VIA Labs Inc (6756) - Total Liabilities
Based on the latest financial reports, VIA Labs Inc (6756) has total liabilities worth NT$892.31 Million TWD (≈ $28.11 Million USD) as of September 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore how efficiently does VIA Labs Inc generate cash to assess how effectively this company generates cash.
VIA Labs Inc - Total Liabilities Trend (2015–2024)
This chart illustrates how VIA Labs Inc's total liabilities have evolved over time, based on quarterly financial data. Check how resilient are VIA Labs Inc's assets to evaluate the company's liquid asset resilience ratio.
VIA Labs Inc Competitors by Total Liabilities
The table below lists competitors of VIA Labs Inc ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Kongsberg Automotive Holding ASA
OL:KOA
|
Norway | Nkr384.50 Million |
|
Mayer Steel Pipe Corp
TW:2020
|
Taiwan | NT$5.07 Billion |
|
Indian Hume Pipe Company Limited
NSE:INDIANHUME
|
India | Rs13.50 Billion |
|
Melar Acquisition Corp. I Unit
NASDAQ:MACIU
|
USA | $10.89 Million |
|
Copley Acquisition Corp
NYSE:COPL
|
USA | $5.35 Million |
|
HIL Limited
NSE:HIL
|
India | Rs17.14 Billion |
|
Sonadezi Chau Duc Shareholding Co
VN:SZC
|
Vietnam | ₫4.97 Trillion |
|
Lanvin Group Holdings Limited
NYSE:LANV
|
USA | $693.10 Million |
Liability Composition Analysis (2015–2024)
This chart breaks down VIA Labs Inc's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see market value of VIA Labs Inc.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 1.60 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.32 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.24 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how VIA Labs Inc's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for VIA Labs Inc (2015–2024)
The table below shows the annual total liabilities of VIA Labs Inc from 2015 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | NT$884.62 Million ≈ $27.87 Million |
+17.94% |
| 2023-12-31 | NT$750.07 Million ≈ $23.63 Million |
+15.85% |
| 2022-12-31 | NT$647.44 Million ≈ $20.40 Million |
-25.87% |
| 2021-12-31 | NT$873.41 Million ≈ $27.52 Million |
+106.14% |
| 2020-12-31 | NT$423.70 Million ≈ $13.35 Million |
+9.62% |
| 2019-12-31 | NT$386.50 Million ≈ $12.18 Million |
+30.35% |
| 2018-12-31 | NT$296.50 Million ≈ $9.34 Million |
-8.39% |
| 2017-12-31 | NT$323.66 Million ≈ $10.20 Million |
+27.75% |
| 2016-12-31 | NT$253.36 Million ≈ $7.98 Million |
-13.35% |
| 2015-12-31 | NT$292.40 Million ≈ $9.21 Million |
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About VIA Labs Inc
VIA Labs, Inc., together with its subsidiaries, engages in the programming, designing, manufacturing, and sale of USB and USB power delivery controllers for multi-functional devices and platforms in Taiwan, Hong Kong, China, Japan, Europe, and internationally. The company offers host, hub, and SATA bridge controllers; USB type-C products, including electronic markers, display port alternate mode … Read more