Taiwan IC Packaging (3372) - Total Liabilities

Latest as of June 2025: NT$299.21 Million TWD ≈ $9.43 Million USD

Based on the latest financial reports, Taiwan IC Packaging (3372) has total liabilities worth NT$299.21 Million TWD (≈ $9.43 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities. Check Taiwan IC Packaging liquidity resilience to evaluate the company's liquid asset resilience ratio.

Taiwan IC Packaging - Total Liabilities Trend (2016–2024)

This chart illustrates how Taiwan IC Packaging's total liabilities have evolved over time, based on quarterly financial data. For the complete balance sheet picture, see 3372 current and non-current assets.

Taiwan IC Packaging Competitors by Total Liabilities

The table below lists competitors of Taiwan IC Packaging ranked by their total liabilities.

Company Country Total Liabilities
Malaysian Bulk Carriers Bhd
KLSE:5077
Malaysia RM149.61 Million
iFabric Corp
TO:IFA
Canada CA$22.29 Million
Sao Ta Foods JSC
VN:FMC
Vietnam ₫1.79 Trillion
CombinedX AB
ST:CX
Sweden Skr401.00 Million
KG Mobilians Co. Ltd
KQ:046440
Korea ₩235.11 Billion
Amata Summit Growth Freehold and Leasehold Real Estate Investment Trust
BK:AMATAR
Thailand ฿1.07 Billion
Crossject
PA:ALCJ
France €35.30 Million
HLB Life Science Co. Ltd
KQ:067630
Korea ₩173.00 Billion

Liability Composition Analysis (2016–2024)

This chart breaks down Taiwan IC Packaging's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. See how leveraged is Taiwan IC Packaging's balance sheet to measure how much of total assets are equity-financed.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 3.51 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.19 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.16 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Taiwan IC Packaging's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Taiwan IC Packaging (2016–2024)

The table below shows the annual total liabilities of Taiwan IC Packaging from 2016 to 2024.

Year Total Liabilities Change
2024-12-31 NT$269.26 Million
≈ $8.48 Million
+8.83%
2023-12-31 NT$247.41 Million
≈ $7.79 Million
+1.77%
2022-12-31 NT$243.11 Million
≈ $7.66 Million
-46.93%
2021-12-31 NT$458.10 Million
≈ $14.43 Million
+10.93%
2020-12-31 NT$412.98 Million
≈ $13.01 Million
+26.52%
2019-12-31 NT$326.42 Million
≈ $10.28 Million
+33.20%
2018-12-31 NT$245.06 Million
≈ $7.72 Million
-31.73%
2017-12-31 NT$358.94 Million
≈ $11.31 Million
-18.81%
2016-12-31 NT$442.09 Million
≈ $13.93 Million
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About Taiwan IC Packaging

TWO:3372 Taiwan Semiconductors
Market Cap
$82.58 Million
NT$2.62 Billion TWD
Market Cap Rank
#20004 Global
#1155 in Taiwan
Share Price
NT$14.95
Change (1 day)
+5.28%
52-Week Range
NT$14.10 - NT$25.65
All Time High
NT$29.67
About

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more