Niching Industrial (3444) - Total Liabilities

Latest as of June 2025: NT$461.72 Million TWD ≈ $14.55 Million USD

Based on the latest financial reports, Niching Industrial (3444) has total liabilities worth NT$461.72 Million TWD (≈ $14.55 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Niching Industrial (3444) asset resilience to evaluate the company's liquid asset resilience ratio.

Niching Industrial - Total Liabilities Trend (2017–2024)

This chart illustrates how Niching Industrial's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see Niching Industrial total assets.

Niching Industrial Competitors by Total Liabilities

The table below lists competitors of Niching Industrial ranked by their total liabilities.

Company Country Total Liabilities
Norooholdings
KO:000320
Korea ₩463.91 Billion
Digital Currency X Technology Inc.
NASDAQ:DCX
USA $709.20 Million
Brouwerij Handelsmaatschappij NV
BR:COBH
Belgium €68.08 Million
Atakey Patates Gida Sanayi ve Ticaret A.S.
IS:ATAKP
Turkey TL1.03 Billion
Loyalty Founder Enterprise Co Ltd
TWO:5465
Taiwan NT$1.87 Billion
Global Fashion Group SA
XETRA:GFG
Germany €373.80 Million
Phu Tai JSC
VN:PTB
Vietnam ₫2.89 Trillion
Yieh Hsing Enterprise Co Ltd
TW:2007
Taiwan NT$8.22 Billion

Liability Composition Analysis (2017–2024)

This chart breaks down Niching Industrial's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See Niching Industrial (3444) balance sheet quality index to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 2.33 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.46 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.32 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Niching Industrial's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Niching Industrial (2017–2024)

The table below shows the annual total liabilities of Niching Industrial from 2017 to 2024.

Year Total Liabilities Change
2024-12-31 NT$438.22 Million
≈ $13.81 Million
+27.45%
2023-12-31 NT$343.83 Million
≈ $10.83 Million
-32.50%
2022-12-31 NT$509.40 Million
≈ $16.05 Million
+0.46%
2021-12-31 NT$507.09 Million
≈ $15.98 Million
-10.26%
2020-12-31 NT$565.07 Million
≈ $17.80 Million
+27.51%
2019-12-31 NT$443.15 Million
≈ $13.96 Million
+69.36%
2018-12-31 NT$261.67 Million
≈ $8.24 Million
-6.23%
2017-12-31 NT$279.04 Million
≈ $8.79 Million
--

About Niching Industrial

TWO:3444 Taiwan Semiconductor Equipment & Materials
Market Cap
$112.42 Million
NT$3.57 Billion TWD
Market Cap Rank
#18827 Global
#1018 in Taiwan
Share Price
NT$79.30
Change (1 day)
+2.72%
52-Week Range
NT$49.85 - NT$117.50
All Time High
NT$136.00
About

Niching Industrial Corporation manufactures, markets and sells semiconductor, flat panel display, LED, green energy, and nanotechnology products. It provides silver pastes products, including customized silver paste, pure and hybrid silver sintering paste, snap cure anisotropic conductive paste, conductive silver paste, and screen-printing silver paste; semiconductor package substrate, such as me… Read more