Taiwan IC Packaging
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more
Taiwan IC Packaging - Asset Resilience Ratio
Taiwan IC Packaging (3372) has an Asset Resilience Ratio of 3.17% as of June 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2016–2024)
This chart shows how Taiwan IC Packaging's Asset Resilience Ratio has changed over time. Compare with other companies' asset resilience ratios.
Liquid Assets Composition Over Time
This chart breaks down Taiwan IC Packaging's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$59.40 Million | 3.17% |
| Total Liquid Assets | NT$59.40 Million | 3.17% |
Asset Resilience Insights
- Limited Liquidity: Taiwan IC Packaging maintains only 3.17% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Taiwan IC Packaging Industry Peers by Asset Resilience Ratio
Compare Taiwan IC Packaging's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
SK Hynix Inc
KO:000660 |
Semiconductors | 11.59% |
|
UniTTEC Co Ltd
SHE:000925 |
Semiconductors | 1.07% |
|
DB HiTek Co Ltd
KO:000990 |
Semiconductors | 28.18% |
|
Zhejiang Chengchang Technology Co. Ltd.
SHE:001270 |
Semiconductors | 1.98% |
|
Shenzhen Techwinsemi Technology Co. Ltd.
SHE:001309 |
Semiconductors | 1.90% |
|
Unigroup Guoxin Microelectronics Co Ltd
SHE:002049 |
Semiconductors | 8.76% |
|
Sinosteel Anhui Tianyuan Technology Co Ltd
SHE:002057 |
Semiconductors | 0.04% |
|
Suzhou Good-Ark Electronics Co Ltd
SHE:002079 |
Semiconductors | 17.01% |
Annual Asset Resilience Ratio for Taiwan IC Packaging (2016–2024)
The table below shows the annual Asset Resilience Ratio data for Taiwan IC Packaging.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2024-12-31 | 8.04% | NT$159.40 Million | NT$1.98 Billion | +5.71pp |
| 2023-12-31 | 2.33% | NT$49.50 Million | NT$2.13 Billion | -2.27pp |
| 2022-12-31 | 4.59% | NT$108.90 Million | NT$2.37 Billion | -2.56pp |
| 2021-12-31 | 7.16% | NT$188.10 Million | NT$2.63 Billion | -3.35pp |
| 2020-12-31 | 10.51% | NT$227.79 Million | NT$2.17 Billion | -1.33pp |
| 2019-12-31 | 11.84% | NT$247.50 Million | NT$2.09 Billion | +2.45pp |
| 2018-12-31 | 9.40% | NT$193.50 Million | NT$2.06 Billion | +5.06pp |
| 2017-12-31 | 4.34% | NT$118.80 Million | NT$2.74 Billion | +0.02pp |
| 2016-12-31 | 4.32% | NT$158.40 Million | NT$3.66 Billion | -- |