Taiwan Semiconductor Manufacturing Co. Ltd. - Asset Resilience Ratio
Taiwan Semiconductor Manufacturing Co. Ltd. (2330) has an Asset Resilience Ratio of 3.79% as of December 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Taiwan Semiconductor Manufacturing Co. L (2330) working capital ratio to evaluate short-term liquidity relative to the company's equity base.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (1997–2025)
This chart shows how Taiwan Semiconductor Manufacturing Co. Ltd.'s Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see 2330 total asset value.
Liquid Assets Composition Over Time
This chart breaks down Taiwan Semiconductor Manufacturing Co. Ltd.'s liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Explore 2330 long-term asset investment ratio to see how much of total assets are deployed in long-term investments.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$300.74 Billion | 3.79% |
| Total Liquid Assets | NT$300.74 Billion | 3.79% |
Asset Resilience Insights
- Limited Liquidity: Taiwan Semiconductor Manufacturing Co. Ltd. maintains only 3.79% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Taiwan Semiconductor Manufacturing Co. Ltd. Industry Peers by Asset Resilience Ratio
Compare Taiwan Semiconductor Manufacturing Co. Ltd.'s asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
Semiconductor Manufacturing Intl Co
SHG:688981 |
Semiconductors | 8.67% |
|
Winbond Electronics Corp
TW:2344 |
Semiconductors | 13.01% |
|
Yuanjie Semiconductor Technology Co. Ltd. A
SHG:688498 |
Semiconductors | 6.43% |
|
Sitime Corporation
NASDAQ:SITM |
Semiconductors | 0.00% |
|
Shannon Semiconductor Technology Co Ltd
SHE:300475 |
Semiconductors | 0.63% |
|
Ingenic Semiconductor
SHE:300223 |
Semiconductors | 9.74% |
|
Goke Microelectronics Co Ltd
SHE:300672 |
Semiconductors | 27.13% |
|
Asmedia Technology Inc
TW:5269 |
Semiconductors | 6.00% |
Annual Asset Resilience Ratio for Taiwan Semiconductor Manufacturing Co. Ltd. (1997–2025)
The table below shows the annual Asset Resilience Ratio data for Taiwan Semiconductor Manufacturing Co. Ltd..
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 3.79% | NT$300.74 Billion ≈ $9.47 Billion |
NT$7.93 Trillion ≈ $249.93 Billion |
-1.55pp |
| 2024-12-31 | 5.34% | NT$357.52 Billion ≈ $11.26 Billion |
NT$6.69 Trillion ≈ $210.83 Billion |
+0.83pp |
| 2023-12-31 | 4.51% | NT$249.38 Billion ≈ $7.86 Billion |
NT$5.53 Trillion ≈ $174.29 Billion |
-0.40pp |
| 2022-12-31 | 4.91% | NT$243.69 Billion ≈ $7.68 Billion |
NT$4.96 Trillion ≈ $156.41 Billion |
+1.15pp |
| 2021-12-31 | 3.76% | NT$139.92 Billion ≈ $4.41 Billion |
NT$3.73 Trillion ≈ $117.37 Billion |
-1.31pp |
| 2020-12-31 | 5.06% | NT$139.72 Billion ≈ $4.40 Billion |
NT$2.76 Trillion ≈ $86.97 Billion |
-1.07pp |
| 2019-12-31 | 6.13% | NT$138.90 Billion ≈ $4.38 Billion |
NT$2.26 Trillion ≈ $71.35 Billion |
-0.37pp |
| 2018-12-31 | 6.50% | NT$135.94 Billion ≈ $4.28 Billion |
NT$2.09 Trillion ≈ $65.85 Billion |
+1.32pp |
| 2017-12-31 | 5.18% | NT$103.19 Billion ≈ $3.25 Billion |
NT$1.99 Trillion ≈ $62.75 Billion |
+0.15pp |
| 2016-12-31 | 5.03% | NT$94.95 Billion ≈ $2.99 Billion |
NT$1.89 Trillion ≈ $59.43 Billion |
+3.36pp |
| 2015-12-31 | 1.68% | NT$27.78 Billion ≈ $875.14 Million |
NT$1.66 Trillion ≈ $52.22 Billion |
-3.81pp |
| 2014-12-31 | 5.48% | NT$81.95 Billion ≈ $2.58 Billion |
NT$1.49 Trillion ≈ $47.10 Billion |
+5.23pp |
| 2013-12-31 | 0.25% | NT$3.15 Billion ≈ $99.21 Million |
NT$1.26 Trillion ≈ $39.79 Billion |
-0.58pp |
| 2012-12-31 | 0.83% | NT$7.98 Billion ≈ $251.44 Million |
NT$961.34 Billion ≈ $30.29 Billion |
-0.17pp |
| 2011-12-31 | 1.00% | NT$7.77 Billion ≈ $244.70 Million |
NT$779.54 Billion ≈ $24.56 Billion |
-3.83pp |
| 2010-12-31 | 4.83% | NT$34.71 Billion ≈ $1.09 Billion |
NT$718.93 Billion ≈ $22.65 Billion |
+0.39pp |
| 2009-12-31 | 4.43% | NT$26.37 Billion ≈ $830.82 Million |
NT$594.70 Billion ≈ $18.74 Billion |
+1.08pp |
| 2008-12-31 | 3.35% | NT$18.75 Billion ≈ $590.67 Million |
NT$558.92 Billion ≈ $17.61 Billion |
-10.35pp |
| 2007-12-31 | 13.70% | NT$78.23 Billion ≈ $2.46 Billion |
NT$570.93 Billion ≈ $17.99 Billion |
+2.22pp |
| 2006-12-31 | 11.48% | NT$68.19 Billion ≈ $2.15 Billion |
NT$593.96 Billion ≈ $18.71 Billion |
+2.36pp |
| 2005-12-31 | 9.12% | NT$47.54 Billion ≈ $1.50 Billion |
NT$521.06 Billion ≈ $16.42 Billion |
-1.71pp |
| 2004-12-31 | 10.83% | NT$54.20 Billion ≈ $1.71 Billion |
NT$500.25 Billion ≈ $15.76 Billion |
+7.49pp |
| 2003-12-31 | 3.34% | NT$13.58 Billion ≈ $427.92 Million |
NT$406.72 Billion ≈ $12.81 Billion |
+3.29pp |
| 2002-12-31 | 0.04% | NT$173.91 Million ≈ $5.48 Million |
NT$391.20 Billion ≈ $12.32 Billion |
-0.59pp |
| 2001-12-31 | 0.64% | NT$2.50 Billion ≈ $78.70 Million |
NT$390.74 Billion ≈ $12.31 Billion |
+0.01pp |
| 2000-12-31 | 0.63% | NT$2.35 Billion ≈ $74.09 Million |
NT$370.89 Billion ≈ $11.68 Billion |
+0.22pp |
| 1999-12-31 | 0.41% | NT$965.52 Million ≈ $30.42 Million |
NT$235.47 Billion ≈ $7.42 Billion |
-3.79pp |
| 1998-12-31 | 4.20% | NT$5.90 Billion ≈ $185.75 Million |
NT$140.53 Billion ≈ $4.43 Billion |
+0.15pp |
| 1997-12-31 | 4.05% | NT$5.06 Billion ≈ $159.44 Million |
NT$124.96 Billion ≈ $3.94 Billion |
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About Taiwan Semiconductor Manufacturing Co. Ltd.
Taiwan Semiconductor Manufacturing Company Limited, together with its subsidiaries, manufactures, packages, tests, and sells integrated circuits and other semiconductor devices in Taiwan, China, Europe, the Middle East, Africa, Japan, the United States, and internationally. It provides various wafer fabrication processes, such as processes to manufacture complementary metal- oxide-semiconductor (… Read more