RF Materials Co. Ltd Total Liabilities

Latest as of June 2026: ₩41.80 Billion KRW ≈ $28.33 Million USD

RF Materials Co. Ltd total liabilities. Based on the latest financial reports, RF Materials Co. Ltd (327260) has total liabilities worth ₩41.80 Billion KRW (≈ $28.33 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check RF Materials Co. Ltd (327260) liquid assets ratio to evaluate the company's liquid asset resilience ratio.

Total Liabilities of RF Materials Co. Ltd (2017–2025)

Total liabilities of RF Materials Co. Ltd from 2017 to 2025. This chart illustrates how RF Materials Co. Ltd's total liabilities have evolved over time, based on quarterly financial data.

RF Materials Co. Ltd Competitors by Total Liabilities

The table below lists competitors of RF Materials Co. Ltd ranked by their total liabilities.

Company Country Total Liabilities
Shenzhen Crastal Technology Co Ltd
SHE:300824
China CN¥289.79 Million
Plasson Indus
TA:PLSN
Israel ILA989.96 Million
Winner Information Technology Co Inc
SHE:300609
China CN¥286.87 Million
Zhenhai PetroChem Engineering
SHG:603637
China CN¥265.87 Million
MT Hoejgaard Holding A/S
CO:MTHH
Denmark Dkr2.80 Billion
Eczacibasi Yatirim Holding Ortakligi AS
IS:ECZYT
Turkey TL789.70 Million
Shenzhen Zhilai Sci and Tech Co Ltd
SHE:300771
China CN¥379.94 Million
Beijing AriTime Intelligent Control Co Ltd
SHG:600560
China CN¥1.43 Billion

Liability Composition Analysis (2017–2025)

This chart breaks down RF Materials Co. Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see how large is RF Materials Co. Ltd's balance sheet.

Liquidity & Leverage Metrics

RF Materials Co. Ltd Total Liabilities Ratios Explained

RF Materials Co. Ltd total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 3.33 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.48 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.25 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how RF Materials Co. Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for RF Materials Co. Ltd (2017–2025)

The table below shows the annual total liabilities of RF Materials Co. Ltd from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 ₩41.80 Billion
≈ $28.33 Million
-42.31%
2024-12-31 ₩72.46 Billion
≈ $49.10 Million
+95.30%
2023-12-31 ₩37.10 Billion
≈ $25.14 Million
-30.02%
2022-12-31 ₩53.02 Billion
≈ $35.93 Million
+45.68%
2021-12-31 ₩36.39 Billion
≈ $24.66 Million
+23.62%
2020-12-31 ₩29.44 Billion
≈ $19.95 Million
+625.61%
2019-12-31 ₩4.06 Billion
≈ $2.75 Million
-13.37%
2018-12-31 ₩4.68 Billion
≈ $3.17 Million
-1.93%
2017-12-31 ₩4.78 Billion
≈ $3.24 Million
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About RF Materials Co. Ltd

KQ:327260 Korea Electronic Components
Market Cap
$346.80 Million
₩511.74 Billion KRW
Market Cap Rank
#13802 Global
#407 in Korea
Share Price
₩28450.00
Change (1 day)
-12.06%
52-Week Range
₩15650.00 - ₩119500.00
All Time High
₩119500.00
About

RF Materials Co., Ltd. develops, produces, and sells optical communication packages in Korea and internationally. It offers packages for RF and microwave, optical communication, and laser module; ceramic packages and substrates and HTCC multilayer ceramics technologies; and laser module, including fiber coupled diode lasers, single bar diode lasers, and diode laser bar stacks. RF Materials Co., L… Read more