Ample Electronic Technology Co Ltd - Asset Resilience Ratio
Ample Electronic Technology Co Ltd (4760) has an Asset Resilience Ratio of 0.38% as of December 2025. The Asset Resilience Ratio measures the percentage of a company's total assets that are held in liquid form (cash and short-term investments). This metric indicates how well-positioned the company is to handle unexpected financial challenges, economic downturns, or strategic opportunities without requiring external financing.
Liquid Assets
Total Assets
Resilience Assessment
Asset Resilience Ratio Trend (2017–2025)
This chart shows how Ample Electronic Technology Co Ltd's Asset Resilience Ratio has changed over time. Check asset allocation strategy of Ample Electronic Technology Co Ltd to assess the company's strategic physical and investment asset allocation.
Liquid Assets Composition Over Time
This chart breaks down Ample Electronic Technology Co Ltd's liquid assets into cash & equivalents and short-term investments, showing how the composition has evolved over time. For market capitalisation and broader financial context, see Ample Electronic Technology Co Ltd market capitalisation.
Current Liquid Assets Breakdown
| Component | Amount | % of Total Assets |
|---|---|---|
| Cash & Equivalents | NT$0.00 | 0% |
| Short-term Investments | NT$6.74 Million | 0.38% |
| Total Liquid Assets | NT$6.74 Million | 0.38% |
Asset Resilience Insights
- Limited Liquidity: Ample Electronic Technology Co Ltd maintains only 0.38% of assets in liquid form.
- This low level may indicate efficient asset utilization but could pose risks during economic downturns.
- The company has significant short-term investments, indicating active treasury management.
Ample Electronic Technology Co Ltd Industry Peers by Asset Resilience Ratio
Compare Ample Electronic Technology Co Ltd's asset resilience ratio with other companies in the same industry.
| Company | Industry | Asset Resilience Ratio |
|---|---|---|
|
TongFu Microelectronics Co Ltd
SHE:002156 |
Semiconductor Equipment & Materials | 0.01% |
|
Anji Microelectronics Tech Co Ltd
SHG:688019 |
Semiconductor Equipment & Materials | 3.14% |
|
Beijing Huafeng Test & Control Technology Co Ltd
SHG:688200 |
Semiconductor Equipment & Materials | 2.40% |
|
Shenzhen Newway Photomask Making Co. Ltd. A
SHG:688401 |
Semiconductor Equipment & Materials | 4.11% |
|
JHT Design Co. Ltd. Cl A
SHG:603061 |
Semiconductor Equipment & Materials | 9.01% |
|
Adaptive Plasma Technology Corp
KQ:089970 |
Semiconductor Equipment & Materials | 1.49% |
|
Spectra7 Microsystems Inc
V:SEV |
Semiconductor Equipment & Materials | 29.72% |
|
Bluglass Ltd
AU:BLG |
Semiconductor Equipment & Materials | 23.98% |
Annual Asset Resilience Ratio for Ample Electronic Technology Co Ltd (2017–2025)
The table below shows the annual Asset Resilience Ratio data for Ample Electronic Technology Co Ltd.
| Year | Asset Resilience Ratio (%) | Liquid Assets | Total Assets | Change |
|---|---|---|---|---|
| 2025-12-31 | 0.38% | NT$6.74 Million ≈ $212.47K |
NT$1.76 Billion ≈ $55.33 Million |
-2.02pp |
| 2024-12-31 | 2.41% | NT$36.30 Million ≈ $1.14 Million |
NT$1.51 Billion ≈ $47.48 Million |
-1.53pp |
| 2023-12-31 | 3.94% | NT$46.03 Million ≈ $1.45 Million |
NT$1.17 Billion ≈ $36.81 Million |
+2.47pp |
| 2022-12-31 | 1.47% | NT$14.41 Million ≈ $454.15K |
NT$982.91 Million ≈ $30.97 Million |
+0.44pp |
| 2021-12-31 | 1.03% | NT$14.61 Million ≈ $460.26K |
NT$1.42 Billion ≈ $44.85 Million |
-2.93pp |
| 2020-12-31 | 3.96% | NT$44.61 Million ≈ $1.41 Million |
NT$1.13 Billion ≈ $35.51 Million |
+0.95pp |
| 2019-12-31 | 3.01% | NT$23.71 Million ≈ $747.09K |
NT$788.56 Million ≈ $24.84 Million |
-0.32pp |
| 2018-12-31 | 3.33% | NT$26.50 Million ≈ $834.93K |
NT$795.95 Million ≈ $25.08 Million |
+0.56pp |
| 2017-12-31 | 2.77% | NT$19.31 Million ≈ $608.34K |
NT$698.03 Million ≈ $21.99 Million |
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About Ample Electronic Technology Co Ltd
Ample Electronic Technology Co.,Ltd. engages in the research, development, design, manufacture, and sale of conductive materials in Taiwan. It offers high-temp. termination silver conductive paste, high-temp. inner silver conductive paste, high-temp. termination copper paste, low-temp. termination silver epoxy paste, silver rear paste for photovoltaic cell, IC (SOT QFN package)/LED die attach sil… Read more