Jiangsu HHCK Advanced Materials Co. Ltd. A (688535) - Total Liabilities

Latest as of March 2026: CN¥877.12 Million CNY ≈ $128.35 Million USD

Based on the latest financial reports, Jiangsu HHCK Advanced Materials Co. Ltd. A (688535) has total liabilities worth CN¥877.12 Million CNY (≈ $128.35 Million USD) as of March 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Jiangsu HHCK Advanced Materials Co. Ltd. A - Total Liabilities Trend (2021–2025)

This chart illustrates how Jiangsu HHCK Advanced Materials Co. Ltd. A's total liabilities have evolved over time, based on quarterly financial data. See 688535 working capital ratio to evaluate short-term liquidity relative to the company's equity base.

Jiangsu HHCK Advanced Materials Co. Ltd. A Competitors by Total Liabilities

The table below lists competitors of Jiangsu HHCK Advanced Materials Co. Ltd. A ranked by their total liabilities.

Company Country Total Liabilities
Tianma Microelectronics Co Ltd
SHE:000050
China CN¥44.40 Billion
The New India Assurance Company Limited
NSE:NIACL
India Rs818.45 Billion
Salzgitter AG
XETRA:SZG
Germany €6.25 Billion
Organización Soriana S. A. B. de C. V
MX:SORIANAB
Mexico MX$76.03 Billion
Fonciere Lyonnaise
PA:FLY
France €3.19 Billion
Ero Copper Corp
TO:ERO
Canada CA$954.36 Million
Varonis Systems
NASDAQ:VRNS
USA $1.18 Billion
Mandatum Oyj
HE:MANTA
Finland €16.49 Billion

Liability Composition Analysis (2021–2025)

This chart breaks down Jiangsu HHCK Advanced Materials Co. Ltd. A's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 688535 market cap.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.69 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.40 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.29 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Jiangsu HHCK Advanced Materials Co. Ltd. A's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Jiangsu HHCK Advanced Materials Co. Ltd. A (2021–2025)

The table below shows the annual total liabilities of Jiangsu HHCK Advanced Materials Co. Ltd. A from 2021 to 2025.

Year Total Liabilities Change
2025-12-31 CN¥984.46 Million
≈ $144.06 Million
+170.98%
2024-12-31 CN¥363.30 Million
≈ $53.16 Million
+78.80%
2023-12-31 CN¥203.19 Million
≈ $29.73 Million
+60.15%
2022-12-31 CN¥126.88 Million
≈ $18.57 Million
-16.94%
2021-12-31 CN¥152.75 Million
≈ $22.35 Million
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About Jiangsu HHCK Advanced Materials Co. Ltd. A

SHG:688535 China Semiconductor Equipment & Materials
Market Cap
$3.18 Billion
CN¥21.71 Billion CNY
Market Cap Rank
#4850 Global
#884 in China
Share Price
CN¥152.90
Change (1 day)
+14.13%
52-Week Range
CN¥77.90 - CN¥152.90
All Time High
CN¥152.90
About

Jiangsu HHCK Advanced Materials Co., Ltd. engages in the research, development, production, and sale of semiconductor packaging materials, such as epoxy molding compounds and electronic adhesives in China. The company offers semiconductor devices, integrated circuits, special devices, and LEDs, as well as electronic packaging materials, such as brackets. Its products are used in semiconductor pac… Read more