TongFu Microelectronics Co Ltd (002156) - Net Assets
Based on the latest financial reports, TongFu Microelectronics Co Ltd (002156) has net assets worth CN¥16.81 Billion CNY (≈ $2.46 Billion USD) as of September 2025. Net assets (also known as shareholders' equity or book value) represent the difference between a company's total assets (CN¥45.47 Billion ≈ $6.65 Billion USD) and total liabilities (CN¥28.67 Billion ≈ $4.19 Billion USD). This figure indicates the residual interest in the assets after deducting liabilities, essentially showing what would remain for shareholders if all assets were liquidated and all debts paid off. Check TongFu Microelectronics Co Ltd (002156) liquid assets ratio to evaluate the company's liquid asset resilience ratio.
Key Net Assets Metrics
| Metric | Value |
|---|---|
| Current Net Assets | CN¥16.81 Billion |
| % of Total Assets | 36.96% |
| Annual Growth Rate | 23.72% |
| 5-Year Change | 56.88% |
| 10-Year Change | 320.04% |
| Growth Volatility | 43.31 |
TongFu Microelectronics Co Ltd - Net Assets Trend (2004–2024)
This chart illustrates how TongFu Microelectronics Co Ltd's net assets have evolved over time, based on quarterly financial data. Also explore 002156 total assets for the complete picture of this company's asset base.
Annual Net Assets for TongFu Microelectronics Co Ltd (2004–2024)
The table below shows the annual net assets of TongFu Microelectronics Co Ltd from 2004 to 2024. For live valuation and market cap data, see TongFu Microelectronics Co Ltd market cap and net worth.
| Year | Net Assets | Change |
|---|---|---|
| 2024-12-31 | CN¥15.71 Billion ≈ $2.30 Billion |
+6.92% |
| 2023-12-31 | CN¥14.69 Billion ≈ $2.15 Billion |
+0.91% |
| 2022-12-31 | CN¥14.56 Billion ≈ $2.13 Billion |
+32.11% |
| 2021-12-31 | CN¥11.02 Billion ≈ $1.61 Billion |
+10.06% |
| 2020-12-31 | CN¥10.01 Billion ≈ $1.47 Billion |
+54.03% |
| 2019-12-31 | CN¥6.50 Billion ≈ $951.46 Million |
-0.01% |
| 2018-12-31 | CN¥6.50 Billion ≈ $951.53 Million |
+3.90% |
| 2017-12-31 | CN¥6.26 Billion ≈ $915.78 Million |
+1.90% |
| 2016-12-31 | CN¥6.14 Billion ≈ $898.73 Million |
+64.20% |
| 2015-12-31 | CN¥3.74 Billion ≈ $547.34 Million |
+58.19% |
| 2014-12-31 | CN¥2.36 Billion ≈ $346.00 Million |
+4.80% |
| 2013-12-31 | CN¥2.26 Billion ≈ $330.14 Million |
+2.15% |
| 2012-12-31 | CN¥2.21 Billion ≈ $323.20 Million |
+1.29% |
| 2011-12-31 | CN¥2.18 Billion ≈ $319.09 Million |
+2.26% |
| 2010-12-31 | CN¥2.13 Billion ≈ $312.02 Million |
+100.09% |
| 2009-12-31 | CN¥1.07 Billion ≈ $155.94 Million |
+6.00% |
| 2008-12-31 | CN¥1.01 Billion ≈ $147.12 Million |
+1.96% |
| 2007-12-31 | CN¥986.05 Million ≈ $144.29 Million |
+176.66% |
| 2006-12-31 | CN¥356.41 Million ≈ $52.15 Million |
+30.95% |
| 2005-12-31 | CN¥272.18 Million ≈ $39.83 Million |
+22.39% |
| 2004-12-31 | CN¥222.39 Million ≈ $32.54 Million |
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Equity Component Analysis
This analysis shows how different components contribute to TongFu Microelectronics Co Ltd's total equity over time. Equity components include common stock, retained earnings, additional paid-in capital, and other elements.
Equity Composition Insights
- Retained earnings have grown by 6265.0% over the analyzed period, indicating profitable operations and earnings retention.
Current Equity Component Breakdown (December 2024)
| Component | Amount | Percentage |
|---|---|---|
| Retained Earnings | CN¥3.33 Billion | 22.69% |
| Common Stock | CN¥1.52 Billion | 10.33% |
| Other Comprehensive Income | CN¥425.05 Million | 2.89% |
| Other Components | CN¥9.41 Billion | 64.09% |
| Total Equity | CN¥14.69 Billion | 100.00% |
TongFu Microelectronics Co Ltd Competitors by Market Cap
The table below lists competitors of TongFu Microelectronics Co Ltd ranked by their market capitalization.
| Company | Market Cap |
|---|---|
|
Eurofins Scientific SE
PA:ERF
|
$11.53 Billion |
|
Chongqing Changan Automobile Co Ltd
SHE:000625
|
$11.53 Billion |
|
Invesco Plc
NYSE:IVZ
|
$11.56 Billion |
|
China Aerospace Times Electronics Co Ltd
SHG:600879
|
$11.57 Billion |
|
Embraer S.A.
NYSE:EMBJ
|
$11.50 Billion |
|
Hong Leong Bank Bhd
KLSE:5819
|
$11.48 Billion |
|
China Merchants Shekou Industrial Zone Holdings
SHE:001979
|
$11.48 Billion |
|
Zhengzhou Yutong Bus Co Ltd
SHG:600066
|
$11.47 Billion |
Equity Growth Attribution
This analysis shows how different factors contributed to changes in TongFu Microelectronics Co Ltd's equity between the two most recent reporting periods.
Equity Growth Insights
- From 2023 to 2024, total equity changed from 13,917,141,774 to 14,690,833,021, a change of 773,691,247 (5.6%).
- Net income of 677,588,319 contributed positively to equity growth.
- Dividend payments of 540,122,413 reduced retained earnings.
- Other comprehensive income increased equity by 59,027,288.
- Other factors increased equity by 577,198,053.
Equity Change Factors (2023 to 2024)
| Factor | Impact | Contribution |
|---|---|---|
| Net Income | CN¥677.59 Million | +4.61% |
| Dividends Paid | CN¥540.12 Million | -3.68% |
| Other Comprehensive Income | CN¥59.03 Million | +0.4% |
| Other Changes | CN¥577.20 Million | +3.93% |
| Total Change | CN¥- | 5.56% |
Book Value vs Market Value Analysis
This analysis compares TongFu Microelectronics Co Ltd's book value (net assets) with its market value over time. The relationship between these values can provide insights into investor sentiment and company valuation.
Valuation Insights
- Current price-to-book ratio: 5.35x
- The company is trading at a significant premium to its book value, suggesting the market values its earnings potential, brand, or other intangibles highly.
- The price-to-book ratio has decreased from 92.07x to 5.35x over the analyzed period, indicating reduced market premium.
Historical Price-to-Book Ratios
| Date | Book Value per Share | Market Price | P/B Ratio |
|---|---|---|---|
| 2004-12-31 | CN¥0.56 | CN¥51.77 | x |
| 2005-12-31 | CN¥0.68 | CN¥51.77 | x |
| 2006-12-31 | CN¥0.66 | CN¥51.77 | x |
| 2007-12-31 | CN¥1.63 | CN¥51.77 | x |
| 2008-12-31 | CN¥1.41 | CN¥51.77 | x |
| 2009-12-31 | CN¥1.45 | CN¥51.77 | x |
| 2010-12-31 | CN¥2.95 | CN¥51.77 | x |
| 2011-12-31 | CN¥2.74 | CN¥51.77 | x |
| 2012-12-31 | CN¥2.69 | CN¥51.77 | x |
| 2013-12-31 | CN¥2.57 | CN¥51.77 | x |
| 2014-12-31 | CN¥2.86 | CN¥51.77 | x |
| 2015-12-31 | CN¥3.81 | CN¥51.77 | x |
| 2016-12-31 | CN¥4.12 | CN¥51.77 | x |
| 2017-12-31 | CN¥6.30 | CN¥51.77 | x |
| 2018-12-31 | CN¥5.32 | CN¥51.77 | x |
| 2019-12-31 | CN¥6.39 | CN¥51.77 | x |
| 2020-12-31 | CN¥7.24 | CN¥51.77 | x |
| 2021-12-31 | CN¥7.89 | CN¥51.77 | x |
| 2022-12-31 | CN¥10.20 | CN¥51.77 | x |
| 2023-12-31 | CN¥9.04 | CN¥51.77 | x |
| 2024-12-31 | CN¥9.68 | CN¥51.77 | x |
Capital Efficiency Dashboard
This dashboard shows how efficiently TongFu Microelectronics Co Ltd utilizes its equity to generate returns, including Return on Equity (ROE) and its components based on the DuPont analysis framework.
Capital Efficiency Insights
- Current Return on Equity (ROE): 4.61%
- The company may be facing challenges in efficiently utilizing shareholder equity.
- DuPont Analysis Breakdown:
- • Net Profit Margin: 2.84%
- • Asset Turnover: 0.61x
- • Equity Multiplier: 2.68x
- Recent ROE (4.61%) is below the historical average (6.27%), suggesting potential challenges in capital efficiency.
Historical Capital Efficiency Metrics
| Year | Return on Equity | Net Profit Margin | Asset Turnover | Equity Multiplier | Economic Value Added |
|---|---|---|---|---|---|
| 2004 | 17.04% | 6.47% | 0.61x | 4.35x | CN¥15.60 Million |
| 2005 | 18.42% | 6.40% | 0.62x | 4.61x | CN¥22.84 Million |
| 2006 | 25.07% | 8.70% | 0.71x | 4.04x | CN¥53.70 Million |
| 2007 | 7.67% | 6.73% | 0.54x | 2.10x | CN¥-22.95 Million |
| 2008 | 4.43% | 3.74% | 0.63x | 1.86x | CN¥-56.02 Million |
| 2009 | 5.65% | 4.87% | 0.59x | 1.97x | CN¥-46.34 Million |
| 2010 | 6.52% | 8.05% | 0.48x | 1.70x | CN¥-74.15 Million |
| 2011 | 2.25% | 3.02% | 0.48x | 1.55x | CN¥-169.03 Million |
| 2012 | 1.71% | 2.38% | 0.47x | 1.53x | CN¥-183.03 Million |
| 2013 | 2.69% | 3.43% | 0.48x | 1.63x | CN¥-164.95 Million |
| 2014 | 5.11% | 5.78% | 0.53x | 1.67x | CN¥-115.62 Million |
| 2015 | 3.94% | 6.35% | 0.36x | 1.74x | CN¥-226.71 Million |
| 2016 | 4.61% | 3.94% | 0.41x | 2.86x | CN¥-211.02 Million |
| 2017 | 2.06% | 1.87% | 0.54x | 2.05x | CN¥-469.81 Million |
| 2018 | 2.07% | 1.76% | 0.52x | 2.28x | CN¥-486.49 Million |
| 2019 | 0.31% | 0.23% | 0.51x | 2.64x | CN¥-591.95 Million |
| 2020 | 3.53% | 3.14% | 0.51x | 2.22x | CN¥-619.43 Million |
| 2021 | 9.16% | 6.05% | 0.58x | 2.60x | CN¥-87.51 Million |
| 2022 | 3.63% | 2.34% | 0.60x | 2.58x | CN¥-881.53 Million |
| 2023 | 1.22% | 0.76% | 0.64x | 2.51x | CN¥-1.22 Billion |
| 2024 | 4.61% | 2.84% | 0.61x | 2.68x | CN¥-791.49 Million |
Industry Comparison
This section compares TongFu Microelectronics Co Ltd's net assets metrics with peer companies in the Semiconductor Equipment & Materials industry.
Industry Context
- Industry: Semiconductor Equipment & Materials
- Average net assets among peers: $1,106,254,972
- Average return on equity (ROE) among peers: 6.86%
Peer Company Comparison
| Company | Net Assets | Return on Equity | Debt-to-Equity | Market Cap |
|---|---|---|---|---|
| TongFu Microelectronics Co Ltd (002156) | CN¥16.81 Billion | 17.04% | 1.71x | $11.50 Billion |
| TCL Corp (000100) | $2.66 Billion | 8.95% | 2.48x | $13.00 Billion |
| TCL Zhonghuan Renewable Energy Technology Co Ltd (002129) | $1.70 Billion | 5.75% | 1.39x | $5.12 Billion |
| Tianshui Huatian Technology Co Ltd (002185) | $279.37 Million | 22.06% | 1.27x | $6.27 Billion |
| NAURA Technology Group Co Ltd (002371) | $958.71 Million | 7.86% | 1.15x | $56.96 Billion |
| Jiangsu Yoke Technology Co Ltd (002409) | $1.13 Billion | 6.43% | 0.15x | $5.90 Billion |
| Guangdong Huafeng New Energy Technology Co Ltd (002806) | $1.19 Billion | -0.70% | 0.63x | $437.78 Million |
| Zhejiang Mtcn Technology Co Ltd (003026) | $74.33 Million | 4.88% | 0.82x | $948.18 Million |
| Hubei Tech Semiconductors Co (300046) | $1.06 Billion | 1.87% | 0.08x | $1.12 Billion |
| Shanghai Sinyang Semiconductor (300236) | $907.06 Million | 4.67% | 0.28x | $4.35 Billion |
About TongFu Microelectronics Co Ltd
Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory device… Read more