Jiangsu HHCK Advanced Materials Co. Ltd. A (688535) - Total Liabilities

Latest as of March 2026: CN¥877.12 Million CNY ≈ $128.35 Million USD

Based on the latest financial reports, Jiangsu HHCK Advanced Materials Co. Ltd. A (688535) has total liabilities worth CN¥877.12 Million CNY (≈ $128.35 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore 688535 year-over-year net asset growth to track the company's year-over-year net asset growth rate.

Jiangsu HHCK Advanced Materials Co. Ltd. A - Total Liabilities Trend (2021–2025)

This chart illustrates how Jiangsu HHCK Advanced Materials Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. See Jiangsu HHCK Advanced Materials Co. Ltd. (688535) FCF generation index to measure how efficiently the company converts operating cash flow to free cash.

Jiangsu HHCK Advanced Materials Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Jiangsu HHCK Advanced Materials Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Tootsie Roll Industries Inc
NYSE:TR
USA $298.96 Million
Suzhou GYZ Electronic Technology Co. Ltd. A
SHG:688260
China CN¥1.41 Billion
Elite Semiconductor Memory Technology Inc
TW:3006
Taiwan NT$7.88 Billion
Shanxi Zhangze Electric Power Co Ltd
SHE:000767
China CN¥53.24 Billion
Scientech Corp
TW:3583
Taiwan NT$17.49 Billion
JBM Auto Limited
NSE:JBMA
India Rs57.78 Billion
MicroPort Endovascular MedTech Ltd
SHG:688016
China CN¥554.42 Million
Addus HomeCare Corporation
NASDAQ:ADUS
USA $319.54 Million

Liability Composition Analysis (2021–2025)

This chart breaks down Jiangsu HHCK Advanced Materials Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see Jiangsu HHCK Advanced Materials Co. Ltd. stock valuation.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.69 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.40 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.29 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Jiangsu HHCK Advanced Materials Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Jiangsu HHCK Advanced Materials Co. Ltd. A (2021–2025)

The table below shows the annual total liabilities of Jiangsu HHCK Advanced Materials Co. Ltd. A from 2021 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥984.46 Million
≈ $144.06 Million
+170.98%
2024-12-31 CN¥363.30 Million
≈ $53.16 Million
+78.80%
2023-12-31 CN¥203.19 Million
≈ $29.73 Million
+60.15%
2022-12-31 CN¥126.88 Million
≈ $18.57 Million
-16.94%
2021-12-31 CN¥152.75 Million
≈ $22.35 Million
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About Jiangsu HHCK Advanced Materials Co. Ltd. A

SHG:688535 China Semiconductor Equipment & Materials
Market Cap
$1.70 Billion
CN¥11.59 Billion CNY
Market Cap Rank
#6677 Global
#1354 in China
Share Price
CN¥81.66
Change (1 day)
-8.35%
52-Week Range
CN¥80.19 - CN¥187.00
All Time High
CN¥187.00
About

Jiangsu HHCK Advanced Materials Co., Ltd. engages in the research, development, production, and sale of semiconductor packaging materials, such as epoxy molding compounds and electronic adhesives in China. The company offers semiconductor devices, integrated circuits, special devices, and LEDs, as well as electronic packaging materials, such as brackets. Its products are used in semiconductor pac… Read more