Jiangsu HHCK Advanced Materials Co. Ltd. A Total Liabilities

Latest as of March 2026: CN¥877.12 Million CNY ≈ $128.35 Million USD

Jiangsu HHCK Advanced Materials Co. Ltd. A total liabilities. Based on the latest financial reports, Jiangsu HHCK Advanced Materials Co. Ltd. A (688535) has total liabilities worth CN¥877.12 Million CNY (≈ $128.35 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Jiangsu HHCK Advanced Materials Co. Ltd. asset resilience ratio to evaluate the company's liquid asset resilience ratio.

Total Liabilities of Jiangsu HHCK Advanced Materials Co. Ltd. A (2021–2025)

Total liabilities of Jiangsu HHCK Advanced Materials Co. Ltd. A from 2021 to 2025. This chart illustrates how Jiangsu HHCK Advanced Materials Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data.

Jiangsu HHCK Advanced Materials Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Jiangsu HHCK Advanced Materials Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
TGS ASA SP.ADR/1
F:TGC0
Germany €1.95 Billion
FAP Agri Tbk PT
JK:FAPA
Indonesia Rp6.19 Trillion
Global Ship Lease Inc
NYSE:GSL
USA $1.04 Billion
Befesa SA
XETRA:BFSA
Germany €1.22 Billion
One Software Technologies Ltd
TA:ONE
Israel ILA1.82 Billion
Collective Mining Ltd.
NYSE:CNL
USA $17.42 Million
Turkiye Kalkinma Bankasi AS
IS:KLNMA
Turkey TL170.89 Billion
Zhejiang Jingxin Pharmaceutical Co Ltd
SHE:002020
China CN¥1.91 Billion

Liability Composition Analysis (2021–2025)

This chart breaks down Jiangsu HHCK Advanced Materials Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Jiangsu HHCK Advanced Materials Co. Ltd. total assets.

Liquidity & Leverage Metrics

Jiangsu HHCK Advanced Materials Co. Ltd. A Total Liabilities Ratios Explained

Jiangsu HHCK Advanced Materials Co. Ltd. A total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 3.69 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.40 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.29 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Jiangsu HHCK Advanced Materials Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Jiangsu HHCK Advanced Materials Co. Ltd. A (2021–2025)

The table below shows the annual total liabilities of Jiangsu HHCK Advanced Materials Co. Ltd. A from 2021 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥984.46 Million
≈ $144.06 Million
+170.98%
2024-12-31 CN¥363.30 Million
≈ $53.16 Million
+78.80%
2023-12-31 CN¥203.19 Million
≈ $29.73 Million
+60.15%
2022-12-31 CN¥126.88 Million
≈ $18.57 Million
-16.94%
2021-12-31 CN¥152.75 Million
≈ $22.35 Million
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About Jiangsu HHCK Advanced Materials Co. Ltd. A

SHG:688535 China Semiconductor Equipment & Materials
Market Cap
$1.45 Billion
CN¥9.90 Billion CNY
Market Cap Rank
#7108 Global
#1448 in China
Share Price
CN¥69.70
Change (1 day)
+4.34%
52-Week Range
CN¥66.76 - CN¥187.00
All Time High
CN¥187.00
About

Jiangsu HHCK Advanced Materials Co., Ltd. engages in the research, development, production, and sale of semiconductor packaging materials, such as epoxy molding compounds and electronic adhesives in China. The company offers semiconductor devices, integrated circuits, special devices, and LEDs, as well as electronic packaging materials, such as brackets. Its products are used in semiconductor pac… Read more