Thermaltake Technology Co Ltd (3540) — Cash Flow-to-Debt Ratio

Latest as of December 2025: -0.02x

Thermaltake Technology Co Ltd (3540) has a Cash Flow-to-Debt Ratio of -0.02x as of December 2025, meaning its operating cash flow of NT$-77.72 Million could theoretically repay 0% of its total liabilities (NT$3.98 Billion) in one year. Check Thermaltake Technology Co Ltd (3540) reinvestment rate to assess the company's total reinvestment commitment from operating cash flow.

CF-to-Debt Ratio

-0.02x
Operating CF / Total Liabilities

Operating Cash Flow

NT$-77.72 Million
TWD

Total Liabilities

NT$3.98 Billion
TWD

Data as of

Dec 2025
Most recent filing

Thermaltake Technology Co Ltd Cash Flow-to-Debt Ratio (2017–2025)

Historical debt coverage capacity for Thermaltake Technology Co Ltd across 9 annual periods. Also explore Thermaltake Technology Co Ltd assets under control for the complete picture of this company's asset base.

Annual Cash Flow-to-Debt Ratio for Thermaltake Technology Co Ltd (2017–2025)

Year-by-year debt coverage analysis for Thermaltake Technology Co Ltd. For market capitalisation and broader financial context, see market value of Thermaltake Technology Co Ltd.

Year CF-to-Debt Ratio Operating CF (TWD) Total Liabilities YoY Change
2025 0.01x NT$28.97 Million NT$3.98 Billion ▲ +107.5%
2024 -0.10x NT$-334.51 Million NT$3.44 Billion ▼ -471.9%
2023 -0.02x NT$-47.72 Million NT$2.81 Billion ▼ -137.0%
2022 0.05x NT$118.03 Million NT$2.57 Billion ▲ +124.1%
2021 -0.19x NT$-468.99 Million NT$2.47 Billion ▼ -166.4%
2020 0.29x NT$800.15 Million NT$2.80 Billion ▲ +1713.5%
2019 0.02x NT$33.30 Million NT$2.11 Billion ▲ +112.7%
2018 -0.12x NT$-216.65 Million NT$1.75 Billion ▼ -159.3%
2017 0.21x NT$313.69 Million NT$1.50 Billion
Cash Flow-to-Debt Ratio = Operating Cash Flow / Total Liabilities. Higher is better for debt service capacity.