Taiwan IC Packaging (3372) - Total Liabilities

Latest as of June 2025: NT$299.21 Million TWD ≈ $9.43 Million USD

Based on the latest financial reports, Taiwan IC Packaging (3372) has total liabilities worth NT$299.21 Million TWD (≈ $9.43 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Explore 3372 operating cash flow to assess how effectively this company generates cash.

Taiwan IC Packaging - Total Liabilities Trend (2016–2024)

This chart illustrates how Taiwan IC Packaging's total liabilities have evolved over time, based on quarterly financial data. Check financial resilience of Taiwan IC Packaging to evaluate the company's liquid asset resilience ratio.

Taiwan IC Packaging Competitors by Total Liabilities

The table below lists competitors of Taiwan IC Packaging ranked by their total liabilities.

Company Country Total Liabilities
Questerre Energy Corporation
TO:QEC
Canada CA$249.80 Million
Hennessy Capital Investment Corp VI
NASDAQ:HCVI
USA $27.66 Million
Netbay Public Company Limited
BK:NETBAY
Thailand ฿201.59 Million
Right Way Industrial Co Ltd
TW:1506
Taiwan NT$370.80 Million
Chyang Sheng Dyeing & Finishing Co Ltd
TW:1463
Taiwan NT$752.75 Million
Beta Systems Software AG
F:BSS
Germany €42.16 Million
Kalaris Therapeutics, Inc.
NASDAQ:KLRS
USA $39.31 Million
Rama Steel Tubes Limited
NSE:RAMASTEEL
India Rs3.69 Billion

Liability Composition Analysis (2016–2024)

This chart breaks down Taiwan IC Packaging's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 3372 market cap overview.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.51 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.19 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.16 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Taiwan IC Packaging's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Taiwan IC Packaging (2016–2024)

The table below shows the annual total liabilities of Taiwan IC Packaging from 2016 to 2024.

Year Total Liabilities Change
2024-12-31 NT$269.26 Million
≈ $8.48 Million
+8.83%
2023-12-31 NT$247.41 Million
≈ $7.79 Million
+1.77%
2022-12-31 NT$243.11 Million
≈ $7.66 Million
-46.93%
2021-12-31 NT$458.10 Million
≈ $14.43 Million
+10.93%
2020-12-31 NT$412.98 Million
≈ $13.01 Million
+26.52%
2019-12-31 NT$326.42 Million
≈ $10.28 Million
+33.20%
2018-12-31 NT$245.06 Million
≈ $7.72 Million
-31.73%
2017-12-31 NT$358.94 Million
≈ $11.31 Million
-18.81%
2016-12-31 NT$442.09 Million
≈ $13.93 Million
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About Taiwan IC Packaging

TWO:3372 Taiwan Semiconductors
Market Cap
$102.19 Million
NT$3.24 Billion TWD
Market Cap Rank
#19107 Global
#1065 in Taiwan
Share Price
NT$18.50
Change (1 day)
+1.37%
52-Week Range
NT$12.65 - NT$25.65
All Time High
NT$29.67
About

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more