Taiwan IC Packaging (3372) - Total Liabilities
Based on the latest financial reports, Taiwan IC Packaging (3372) has total liabilities worth NT$299.21 Million TWD (≈ $9.43 Million USD) as of June 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.
Taiwan IC Packaging - Total Liabilities Trend (2016–2024)
This chart illustrates how Taiwan IC Packaging's total liabilities have evolved over time, based on quarterly financial data. See working capital position of Taiwan IC Packaging to evaluate short-term liquidity relative to the company's equity base.
Taiwan IC Packaging Competitors by Total Liabilities
The table below lists competitors of Taiwan IC Packaging ranked by their total liabilities.
| Company | Country | Total Liabilities |
|---|---|---|
|
Lassila &Tikanoja Oyj
HE:LAT1V
|
Finland | €413.00 Million |
|
PepGen Ltd
NASDAQ:PEPG
|
USA | $26.46 Million |
|
Purit Co. Ltd.
KQ:445180
|
Korea | ₩18.83 Billion |
|
Ubiquoss Holdings Inc
KQ:078070
|
Korea | ₩34.48 Billion |
|
Lee Ku Ind
KO:025820
|
Korea | ₩231.33 Billion |
|
Milestone Pharmaceuticals Inc
NASDAQ:MIST
|
USA | $67.25 Million |
|
Genovate Biotechnology Co Ltd
TWO:4130
|
Taiwan | NT$126.05 Million |
|
Sat Industries Limited
NSE:SATINDLTD
|
India | Rs1.52 Billion |
Liability Composition Analysis (2016–2024)
This chart breaks down Taiwan IC Packaging's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 3372 market cap overview.
Liquidity & Leverage Metrics
Key Metrics Explained
| Metric | Value | Description |
|---|---|---|
| Current Ratio | 3.51 | Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities) |
| Quick Ratio | N/A | More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities) |
| Cash Ratio | N/A | Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities) |
| Debt to Equity | 0.19 | Measures financial leverage (Total Liabilities ÷ Shareholder Equity) |
| Debt to Assets | 0.16 | Portion of assets financed with debt (Total Liabilities ÷ Total Assets) |
Liability Trends Comparison
This chart compares key liability metrics across different time periods, showing how Taiwan IC Packaging's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.
Annual Total Liabilities for Taiwan IC Packaging (2016–2024)
The table below shows the annual total liabilities of Taiwan IC Packaging from 2016 to 2024.
| Year | Total Liabilities | Change |
|---|---|---|
| 2024-12-31 | NT$269.26 Million ≈ $8.48 Million |
+8.83% |
| 2023-12-31 | NT$247.41 Million ≈ $7.79 Million |
+1.77% |
| 2022-12-31 | NT$243.11 Million ≈ $7.66 Million |
-46.93% |
| 2021-12-31 | NT$458.10 Million ≈ $14.43 Million |
+10.93% |
| 2020-12-31 | NT$412.98 Million ≈ $13.01 Million |
+26.52% |
| 2019-12-31 | NT$326.42 Million ≈ $10.28 Million |
+33.20% |
| 2018-12-31 | NT$245.06 Million ≈ $7.72 Million |
-31.73% |
| 2017-12-31 | NT$358.94 Million ≈ $11.31 Million |
-18.81% |
| 2016-12-31 | NT$442.09 Million ≈ $13.93 Million |
-- |
About Taiwan IC Packaging
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies in China, South Korea, the United States, and internationally. The company offers thin small outline, small outline, quad flat, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, LQFP, thermal enhanced, and image sensor packages. It also provides substrate-based package products, such as LGA, VLGA… Read more