Thermaltake Technology Co Ltd (3540) — Cash Flow-to-Debt Ratio

Latest as of September 2025: -0.04x

Thermaltake Technology Co Ltd (3540) has a Cash Flow-to-Debt Ratio of -0.04x as of September 2025, meaning its operating cash flow of NT$-173.46 Million could theoretically repay 0% of its total liabilities (NT$4.12 Billion) in one year. See Thermaltake Technology Co Ltd free cash flow ratio to measure how efficiently the company converts operating cash flow to free cash.

CF-to-Debt Ratio

-0.04x
Operating CF / Total Liabilities

Operating Cash Flow

NT$-173.46 Million
TWD

Total Liabilities

NT$4.12 Billion
TWD

Data as of

Sep 2025
Most recent filing

Thermaltake Technology Co Ltd Cash Flow-to-Debt Ratio (2017–2024)

Historical debt coverage capacity for Thermaltake Technology Co Ltd across 8 annual periods. Also explore 3540 shareholders equity momentum to track the company's year-over-year net asset growth rate.

Annual Cash Flow-to-Debt Ratio for Thermaltake Technology Co Ltd (2017–2024)

Year-by-year debt coverage analysis for Thermaltake Technology Co Ltd. For market capitalisation and broader financial context, see 3540 market cap.

Year CF-to-Debt Ratio Operating CF (TWD) Total Liabilities YoY Change
2024 -0.10x NT$-334.51 Million NT$3.44 Billion ▼ -471.9%
2023 -0.02x NT$-47.72 Million NT$2.81 Billion ▼ -137.0%
2022 0.05x NT$118.03 Million NT$2.57 Billion ▲ +124.1%
2021 -0.19x NT$-468.99 Million NT$2.47 Billion ▼ -166.4%
2020 0.29x NT$800.15 Million NT$2.80 Billion ▲ +1713.5%
2019 0.02x NT$33.30 Million NT$2.11 Billion ▲ +112.7%
2018 -0.12x NT$-216.65 Million NT$1.75 Billion ▼ -159.3%
2017 0.21x NT$313.69 Million NT$1.50 Billion
Cash Flow-to-Debt Ratio = Operating Cash Flow / Total Liabilities. Higher is better for debt service capacity.