Holitech Technology Co Ltd - Asset Resilience Ratio
Holitech Technology Co Ltd (002217) has an Asset Resilience Ratio of 0.87% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. Check Holitech Technology Co Ltd PP&E and investment ratio to assess the company's strategic physical and investment asset allocation.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2005–2023)
This chart shows how Holitech Technology Co Ltd's Asset Resilience Ratio has changed over time. See net asset quality index of Holitech Technology Co Ltd to measure how much of total assets are equity-financed.
Liquid Assets Composition Over Time
This chart breaks down Holitech Technology Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see Holitech Technology Co Ltd market cap and net worth.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | CN¥0.00 | 0% |
| Short-term Investments | CN¥22.01 Million | 0.87% |
| Total Liquid Assets | CN¥22.01 Million | 0.87% |
Asset Resilience Insights
- Limited Liquidity: Holitech Technology Co Ltd maintains only 0.87% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Holitech Technology Co Ltd Industry Peers by Asset Resilience Ratio
Compare Holitech Technology Co Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Lens Technology Co Ltd
SHE:300433 |
Electronic Components | 1.43% |
|
Elite Material Co Ltd
TW:2383 |
Electronic Components | 0.00% |
|
FangDa Carbon New Material Co Ltd
SHG:600516 |
Electronic Components | 4.27% |
|
Shenzhen Jufei Optoelectronics
SHE:300303 |
Electronic Components | 19.39% |
|
TXC Corp
TW:3042 |
Electronic Components | 6.15% |
|
Guangdong Ellington Electronics Technology Co Ltd
SHG:603328 |
Electronic Components | 4.13% |
|
Suzhou GYZ Electronic Technology Co. Ltd. A
SHG:688260 |
Electronic Components | 3.19% |
|
Shenzhen Sunmoon Microelectronics Co. Ltd. A
SHG:688699 |
Electronic Components | 5.83% |
Annual Asset Resilience Ratio for Holitech Technology Co Ltd (2005–2023)
The table below shows the annual Asset Resilience Ratio data for Holitech Technology Co Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2023-12-31 | -3.91% | CN¥-299.23 Million ≈ $-43.79 Million |
CN¥7.65 Billion ≈ $1.12 Billion |
-4.13pp |
| 2022-12-31 | 0.22% | CN¥50.00 Million ≈ $7.32 Million |
CN¥23.25 Billion ≈ $3.40 Billion |
+2.38pp |
| 2021-12-31 | -2.17% | CN¥-635.45 Million ≈ $-92.99 Million |
CN¥29.31 Billion ≈ $4.29 Billion |
-2.19pp |
| 2020-12-31 | 0.02% | CN¥7.50 Million ≈ $1.10 Million |
CN¥30.37 Billion ≈ $4.44 Billion |
-0.03pp |
| 2019-12-31 | 0.05% | CN¥17.79 Million ≈ $2.60 Million |
CN¥34.28 Billion ≈ $5.02 Billion |
+2.77pp |
| 2018-12-31 | -2.71% | CN¥-744.59 Million ≈ $-108.96 Million |
CN¥27.43 Billion ≈ $4.01 Billion |
-2.81pp |
| 2016-12-31 | 0.10% | CN¥16.23 Million ≈ $2.38 Million |
CN¥17.00 Billion ≈ $2.49 Billion |
-0.24pp |
| 2008-12-31 | 0.33% | CN¥3.09 Million ≈ $452.81K |
CN¥930.18 Million ≈ $136.11 Million |
+0.30pp |
| 2005-12-31 | 0.03% | CN¥100.00K ≈ $14.63K |
CN¥303.24 Million ≈ $44.37 Million |
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About Holitech Technology Co Ltd
Holitech Technology Co., Ltd. engages in the manufacture and sale of components for smart terminals in China and internationally. The company offers display modules, touch panels, cover glass, photoelectric sensor products, camera and fingerprint identification modules, electronic paper eco-chain modules, backlight modules, flexible circuit boards, and application products. Its products are used … Read more