Taiwan IC Packaging Asset Resilience Ratio

Latest as of June 2025: 3.17%

Taiwan IC Packaging asset resilience ratio. Taiwan IC Packaging (3372) has an Asset Resilience Ratio of 3.17% as of June 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing. See Taiwan IC Packaging (3372) defensive interval to measure how many days the company can operate on defensive assets alone.

Liquid Assets

NT$59.40 Million
≈ $1.87 Million USD Cash + Short-term Investments

Total Assets

NT$1.88 Billion
≈ $59.08 Million USD All company assets

Resilience Assessment

Low
Financial Resilience Level

Asset Resilience Ratio of Taiwan IC Packaging (2016–2024)

Asset resilience ratio of Taiwan IC Packaging from 2016 to 2024. This chart shows how Taiwan IC Packaging's Asset Resilience Ratio has changed over time. Read 3372 current and long-term liabilities for a breakdown of total debt and financial obligations.

Liquid Assets Composition Over Time

This chart breaks down Taiwan IC Packaging's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For the complete balance sheet picture, see Taiwan IC Packaging assets under control.

Current Liquid Assets Breakdown

Component Amount % of Total Assets
Cash & Equivalents NT$0.00 0%
Short-term Investments NT$59.40 Million 3.17%
Total Liquid Assets NT$59.40 Million 3.17%

Asset Resilience Insights

  • Limited Liquidity: Taiwan IC Packaging maintains only 3.17% of assets in liquid form.
  • This low level may indicate efficient asset utilization but could pose risks during economic downturns.
  • The company has significant short-term investments, indicating active treasury management.

Taiwan IC Packaging Industry Peers by Asset Resilience Ratio

Compare Taiwan IC Packaging's asset resilience ratio with other companies in the same industry.

Company Industry Asset Resilience Ratio
SK Square Co Ltd
KO:402340
Semiconductors 1.99%
United Microelectronics
NYSE:UMC
Semiconductors 4.21%
Realtek Semiconductor Corp
TW:2379
Semiconductors 38.13%
Maxscend Microelectronics Co Ltd
SHE:300782
Semiconductors 0.01%
FADU Inc.
KQ:440110
Semiconductors 0.47%
Motorcomm Electronic Technology Co. Ltd. A
SHG:688515
Semiconductors 24.81%
Actions Technology Co Ltd
SHG:688049
Semiconductors 18.63%
Wuxi Chipown Micro-electronics Ltd
SHG:688508
Semiconductors 57.54%

Taiwan IC Packaging Asset Resilience Ratio by Year (2016–2024)

Taiwan IC Packaging asset resilience ratio by year from 2016 to 2024. The table below shows the annual Asset Resilience Ratio data for Taiwan IC Packaging.

Year Asset Resilience Ratio (%) Liquid Assets Total Assets Change
2024-12-31 8.04% NT$159.40 Million
≈ $5.02 Million
NT$1.98 Billion
≈ $62.49 Million
+5.71pp
2023-12-31 2.33% NT$49.50 Million
≈ $1.56 Million
NT$2.13 Billion
≈ $67.01 Million
-2.27pp
2022-12-31 4.59% NT$108.90 Million
≈ $3.43 Million
NT$2.37 Billion
≈ $74.67 Million
-2.56pp
2021-12-31 7.16% NT$188.10 Million
≈ $5.93 Million
NT$2.63 Billion
≈ $82.79 Million
-3.35pp
2020-12-31 10.51% NT$227.79 Million
≈ $7.18 Million
NT$2.17 Billion
≈ $68.27 Million
-1.33pp
2019-12-31 11.84% NT$247.50 Million
≈ $7.80 Million
NT$2.09 Billion
≈ $65.84 Million
+2.45pp
2018-12-31 9.40% NT$193.50 Million
≈ $6.10 Million
NT$2.06 Billion
≈ $64.87 Million
+5.06pp
2017-12-31 4.34% NT$118.80 Million
≈ $3.74 Million
NT$2.74 Billion
≈ $86.23 Million
+0.02pp
2016-12-31 4.32% NT$158.40 Million
≈ $4.99 Million
NT$3.66 Billion
≈ $115.42 Million
--
pp = percentage points

About Taiwan IC Packaging

TWO:3372 Taiwan Semiconductors
Market Cap
$101.57 Million
NT$3.22 Billion TWD
Market Cap Rank
#18935 Global
#1053 in Taiwan
Share Price
NT$13.70
Change (1 day)
-3.52%
52-Week Range
NT$13.70 - NT$25.65
All Time High
NT$29.67
About

Taiwan IC Packaging Corporation develops semiconductor packaging and testing services in Taiwan, South Korea, the United States, and internationally. It offers advanced and traditional lead frame type integrated circuit packaging services. The company was founded in 1998 and is based in Kaohsiung, Taiwan.