Grand Plastic Technology Total Liabilities

Latest as of June 2026: NT$12.17 Billion TWD ≈ $383.42 Million USD

Grand Plastic Technology total liabilities. Based on the latest financial reports, Grand Plastic Technology (3131) has total liabilities worth NT$12.17 Billion TWD (≈ $383.42 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Grand Plastic Technology asset resilience ratio to evaluate the company's liquid asset resilience ratio.

Total Liabilities of Grand Plastic Technology (2017–2025)

Total liabilities of Grand Plastic Technology from 2017 to 2025. This chart illustrates how Grand Plastic Technology's total liabilities have evolved over time, based on quarterly financial data.

Grand Plastic Technology Competitors by Total Liabilities

The table below lists competitors of Grand Plastic Technology ranked by their total liabilities.

Company Country Total Liabilities
Ruentex Engineering & Construction Co Ltd
TW:2597
Taiwan NT$15.91 Billion
Pebblebrook Hotel Trust
NYSE:PEB
USA $2.77 Billion
SBT Ultrasonic Technology Co. Ltd. A
SHG:688392
China CN¥784.87 Million
PHARVARIS N.V. EO -12
F:9EN
Germany €30.18 Million
Polaris Bay Group Co Ltd
SHG:600155
China CN¥49.24 Billion
National Bank Holdings Corporation
NYSE:NBHC
USA $10.92 Billion
Nuvation Bio Inc
NYSE:NUVB
USA $490.64 Million
CSC Financial Co. Ltd
F:CS0
Germany €734.67 Billion

Liability Composition Analysis (2017–2025)

This chart breaks down Grand Plastic Technology's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see 3131 total assets.

Liquidity & Leverage Metrics

Grand Plastic Technology Total Liabilities Ratios Explained

Grand Plastic Technology total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 1.30 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 3.85 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.79 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Grand Plastic Technology's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Grand Plastic Technology (2017–2025)

The table below shows the annual total liabilities of Grand Plastic Technology from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 NT$8.17 Billion
≈ $257.47 Million
+41.25%
2024-12-31 NT$5.79 Billion
≈ $182.28 Million
+45.48%
2023-12-31 NT$3.98 Billion
≈ $125.29 Million
+13.34%
2022-12-31 NT$3.51 Billion
≈ $110.55 Million
+17.38%
2021-12-31 NT$2.99 Billion
≈ $94.18 Million
+19.30%
2020-12-31 NT$2.51 Billion
≈ $78.94 Million
+18.17%
2019-12-31 NT$2.12 Billion
≈ $66.80 Million
+6.66%
2018-12-31 NT$1.99 Billion
≈ $62.63 Million
+5.98%
2017-12-31 NT$1.88 Billion
≈ $59.09 Million
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About Grand Plastic Technology

TWO:3131 Taiwan Semiconductor Equipment & Materials
Market Cap
$1.67 Billion
NT$52.94 Billion TWD
Market Cap Rank
#6531 Global
#208 in Taiwan
Share Price
NT$1880.00
Change (1 day)
-6.00%
52-Week Range
NT$1335.00 - NT$3905.00
All Time High
NT$3905.00
About

Grand Process Technology Corporation manufactures and sells semiconductor equipment in Taiwan. The company offers single wafer spin processor, batch type wet bench system, and combo system for advanced IC packaging, IC front end of line, and optoelectronics applications. Grand Process Technology Corporation was founded in 1993 and is headquartered in Hsinchu City, Taiwan.