Taiwan IC Packaging (3372) - Total Assets
Based on the latest financial reports, Taiwan IC Packaging (3372) holds total assets worth NT$1.88 Billion TWD (≈ $59.08 Million USD) as of June 2025. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. See 3372 total equity for net asset value and shareholders' equity analysis.
Taiwan IC Packaging - Total Assets Trend (2016–2024)
This chart illustrates how Taiwan IC Packaging's total assets have evolved over time, based on quarterly financial data.
Taiwan IC Packaging - Asset Composition Analysis
Current Asset Composition (December 2024)
Taiwan IC Packaging's total assets of NT$1.88 Billion consist of 43.2% current assets and 56.8% non-current assets.
| Asset Category | Amount (TWD) | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 15.8% |
| Accounts Receivable | NT$169.83 Million | 8.6% |
| Inventory | NT$153.19 Million | 7.7% |
| Property, Plant & Equipment | NT$0.00 | 0.0% |
| Intangible Assets | NT$0.00 | 0.0% |
| Goodwill | NT$0.00 | 0.0% |
Asset Composition Trend (2016–2024)
This chart illustrates how Taiwan IC Packaging's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see Taiwan IC Packaging stock valuation.
Key Asset Composition Facts
- Current vs. Non-Current Assets: Taiwan IC Packaging's current assets represent 43.2% of total assets in 2024, a decrease from 47.0% in 2016.
- Cash Position: Cash and equivalents constituted 15.8% of total assets in 2024, down from 28.6% in 2016.
- Tangible vs. Intangible: Intangible assets (including goodwill) make up 0.0% of total assets, unchanged from 0.0% in 2016.
- Asset Diversification: The largest asset category is accounts receivable at 8.6% of total assets.
Taiwan IC Packaging Competitors by Total Assets
Key competitors of Taiwan IC Packaging based on total assets are shown below.
| Company | Country | Total Assets |
|---|---|---|
|
NVIDIA Corporation
NASDAQ:NVDA
|
USA | $206.80 Billion |
|
Broadcom Inc
NASDAQ:AVGO
|
USA | $169.90 Billion |
|
MediaTek Inc
TW:2454
|
Taiwan | NT$743.78 Billion |
|
Shannon Semiconductor Technology Co Ltd
SHE:300475
|
China | CN¥8.98 Billion |
|
Sitime Corporation
NASDAQ:SITM
|
USA | $1.29 Billion |
|
Shanghai V-Test Semiconductor Tech Co. Ltd. A
SHG:688372
|
China | CN¥6.32 Billion |
|
Airoha Technology Corp
TW:6526
|
Taiwan | NT$27.98 Billion |
|
Melexis NV
BR:MELE
|
Belgium | €903.27 Million |
Taiwan IC Packaging - Liquidity and Working Capital Analysis
Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.
Key Liquidity Metrics
| Metric | Current | 1 Year Ago | 5 Years Ago |
|---|---|---|---|
| Current Ratio | 3.51 | 5.32 | 3.69 |
| Quick Ratio | 2.81 | 4.45 | 2.85 |
| Cash Ratio | 0.00 | 0.00 | 0.00 |
| Working Capital | NT$572.77 Million | NT$769.22 Million | NT$654.33 Million |
Taiwan IC Packaging - Advanced Valuation Insights
This section examines the relationship between Taiwan IC Packaging's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.
Key Valuation Metrics
| Current Price-to-Book Ratio | 2.49 |
| Latest Market Cap to Assets Ratio | 0.05 |
| Asset Growth Rate (YoY) | -6.7% |
| Total Assets | NT$1.98 Billion |
| Market Capitalization | $102.19 Million USD |
Valuation Analysis
Below Book Valuation: The market values Taiwan IC Packaging's assets below their book value (0.05x), which may indicate investor concerns about asset quality or future growth.
Significant Asset Reduction: Taiwan IC Packaging's assets decreased by 6.7% over the past year, potentially indicating divestiture, restructuring, or challenging business conditions.
Annual Total Assets for Taiwan IC Packaging (2016–2024)
The table below shows the annual total assets of Taiwan IC Packaging from 2016 to 2024.
| Year | Total Assets | Change |
|---|---|---|
| 2024-12-31 | NT$1.98 Billion ≈ $62.49 Million |
-6.75% |
| 2023-12-31 | NT$2.13 Billion ≈ $67.01 Million |
-10.27% |
| 2022-12-31 | NT$2.37 Billion ≈ $74.67 Million |
-9.81% |
| 2021-12-31 | NT$2.63 Billion ≈ $82.79 Million |
+21.27% |
| 2020-12-31 | NT$2.17 Billion ≈ $68.27 Million |
+3.69% |
| 2019-12-31 | NT$2.09 Billion ≈ $65.84 Million |
+1.49% |
| 2018-12-31 | NT$2.06 Billion ≈ $64.87 Million |
-24.76% |
| 2017-12-31 | NT$2.74 Billion ≈ $86.23 Million |
-25.30% |
| 2016-12-31 | NT$3.66 Billion ≈ $115.42 Million |
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About Taiwan IC Packaging
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more