Taiwan IC Packaging - Asset Resilience Ratio

Latest as of June 2025: 3.17%

Taiwan IC Packaging (3372) has an Asset Resilience Ratio of 3.17% as of June 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See 3372 working capital ratio to evaluate short-term liquidity relative to the company's equity base.

Liquid Assets

NT$59.40 Million
≈ $1.87 Million USD Cash + Short-term Investments

Total Assets

NT$1.88 Billion
≈ $59.08 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio Trend (2016–2024)

This chart shows how Taiwan IC Packaging's Asset Resilience Ratio has changed over time. For the complete balance sheet picture, see Taiwan IC Packaging balance sheet assets.

Liquid Assets Composition Over Time

This chart breaks down Taiwan IC Packaging's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. Read 3372 current and long-term liabilities for a breakdown of total debt and financial obligations.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents NT$0.00 0%
Short-term Investments NT$59.40 Million 3.17%
Total Liquid Assets NT$59.40 Million 3.17%

Asset Resilience Insights

  • Limited Liquidity: Taiwan IC Packaging maintains only 3.17% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Taiwan IC Packaging Industry Peers by Asset Resilience Ratio

Compare Taiwan IC Packaging's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
Zen Voce
TWO:3581
Semiconductors 3.91%
CML Microsystems Plc
LSE:CML
Semiconductors 2.96%
MACOM Technology Solutions Holdings Inc
NASDAQ:MTSI
Semiconductors 26.71%
Globalfoundries Inc
NASDAQ:GFS
Semiconductors 6.83%
SK HYNIX GDR 144A/REGS 1
F:HY9H
Semiconductors 11.48%
Edelteq Holdings Berhad
KLSE:0278
Semiconductors 30.33%
Charm Engine
KO:009310
Semiconductors 14.09%
UBIVELOX Inc
KQ:089850
Semiconductors 2.89%

Annual Asset Resilience Ratio for Taiwan IC Packaging (2016–2024)

The table below shows the annual Asset Resilience Ratio data for Taiwan IC Packaging.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 8.04% NT$159.40 Million
≈ $5.02 Million
NT$1.98 Billion
≈ $62.49 Million
+5.71pp
2023-12-31 2.33% NT$49.50 Million
≈ $1.56 Million
NT$2.13 Billion
≈ $67.01 Million
-2.27pp
2022-12-31 4.59% NT$108.90 Million
≈ $3.43 Million
NT$2.37 Billion
≈ $74.67 Million
-2.56pp
2021-12-31 7.16% NT$188.10 Million
≈ $5.93 Million
NT$2.63 Billion
≈ $82.79 Million
-3.35pp
2020-12-31 10.51% NT$227.79 Million
≈ $7.18 Million
NT$2.17 Billion
≈ $68.27 Million
-1.33pp
2019-12-31 11.84% NT$247.50 Million
≈ $7.80 Million
NT$2.09 Billion
≈ $65.84 Million
+2.45pp
2018-12-31 9.40% NT$193.50 Million
≈ $6.10 Million
NT$2.06 Billion
≈ $64.87 Million
+5.06pp
2017-12-31 4.34% NT$118.80 Million
≈ $3.74 Million
NT$2.74 Billion
≈ $86.23 Million
+0.02pp
2016-12-31 4.32% NT$158.40 Million
≈ $4.99 Million
NT$3.66 Billion
≈ $115.42 Million
--
pp = percentage points

About Taiwan IC Packaging

TWO:3372 Taiwan Semiconductors
Market Cap
$90.59 Million
NT$2.88 Billion TWD
Market Cap Rank
#20004 Global
#1155 in Taiwan
Share Price
NT$16.40
Change (1 day)
+9.70%
52-Week Range
NT$14.10 - NT$25.65
All Time High
NT$29.67
About

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more