Taiwan IC Packaging (TWO:3372) — Market Cap & Net Worth
Market Cap & Net Worth: Taiwan IC Packaging (3372)
Taiwan IC Packaging (TWO:3372) has a market capitalization of $82.58 Million (NT$2.62 Billion) as of September 18, 2026. Listed on the TWO stock exchange, this Taiwan-based company holds position #20004 globally and #1155 in its home market, demonstrating a 4.18% increase in market value over the past year.
Market capitalization, also known as net worth in stock markets, is calculated by multiplying Taiwan IC Packaging's stock price NT$14.95 by its total outstanding shares 175324000 (175.32 Million). Also see Taiwan IC Packaging (3372) total assets for a full breakdown of the balance sheet.
Taiwan IC Packaging Market Cap History: 2015 to 2026
Taiwan IC Packaging's market capitalization history from 2015 to 2026. Data shows change from $97.06 Million to $82.58 Million (-0.82% CAGR). Also see 3372 cash generation efficiency for how efficiently the company converts equity into cash flow.
Taiwan IC Packaging Market Cap to Earnings & Revenue Ratios Timeline
This chart shows how Taiwan IC Packaging's valuation ratios have evolved. The Price to Sales (P/S) ratio compares market cap to revenue, while the Price to Earnings (P/E) ratio compares market cap to net income. Lower values may indicate a more undervalued company relative to its financial performance. Check current stock price of Taiwan IC Packaging for real-time trading data and today's change.
Latest Price to Sales (P/S) Ratio
0.09x
Taiwan IC Packaging's market cap is 0.09 times its annual revenue
Latest Price to Earnings (P/E) Ratio
N/A
P/E ratio not applicable due to negative or zero earnings
What These Ratios Tell Investors:
- Price to Sales (P/S) Ratio: Shows how much investors are paying for each dollar of the company's sales. Lower P/S ratios may indicate undervaluation.
- Price to Earnings (P/E) Ratio: Shows how much investors are paying for each dollar of the company's earnings. This is one of the most common valuation metrics.
- Trends in these ratios over time can indicate changing investor sentiment about the company's future growth prospects.
- Industry comparison provides context for whether the company is valued higher or lower than peers.
| Year | Market Cap (USD) | Revenue (USD) | Net Income (USD) | P/S Ratio | P/E Ratio |
|---|---|---|---|---|---|
| 2016 | $90.50 Million | $1.74 Billion | -$273.81 Million | 0.05x | N/A |
| 2017 | $68.39 Million | $1.41 Billion | -$857.93 Million | 0.05x | N/A |
| 2018 | $59.77 Million | $1.27 Billion | -$568.06 Million | 0.05x | N/A |
| 2019 | $52.15 Million | $1.18 Billion | -$47.43 Million | 0.04x | N/A |
| 2020 | $66.54 Million | $1.21 Billion | -$11.04 Million | 0.05x | N/A |
| 2021 | $124.34 Million | $1.94 Billion | $411.64 Million | 0.06x | 0.30x |
| 2022 | $61.04 Million | $1.22 Billion | $84.13 Million | 0.05x | 0.73x |
| 2023 | $80.09 Million | $861.69 Million | -$176.99 Million | 0.09x | N/A |
| 2024 | $83.41 Million | $904.16 Million | -$185.38 Million | 0.09x | N/A |
Competitor Companies of 3372 by Market Capitalization
Companies near Taiwan IC Packaging in the global market cap rankings as of September 18, 2026. Review tangible equity quality of Taiwan IC Packaging to assess the quality of the company's equity after excluding intangible assets.
Key companies related to Taiwan IC Packaging by market ranking:
- NVIDIA Corporation (NASDAQ:NVDA): Ranked #1 globally with a market cap of $5.06 Trillion USD.
- Taiwan Semiconductor Manufacturing Co. Ltd. (TW:2330): Ranked #6 globally with a market cap of $1.94 Trillion USD ( NT$61.72 Trillion TWD).
- Broadcom Inc (NASDAQ:AVGO): Ranked #8 globally with a market cap of $1.61 Trillion USD.
- SK Hynix Inc. American Depositary Shares (NASDAQ:SKHY): Ranked #12 globally with a market cap of $1.24 Trillion USD.
| Rank | Company | Symbol | Market Cap | Price |
|---|---|---|---|---|
| #1 | NVIDIA Corporation | NASDAQ:NVDA | $5.06 Trillion | $213.90 |
| #6 | Taiwan Semiconductor Manufacturing Co. Ltd. | TW:2330 | $1.94 Trillion | NT$2380.00 |
| #8 | Broadcom Inc | NASDAQ:AVGO | $1.61 Trillion | $339.51 |
| #12 | SK Hynix Inc. American Depositary Shares | NASDAQ:SKHY | $1.24 Trillion | $174.87 |
Taiwan IC Packaging Historical Marketcap From 2015 to 2026
Between 2015 and today, Taiwan IC Packaging's market cap moved from $97.06 Million to $ 82.58 Million, with a yearly change of -0.82%.
| Year | Market Cap | Change (%) |
|---|---|---|
| 2026 | NT$82.58 Million | -30.63% |
| 2025 | NT$119.04 Million | +42.72% |
| 2024 | NT$83.41 Million | +4.14% |
| 2023 | NT$80.09 Million | +31.22% |
| 2022 | NT$61.04 Million | -50.91% |
| 2021 | NT$124.34 Million | +86.87% |
| 2020 | NT$66.54 Million | +27.59% |
| 2019 | NT$52.15 Million | -12.74% |
| 2018 | NT$59.77 Million | -12.61% |
| 2017 | NT$68.39 Million | -24.43% |
| 2016 | NT$90.50 Million | -6.76% |
| 2015 | NT$97.06 Million | -- |
End of Day Market Cap According to Different Sources
On Sep 17th, 2026 the market cap of Taiwan IC Packaging was reported to be:
| Source | Market Cap |
|---|---|
| Yahoo Finance | $82.58 Million USD |
| MoneyControl | $82.58 Million USD |
| MarketWatch | $82.58 Million USD |
| marketcap.company | $82.58 Million USD |
| Reuters | $82.58 Million USD |
Market cap values may vary slightly between sources due to differences in calculation methods, timing, and data refresh rates.
About Taiwan IC Packaging
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more