Taiwan IC Packaging (3372) - Total Assets

Latest as of June 2025: NT$1.88 Billion TWD ≈ $59.08 Million USD

Based on the latest financial reports, Taiwan IC Packaging (3372) holds total assets worth NT$1.88 Billion TWD (≈ $59.08 Million USD) as of June 2025. Total assets represent everything the company owns and controls, combining both current assets—like cash and cash equivalents, accounts receivable, and inventories—and non-current assets such as property, plant, equipment (PP&E), intangible assets, and long-term investments. Check 3372 total capital reinvestment ratio to assess the company's total reinvestment commitment from operating cash flow.

Taiwan IC Packaging - Total Assets Trend (2016–2024)

This chart illustrates how Taiwan IC Packaging's total assets have evolved over time, based on quarterly financial data. Check Taiwan IC Packaging (3372) cash earnings ratio to evaluate the quality of earnings relative to operating cash generation.

Taiwan IC Packaging - Asset Composition Analysis

Current Asset Composition (December 2024)

Taiwan IC Packaging's total assets of NT$1.88 Billion consist of 43.2% current assets and 56.8% non-current assets.

Asset Category Amount (TWD) % of Total Assets
Cash & Equivalents NT$0.00 15.8%
Accounts Receivable NT$169.83 Million 8.6%
Inventory NT$153.19 Million 7.7%
Property, Plant & Equipment NT$0.00 0.0%
Intangible Assets NT$0.00 0.0%
Goodwill NT$0.00 0.0%

Asset Composition Trend (2016–2024)

This chart illustrates how Taiwan IC Packaging's asset composition has evolved over time. Understanding changes in asset allocation can provide insights into the company's strategic shifts, capital allocation priorities, and business focus evolution. For live market cap, price, and company overview, see Taiwan IC Packaging stock valuation.

Key Asset Composition Facts

  • Current vs. Non-Current Assets: Taiwan IC Packaging's current assets represent 43.2% of total assets in 2024, a decrease from 47.0% in 2016.
  • Cash Position: Cash and equivalents constituted 15.8% of total assets in 2024, down from 28.6% in 2016.
  • Tangible vs. Intangible: Intangible assets (including goodwill) make up 0.0% of total assets, unchanged from 0.0% in 2016.
  • Asset Diversification: The largest asset category is accounts receivable at 8.6% of total assets.

Taiwan IC Packaging Competitors by Total Assets

Key competitors of Taiwan IC Packaging based on total assets are shown below.

Company Country Total Assets
Cambricon Technologies Corp Ltd
SHG:688256
China CN¥15.40 Billion
Aspeed Technology
TWO:5274
Taiwan NT$10.33 Billion
Sanan Optoelectronics Co Ltd
SHG:600703
China CN¥57.72 Billion
Yangzhou Yangjie Electronic Technology Co Ltd
SHE:300373
China CN¥16.93 Billion
SIGMASTAR TECH LTD
SHE:301536
China CN¥5.58 Billion
Changsha Jingjia Microelectronics Co Ltd
SHE:300474
China CN¥7.99 Billion
Union Semiconductor (Hefei) Co. Ltd. A
SHG:688403
China CN¥5.05 Billion
Bestechnic (Shanghai) Co. Ltd. A
SHG:688608
China CN¥7.49 Billion

Taiwan IC Packaging - Liquidity and Working Capital Analysis

Liquidity ratios measure a company's ability to pay off its short-term debts as they come due, using the company's current or quick assets. Working capital represents the operational liquidity available.

Key Liquidity Metrics

Metric Current 1 Year Ago 5 Years Ago
Current Ratio 3.51 5.32 3.69
Quick Ratio 2.81 4.45 2.85
Cash Ratio 0.00 0.00 0.00
Working Capital NT$572.77 Million NT$769.22 Million NT$654.33 Million

Taiwan IC Packaging - Advanced Valuation Insights

This section examines the relationship between Taiwan IC Packaging's asset base and its market valuation, helping to identify whether the company's assets are efficiently translated into market value.

Key Valuation Metrics

Current Price-to-Book Ratio 2.49
Latest Market Cap to Assets Ratio 0.06
Asset Growth Rate (YoY) -6.7%
Total Assets NT$1.98 Billion
Market Capitalization $109.92 Million USD

Valuation Analysis

Below Book Valuation: The market values Taiwan IC Packaging's assets below their book value (0.06x), which may indicate investor concerns about asset quality or future growth.

Significant Asset Reduction: Taiwan IC Packaging's assets decreased by 6.7% over the past year, potentially indicating divestiture, restructuring, or challenging business conditions.

Annual Total Assets for Taiwan IC Packaging (2016–2024)

The table below shows the annual total assets of Taiwan IC Packaging from 2016 to 2024.

Year Total Assets Change
2024-12-31 NT$1.98 Billion
≈ $62.49 Million
-6.75%
2023-12-31 NT$2.13 Billion
≈ $67.01 Million
-10.27%
2022-12-31 NT$2.37 Billion
≈ $74.67 Million
-9.81%
2021-12-31 NT$2.63 Billion
≈ $82.79 Million
+21.27%
2020-12-31 NT$2.17 Billion
≈ $68.27 Million
+3.69%
2019-12-31 NT$2.09 Billion
≈ $65.84 Million
+1.49%
2018-12-31 NT$2.06 Billion
≈ $64.87 Million
-24.76%
2017-12-31 NT$2.74 Billion
≈ $86.23 Million
-25.30%
2016-12-31 NT$3.66 Billion
≈ $115.42 Million
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About Taiwan IC Packaging

TWO:3372 Taiwan Semiconductors
Market Cap
$109.92 Million
NT$3.49 Billion TWD
Market Cap Rank
#18930 Global
#1049 in Taiwan
Share Price
NT$19.90
Change (1 day)
-2.21%
52-Week Range
NT$12.65 - NT$25.65
All Time High
NT$29.67
About

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more