Taiwan IC Packaging (3372) - Total Liabilities

Latest as of June 2025: NT$299.21 Million TWD ≈ $9.43 Million USD

Based on the latest financial reports, Taiwan IC Packaging (3372) has total liabilities worth NT$299.21 Million TWD (≈ $9.43 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Also explore how fast is Taiwan IC Packaging growing its equity to track the company's year-over-year net asset growth rate.

Taiwan IC Packaging - Total Liabilities Trend (2016–2024)

This chart illustrates how Taiwan IC Packaging's total liabilities have evolved over time, based on quarterly financial data. See cash generation quality of Taiwan IC Packaging to measure how efficiently the company converts operating cash flow to free cash.

Taiwan IC Packaging Competitors by Total Liabilities

The table below lists competitors of Taiwan IC Packaging ranked by their total liabilities.

Company Country Total Liabilities
Kalaris Therapeutics, Inc.
NASDAQ:KLRS
USA $41.25 Million
Delta Djakarta Tbk
JK:DLTA
Indonesia Rp285.36 Billion
Ibkimyoung Co. Ltd
KQ:339950
Korea ₩53.78 Billion
SUN KWANG CO.Ltd
KQ:003100
Korea ₩257.12 Billion
OncoQuest Pharmaceuticals Inc
KQ:078590
Korea ₩19.38 Billion
ZUARI INDUSTRIES LIMITED
NSE:ZUARIIND
India Rs34.46 Billion
Hwa Fong Rubber (Thailand) Public Company Limited
BK:HFT
Thailand ฿385.79 Million
Ecograf Ltd
AU:EGR
Australia AU$1.94 Million

Liability Composition Analysis (2016–2024)

This chart breaks down Taiwan IC Packaging's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 3372 market cap overview.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.51 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.19 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.16 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Taiwan IC Packaging's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Taiwan IC Packaging (2016–2024)

The table below shows the annual total liabilities of Taiwan IC Packaging from 2016 to 2024.

Year Total Liabilities Change
2024-12-31 NT$269.26 Million
≈ $8.48 Million
+8.83%
2023-12-31 NT$247.41 Million
≈ $7.79 Million
+1.77%
2022-12-31 NT$243.11 Million
≈ $7.66 Million
-46.93%
2021-12-31 NT$458.10 Million
≈ $14.43 Million
+10.93%
2020-12-31 NT$412.98 Million
≈ $13.01 Million
+26.52%
2019-12-31 NT$326.42 Million
≈ $10.28 Million
+33.20%
2018-12-31 NT$245.06 Million
≈ $7.72 Million
-31.73%
2017-12-31 NT$358.94 Million
≈ $11.31 Million
-18.81%
2016-12-31 NT$442.09 Million
≈ $13.93 Million
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About Taiwan IC Packaging

TWO:3372 Taiwan Semiconductors
Market Cap
$83.41 Million
NT$2.65 Billion TWD
Market Cap Rank
#19766 Global
#1132 in Taiwan
Share Price
NT$15.10
Change (1 day)
+7.09%
52-Week Range
NT$12.95 - NT$25.65
All Time High
NT$29.67
About

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more