Holitech Technology Co Ltd - Asset Resilience Ratio

Latest as of September 2025: 0.87%

Holitech Technology Co Ltd (002217) has an Asset Resilience Ratio of 0.87% as of September 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.

Liquid Assets

CN¥22.01 Million
≈ $3.22 Million USD Cash + Short-term Investments

Total Assets

CN¥2.52 Billion
≈ $368.37 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2005–2023)

This chart shows how Holitech Technology Co Ltd's Asset Resilience Ratio has changed over time. Check Holitech Technology Co Ltd PP&E and investment ratio to assess the company's strategic physical and investment asset allocation.

Liquid Assets Composition Over Time

This chart breaks down Holitech Technology Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see 002217 market cap overview.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents CN¥0.00 0%
Short-term Investments CN¥22.01 Million 0.87%
Total Liquid Assets CN¥22.01 Million 0.87%

Asset Resilience Insights

  • Limited Liquidity: Holitech Technology Co Ltd maintains only 0.87% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Holitech Technology Co Ltd Industry Peers by Asset Resilience Ratio

Compare Holitech Technology Co Ltd's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Taiwan Union Technology
TWO:6274
Electronic Components 8.46%
Anhui Tongguan Copper Foil Group Co. Ltd.
SHE:301217
Electronic Components 6.54%
Guangdong Fenghua Advanced Technology Holding Co Ltd
SHE:000636
Electronic Components 0.29%
WT Microelectronics Co Ltd
TW:3036
Electronic Components 0.05%
Zhejiang Crystal Optech Co Ltd
SHE:002273
Electronic Components 4.91%
Olympic Circuit Technology Co Ltd
SHG:603920
Electronic Components 23.19%
Guangdong Kingshine Electronic Tech
SHE:300903
Electronic Components 3.02%
Poco Holding Co Ltd
SHE:300811
Electronic Components 6.41%

Annual Asset Resilience Ratio for Holitech Technology Co Ltd (2005–2023)

The table below shows the annual Asset Resilience Ratio data for Holitech Technology Co Ltd.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2023-12-31 -3.91% CN¥-299.23 Million
≈ $-43.79 Million
CN¥7.65 Billion
≈ $1.12 Billion
-4.13pp
2022-12-31 0.22% CN¥50.00 Million
≈ $7.32 Million
CN¥23.25 Billion
≈ $3.40 Billion
+2.38pp
2021-12-31 -2.17% CN¥-635.45 Million
≈ $-92.99 Million
CN¥29.31 Billion
≈ $4.29 Billion
-2.19pp
2020-12-31 0.02% CN¥7.50 Million
≈ $1.10 Million
CN¥30.37 Billion
≈ $4.44 Billion
-0.03pp
2019-12-31 0.05% CN¥17.79 Million
≈ $2.60 Million
CN¥34.28 Billion
≈ $5.02 Billion
+2.77pp
2018-12-31 -2.71% CN¥-744.59 Million
≈ $-108.96 Million
CN¥27.43 Billion
≈ $4.01 Billion
-2.81pp
2016-12-31 0.10% CN¥16.23 Million
≈ $2.38 Million
CN¥17.00 Billion
≈ $2.49 Billion
-0.24pp
2008-12-31 0.33% CN¥3.09 Million
≈ $452.81K
CN¥930.18 Million
≈ $136.11 Million
+0.30pp
2005-12-31 0.03% CN¥100.00K
≈ $14.63K
CN¥303.24 Million
≈ $44.37 Million
--
pp = percentage points

About Holitech Technology Co Ltd

SHE:002217 China Electronic Components
Market Cap
$1.62 Billion
CN¥11.07 Billion CNY
Market Cap Rank
#6839 Global
#1398 in China
Share Price
CN¥1.48
Change (1 day)
+1.37%
52-Week Range
CN¥1.38 - CN¥4.06
All Time High
CN¥12.45
About

Holitech Technology Co., Ltd. engages in the manufacture and sale of components for smart terminals in China and internationally. The company offers display modules, touch panels, cover glass, photoelectric sensor products, camera and fingerprint identification modules, electronic paper eco-chain modules, backlight modules, flexible circuit boards, and application products. Its products are used … Read more