Ample Electronic Technology Co Ltd (4760) - Total Liabilities

Latest as of December 2025: NT$700.34 Million TWD ≈ $22.06 Million USD

Based on the latest financial reports, Ample Electronic Technology Co Ltd (4760) has total liabilities worth NT$700.34 Million TWD (≈ $22.06 Million USD) as of December 2025. Total liabilities represent everything the company owes to external parties, combining both current liabilities—like accounts payable, short-term debt, and accrued expenses—and non-current liabilities such as long-term debt, pension obligations, lease liabilities, and deferred tax liabilities.

Ample Electronic Technology Co Ltd - Total Liabilities Trend (2017–2025)

This chart illustrates how Ample Electronic Technology Co Ltd's total liabilities have evolved over time, based on quarterly financial data. See Ample Electronic Technology Co Ltd (4760) working capital ratio to evaluate short-term liquidity relative to the company's equity base.

Ample Electronic Technology Co Ltd Competitors by Total Liabilities

The table below lists competitors of Ample Electronic Technology Co Ltd ranked by their total liabilities.

Company Country Total Liabilities
Yaxing Chem
SHG:600319
China CN¥2.57 Billion
Nanhua Bio Medicine Co Ltd
SHE:000504
China CN¥647.35 Million
Taimide Tech Inc
TW:3645
Taiwan NT$1.82 Billion
Monopar Therapeutics Inc
NASDAQ:MNPR
USA $2.59 Million
Beijing HuaYuanYiTong Thermal Technology Co Ltd
SHE:002893
China CN¥1.19 Billion
Quadient SA
PA:QDT
France €1.40 Billion
Gravity Co Ltd
NASDAQ:GRVY
USA $109.25 Billion
Mangalore Chemicals & Fertilizers Limited
NSE:MANGCHEFER
India Rs-10.65 Billion

Liability Composition Analysis (2017–2025)

This chart breaks down Ample Electronic Technology Co Ltd's total liabilities into key components over time: long-term debt, short-term debt, other current liabilities, and other non-current liabilities. Toggle between absolute values and percentage view to see how the composition has shifted. For the full company profile including market capitalisation, see 4760 stock market capitalisation.

Liquidity & Leverage Metrics

Key Metrics Explained

Metric Value Description
Current Ratio 1.90 Measures ability to pay short-term obligations (Current Assets ÷ Current Liabilities)
Quick Ratio N/A More stringent measure of short-term liquidity ((Current Assets - Inventory) ÷ Current Liabilities)
Cash Ratio N/A Most conservative liquidity measure (Cash & Equivalents ÷ Current Liabilities)
Debt to Equity 0.66 Measures financial leverage (Total Liabilities ÷ Shareholder Equity)
Debt to Assets 0.40 Portion of assets financed with debt (Total Liabilities ÷ Total Assets)

Liability Trends Comparison

This chart compares key liability metrics across different time periods, showing how Ample Electronic Technology Co Ltd's debt structure has evolved. The comparison includes total liabilities, long-term debt, and current liabilities.

Annual Total Liabilities for Ample Electronic Technology Co Ltd (2017–2025)

The table below shows the annual total liabilities of Ample Electronic Technology Co Ltd from 2017 to 2025.

Year Total Liabilities Change
2025-12-31 NT$700.34 Million
≈ $22.06 Million
+20.31%
2024-12-31 NT$582.11 Million
≈ $18.34 Million
+67.83%
2023-12-31 NT$346.84 Million
≈ $10.93 Million
+37.44%
2022-12-31 NT$252.36 Million
≈ $7.95 Million
-57.28%
2021-12-31 NT$590.70 Million
≈ $18.61 Million
+12.05%
2020-12-31 NT$527.19 Million
≈ $16.61 Million
+64.06%
2019-12-31 NT$321.35 Million
≈ $10.12 Million
-11.43%
2018-12-31 NT$362.81 Million
≈ $11.43 Million
+16.64%
2017-12-31 NT$311.06 Million
≈ $9.80 Million
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About Ample Electronic Technology Co Ltd

TWO:4760 Taiwan Semiconductor Equipment & Materials
Market Cap
$395.88 Million
NT$12.57 Billion TWD
Market Cap Rank
#13641 Global
#555 in Taiwan
Share Price
NT$390.00
Change (1 day)
-2.86%
52-Week Range
NT$98.90 - NT$468.00
All Time High
NT$468.00
About

Ample Electronic Technology Co.,Ltd. engages in the research, development, design, manufacture, and sale of conductive materials in Taiwan. It offers high-temp. termination silver conductive paste, high-temp. inner silver conductive paste, high-temp. termination copper paste, low-temp. termination silver epoxy paste, silver rear paste for photovoltaic cell, IC (SOT QFN package)/LED die attach sil… Read more