025)
Total liabilities of Forehope Electronic (Ningbo) Co. Ltd. A from 2020 to 2025. This chart illustrates how Forehope Electronic (Ningbo) Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data.
Forehope Electronic (Ningbo) Co. Ltd. A Competitors by Total Liabilities
The table below lists competitors of Forehope Electronic (Ningbo) Co. Ltd. A ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Webull Corp
NASDAQ:BULL
|
USA | $2.86 Billion |
|
Veeco Instruments Inc
NASDAQ:VECO
|
USA | $511.68 Million |
|
Guangdong Aofei Data Technology Co Ltd Class A
SHE:300738
|
China | CN¥12.63 Billion |
|
Compagnie Financiere Tradition
SW:CFT
|
Switzerland | CHF648.95 Million |
|
Proximus NV
BR:PROX
|
Belgium | €8.79 Billion |
|
Tonghua Dongbao Pharmaceutical Co Ltd
SHG:600867
|
China | CN¥1.01 Billion |
|
AF Gruppen ASA
OL:AFG
|
Norway | Nkr13.29 Billion |
|
CA Immobilien Anlagen AG
VI:CAI
|
Austria | €2.89 Billion |
Liability Composition Analysis (2020–2025)
This chart breaks down Forehope Electronic (Ningbo) Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see how large is Forehope Electronic (Ningbo) Co. Ltd. A's balance sheet.
Liquidity & Leverage Metrics
Forehope Electronic (Ningbo) Co. Ltd. A Total Liabilities Ratios Explained
Forehope Electronic (Ningbo) Co. Ltd. A total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 0.86 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 4.45 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.74 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Forehope Electronic (Ningbo) Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Forehope Electronic (Ningbo) Co. Ltd. A (2020–2025)
The table below shows the annual total liabilities of Forehope Electronic (Ningbo) Co. Ltd. A from 2020 to 2025.
| Year | Total Liabilities | Change |
|---|---|---|
| 2025-12-31 | CN¥11.10 Billion ≈ $1.62 Billion |
+15.37% |
| 2024-12-31 | CN¥9.62 Billion ≈ $1.41 Billion |
+15.42% |
| 2023-12-31 | CN¥8.33 Billion ≈ $1.22 Billion |
+55.02% |
| 2022-12-31 | CN¥5.38 Billion ≈ $786.63 Million |
+64.94% |
| 2021-12-31 | CN¥3.26 Billion ≈ $476.91 Million |
+35.96% |
| 2020-12-31 | CN¥2.40 Billion ≈ $350.78 Million |
-- |
About Forehope Electronic (Ningbo) Co. Ltd. A
Forehope Electronic (Ningbo) Co., Ltd. engages in advanced packaging field in the integrated circuit packaging and testing business. It offers bumping and wafer-level packaging, ball grid array package, quad flat no-lead and quad flat package, flip-chip, and system in package products. The company also provides design services for substrates, lead-frames, and wafer packages. Its products are used… Read more