RF Materials Co. Ltd - Asset Resilience Ratio

Latest as of March 2026: 24.91%

RF Materials Co. Ltd (327260) has an Asset Resilience Ratio of 24.91% as of March 2026. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check RF Materials Co. Ltd strategic asset allocation index to assess the company's strategic physical and investment asset allocation.

Liquid Assets

₩32.97 Billion
≈ $22.34 Million USD Cash + Short-term Investments

Total Assets

₩132.37 Billion
≈ $89.70 Million USD All company assets

Resilience Assessment

Good
Financial Resilience Level

Asset Resilience Ratio Trend (2017–2025)

This chart shows how RF Materials Co. Ltd's Asset Resilience Ratio has changed over time. See debt-free asset ratio of RF Materials Co. Ltd to measure how much of total assets are equity-financed.

Liquid Assets Composition Over Time

This chart breaks down RF Materials Co. Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see RF Materials Co. Ltd market cap and net worth.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents ₩0.00 0%
Short-term Investments ₩32.97 Billion 24.91%
Total Liquid Assets ₩32.97 Billion 24.91%

Asset Resilience Insights

  • Good Liquidity Position: RF Materials Co. Ltd maintains a healthy 24.91% of assets in liquid form.
  • This level provides good financial flexibility while maintaining productive asset deployment.
  • The company has significant short-term investments, indicating active treasury management.

RF Materials Co. Ltd Industry Peers by Asset Resilience Ratio

Compare RF Materials Co. Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Lens Technology Co Ltd
SHE:300433
Electronic Components 1.43%
Elite Material Co Ltd
TW:2383
Electronic Components 0.00%
FangDa Carbon New Material Co Ltd
SHG:600516
Electronic Components 4.27%
Holitech Technology Co Ltd
SHE:002217
Electronic Components 0.87%
Shenzhen Jufei Optoelectronics
SHE:300303
Electronic Components 19.39%
TXC Corp
TW:3042
Electronic Components 6.15%
Guangdong Ellington Electronics Technology Co Ltd
SHG:603328
Electronic Components 4.13%
Suzhou GYZ Electronic Technology Co. Ltd. A
SHG:688260
Electronic Components 3.19%

Annual Asset Resilience Ratio for RF Materials Co. Ltd (2017–2025)

The table below shows the annual Asset Resilience Ratio data for RF Materials Co. Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2025-12-31 13.39% ₩17.16 Billion
≈ $11.63 Million
₩128.19 Billion
≈ $86.87 Million
-37.31pp
2024-12-31 50.70% ₩57.56 Billion
≈ $39.01 Million
₩113.53 Billion
≈ $76.94 Million
+4.54pp
2023-12-31 46.16% ₩44.79 Billion
≈ $30.35 Million
₩97.01 Billion
≈ $65.74 Million
+5.12pp
2022-12-31 41.04% ₩39.36 Billion
≈ $26.68 Million
₩95.91 Billion
≈ $65.00 Million
+2.43pp
2021-12-31 38.61% ₩27.52 Billion
≈ $18.65 Million
₩71.29 Billion
≈ $48.31 Million
+5.51pp
2020-12-31 33.10% ₩19.40 Billion
≈ $13.15 Million
₩58.62 Billion
≈ $39.72 Million
-17.43pp
2019-12-31 50.52% ₩15.03 Billion
≈ $10.19 Million
₩29.75 Billion
≈ $20.16 Million
+24.90pp
2018-12-31 25.63% ₩4.56 Billion
≈ $3.09 Million
₩17.79 Billion
≈ $12.06 Million
+7.67pp
2017-12-31 17.95% ₩2.10 Billion
≈ $1.42 Million
₩11.70 Billion
≈ $7.93 Million
--
pp = percentage points

About RF Materials Co. Ltd

KQ:327260 Korea Electronic Components
Market Cap
$362.63 Million
₩535.10 Billion KRW
Market Cap Rank
#14015 Global
#446 in Korea
Share Price
₩63000.00
Change (1 day)
-3.08%
52-Week Range
₩5690.00 - ₩119500.00
All Time High
₩119500.00
About

RF Materials Co., Ltd. develops, produces, and sells optical communication packages in Korea and internationally. It offers packages for RF and microwave, optical communication, and laser module; ceramic packages and substrates and HTCC multilayer ceramics technologies; and laser module, including fiber coupled diode lasers, single bar diode lasers, and diode laser bar stacks. RF Materials Co., L… Read more