Taiwan IC Packaging Total Liabilities

Latest as of June 2026: NT$366.35 Million TWD ≈ $11.54 Million USD

Taiwan IC Packaging total liabilities. Based on the latest financial reports, Taiwan IC Packaging (3372) has total liabilities worth NT$366.35 Million TWD (≈ $11.54 Million USD) as of June 2026. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check how resilient are Taiwan IC Packaging's assets to evaluate the company's liquid asset resilience ratio.

Total Liabilities of Taiwan IC Packaging (2016–2025)

Total liabilities of Taiwan IC Packaging from 2016 to 2025. This chart illustrates how Taiwan IC Packaging's total liabilities have evolved over time, based on quarterly financial data.

Taiwan IC Packaging Competitors by Total Liabilities

The table below lists competitors of Taiwan IC Packaging ranked by their total liabilities.

Company Country Total Liabilities
Libstar Holdings Ltd
JSE:LBR
South Africa ZAC4.02 Billion
Braemar Hotel & Resorts Inc
NYSE:BHR
USA $1.35 Billion
Hauman Technologies
TWO:6218
Taiwan NT$791.37 Million
Bansal Wire Industries Ltd
NSE:BANSALWIRE
India Rs10.86 Billion
Putra Mandiri Jembar Tbk PT
JK:PMJS
Indonesia Rp2.02 Trillion
Tipco Foods Public Company Limited
BK:TIPCO
Thailand ฿2.01 Billion
Hektar Real Estate Investment Trust
KLSE:5121
Malaysia RM707.97 Million
ReaLy Development & Construction
TWO:2596
Taiwan NT$3.78 Billion

Liability Composition Analysis (2016–2025)

This chart breaks down Taiwan IC Packaging's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the complete balance sheet picture, see Taiwan IC Packaging (3372) total assets.

Liquidity & Leverage Metrics

Taiwan IC Packaging Total Liabilities Ratios Explained

Taiwan IC Packaging total liabilities ratios compare its liabilities with its current assets, cash and shareholder equity.

Metric Value Description
Current Ratio 2.87 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.25 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.20 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Taiwan IC Packaging's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Taiwan IC Packaging (2016–2025)

The table below shows the annual total liabilities of Taiwan IC Packaging from 2016 to 2025.

Year Total Liabilities Change
2025-12-31 NT$343.22 Million
≈ $10.81 Million
+27.47%
2024-12-31 NT$269.26 Million
≈ $8.48 Million
+8.83%
2023-12-31 NT$247.41 Million
≈ $7.79 Million
+1.77%
2022-12-31 NT$243.11 Million
≈ $7.66 Million
-46.93%
2021-12-31 NT$458.10 Million
≈ $14.43 Million
+10.93%
2020-12-31 NT$412.98 Million
≈ $13.01 Million
+26.52%
2019-12-31 NT$326.42 Million
≈ $10.28 Million
+33.20%
2018-12-31 NT$245.06 Million
≈ $7.72 Million
-31.73%
2017-12-31 NT$358.94 Million
≈ $11.31 Million
-18.81%
2016-12-31 NT$442.09 Million
≈ $13.93 Million
--

About Taiwan IC Packaging

TWO:3372 Taiwan Semiconductors
Market Cap
$101.57 Million
NT$3.22 Billion TWD
Market Cap Rank
#18935 Global
#1053 in Taiwan
Share Price
NT$13.70
Change (1 day)
-3.52%
52-Week Range
NT$13.70 - NT$25.65
All Time High
NT$29.67
About

Taiwan IC Packaging Corporation develops semiconductor packaging and testing services in Taiwan, South Korea, the United States, and internationally. It offers advanced and traditional lead frame type integrated circuit packaging services. The company was founded in 1998 and is based in Kaohsiung, Taiwan.